Wire network for interconnecting photovoltaic cells

US10056521B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-10056521-B2
Application numberUS-201514822712-A
CountryUS
Kind codeB2
Filing dateAug 10, 2015
Priority dateMar 20, 2008
Publication dateAug 21, 2018
Grant dateAug 21, 2018

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

    Technology tags used to group this patent with similar filings.

  7. Citations and related patents

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Abstract

Official abstract text for this publication.

Provided are novel interconnect wire network assemblies and methods of fabricating thereof. An assembly may include conductive portions/individual wires that, in certain embodiments, are substantially parallel to each other. The assembly also includes two or more carrier films (i.e., the front side and back side films) attached to opposite sides of the wires. The films are typically attached along the wire ends. The films are made from electrically insulating materials and at least the front side film is substantially transparent. The front side film is used to attach the wires to a photovoltaic surface of one cell, while the back side film is used for attachment to a substrate surface of another cell. These attachments electrically interconnect the two cells in series. In certain embodiments, one or both carrier films extend beyond two end wires and form insulated portions that allow much closer arrangements of the cells in a module.

First claim

Opening claim text (preview).

What is claimed is: 1. A method of fabricating an interconnect wire network assembly comprising: unwinding multiple individual wires from corresponding multiple wire rolls; extending the multiple individual wires along a first unwinding direction such that the multiple individual wires are substantially parallel to each other and are at a first distance from each other, wherein the unwound multiple individual wires are positioned substantially within a first referential plane, wherein the first unwinding direction is parallel to the first referential plane, and wherein the unwound multiple individual wires form a first surface and a second surface, with the first surface and the second surface spaced apart by a cross-sectional dimension of the unwound multiple individual wires; extending a first carrier film in a second unwinding direction such that a bottom surface of the first carrier film faces the first surface of the unwound multiple individual wires, wherein the second unwinding direction is parallel to the first referential plane and perpendicular to the first unwinding direction; applying the first carrier film onto the first surface of the unwound multiple individual wires; extending a second carrier film in the second unwinding direction such that a top surface of the second carrier film faces the second surface of the unwound multiple individual wires; and applying a second carrier film onto the second surface of the multiple individual wires such that the first carrier film and the second carrier film partially overlap when viewed from a direction perpendicular to the first referential plane. 2. The method of fabricating an interconnect wire network assembly of claim 1 , further comprising: forming a roll of interconnect wire network subassemblies; unwinding the roll of interconnect wire network subassemblies; and cutting the multiple individual wires substantially perpendicular to the multiple individual wires to form the interconnect wire network assembly. 3. The method of fabricating an interconnect wire network assembly of claim 1 , further comprising cutting the unwound multiple individual wires substantially perpendicular to the multiple individual wires to form the interconnect wire network assembly. 4. The method of fabricating an interconnect wire network assembly of claim 3 , wherein cutting the unwound multiple individual wires comprises cutting the first carrier film or the second carrier film. 5. The method of fabricating an interconnect wire network assembly of claim 1 , wherein applying the first carrier film comprises passing an electric current through a portion of the unwound multiple individual wires that is in contact with the first carrier film in order to heat this portion. 6. The method of fabricating an interconnect wire network assembly of claim 5 , wherein applying the first carrier film further comprises applying a pressure to the first carrier film and the unwound multiple individual wires. 7. The method of fabricating an interconnect wire network assembly of claim 1 , wherein applying the second carrier film comprises passing an electric current through a portion of the unwound multiple individual wires that is in contact with the second carrier film in order to heat this portion. 8. The method of fabricating an interconnect wire network assembly of claim 7 , wherein applying the second carrier film further comprises applying a pressure to the second carrier film and the unwound multiple individual wires. 9. The method of fabricating an interconnect wire network assembly of claim 1 , wherein: applying the first carrier film comprises passing an electric current through a portion of the unwound multiple individual wires that is in contact with the first carrier film in order to heat this portion, and applying the second carrier film comprises passing an electric current through a portion of the unwound multiple individual wires that is in contact with the second carrier film in order to heat this portion. 10. The method of fabricating an interconnect wire network assembly of claim 1 , wherein: applying the first carrier film further comprises applying a pressure to the first carrier film and the unwound multiple individual wires, and applying the second carrier film further comprises applying a pressure to the second carrier film and the unwound multiple individual wires.

Assignees

Inventors

Classifications

  • B32B15/04Primary

    comprising metal as the main or only constituent of a layer, {which is} next to another layer of {the same or of} a {different material (next to a bituminous or tarry layer B32B11/08; next to a water-setting substance layer B32B13/06; next to a glass layer B32B17/061; next to a cellulosic plastic layer B32B23/042)} · CPC title

  • Electricity · mapped topic

  • Electricity · mapped topic

  • Electricity · mapped topic

  • Photovoltaic [PV] energy · CPC title

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Frequently asked questions

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What does patent US10056521B2 cover?
Provided are novel interconnect wire network assemblies and methods of fabricating thereof. An assembly may include conductive portions/individual wires that, in certain embodiments, are substantially parallel to each other. The assembly also includes two or more carrier films (i.e., the front side and back side films) attached to opposite sides of the wires. The films are typically attached al…
Who is the assignee on this patent?
Apollo Prec Kunming Yuanhong Limited, Beijing Apollo Ding Rong Solar Tech Co Ltd
What technology area does this patent fall under?
Primary CPC classification B32B15/04. Mapped technology areas include Operations & Transport.
When was this patent published?
Publication date Tue Aug 21 2018 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 4 related publications on this page (citations in our corpus or others sharing the same primary CPC).