Power module of square flat pin-free packaging structure

Patent metadata

Field	Value
Publication number	US-10056313-B2
Application number	US-201615576850-A
Country	US
Kind code	B2
Filing date	Jan 29, 2016
Priority date	Jul 20, 2015
Publication date	Aug 21, 2018
Grant date	Aug 21, 2018

Abstract

A power module of a square flat pin-free packaging structure for suppressing the power module from being excessively high in local temperature. The power module includes an insulating resin, a driving chip, a plurality of power chips, and a plurality of metal electrode contacts. The driving chip, the power chips, and the metal electrode contacts are electrically connected through a metal lead according to a predetermined circuit. A plurality of metal heat dissipating disks used for heat dissipation of the power chips and a driving chip lead frame are disposed at the bottom of the insulating resin. A plurality of metal power chip lead frames are disposed on the metal heat dissipating disks, the power chips are disposed on the power chip lead frames, and the drain electrodes of the power chips are electrically connected to the metal heat dissipating disks.

First claim

What is claimed is:

1. A power module of a square flat pin-free packaging structure, comprising: an insulating resin, a driving chip, a plurality of power chips, and a plurality of metal electrode contacts, wherein the driving chip, the plurality of power chips, and the plurality of metal electrode contacts are electrically connected through a metal lead according to a predetermined circuit, a plurality of metal heat dissipating disks used for heat dissipation for the plurality of power chips and a driving chip lead frame are disposed at a bottom of the insulating resin, wherein a plurality of power chip lead frames are disposed on the plurality of metal heat dissipating disks, wherein the plurality of power chips are disposed on the plurality of power chip lead frames, and a plurality of drain electrodes of the power chips are electrically connected to the plurality of metal heat dissipating disks, wherein the plurality of driving chips are disposed on the plurality of driving chip lead frames, wherein the plurality of metal heat dissipating disks extend beyond an area occupied by the driving chip lead frame and the plurality of metal electrode contacts at the bottom to cover the bottom areas not occupied by the driving chip lead frame and the plurality of metal electrode contacts, wherein a plurality of metal supporting pillars are disposed on a lower part of the driving chip lead frame, wherein the plurality of metal supporting pillars stand on the bottom and elevate the driving chip lead frame away from the bottom, and the plurality of metal heat dissipating disks further extend into a bottom layer area below the driving chip lead frame.

2. The power module of a square flat pin-free packaging structure according to claim 1 , wherein a bonding island is disposed on the bottom to connect the plurality of metal leads connecting the driving chip and the plurality of power chips, wherein the bonding island acts as a bridge point to achieve the connection between the driving chip and the plurality of power chips.

Assignees

• Univ Southeast

Inventors

• Liu Siyang
• Wang Ning
• Wei jiaxing
• Liu Chao
• Sun Weifeng
• Lu Shengli
• Shi Longxing

Classifications

• H10W72/5522

  comprising gold [Au] · CPC title

• H10W74/00

  Encapsulations, e.g. protective coatings · CPC title

• H10W72/884

  Die-attach connectors and bond wires · CPC title

• H10W90/756

  between a chip and a stacked lead frame, conducting package substrate or heat sink · CPC title

• H10W90/755

  between a chip and a laterally-adjacent insulating package substrate, interpose or RDL · CPC title