Plasma equipment for treating powder

Patent metadata

Field	Value
Publication number	US-10056234-B2
Application number	US-201715827929-A
Country	US
Kind code	B2
Filing date	Nov 30, 2017
Priority date	Dec 10, 2012
Publication date	Aug 21, 2018
Grant date	Aug 21, 2018

Abstract

A powder plasma processing apparatus is disclosed. The powder plasma processing apparatus includes: a chamber configured to perform plasma processing on a powder; a powder supply unit disposed in an upper portion of the chamber; and a plurality of plate-like surface discharge plasma modules disposed below the powder supply unit and positioned within the chamber, wherein surfaces of the surface discharge plasma modules are spaced apart from each other. According to the powder plasma processing apparatus, the powder can be uniformly processed, and the time that the powder spends in contact with the plasma can be controlled, thereby allowing efficient powder processing to be performed.

First claim

What is claimed is:

1. A method of processing a powder using a powder surface processing apparatus of a plate-like surface discharge plasma module:
the apparatus comprising:
a chamber configured to perform plasma processing on a powder; and
a plate-like surface discharge plasma module disposed in the chamber,
wherein the plate-like surface discharge module comprises:
an insulating layer;
a plate-like electrode layer which is disposed on one side of the insulating layer; and
a plurality of plasma generating electrodes in the form of a bar which are disposed on the other side of the insulating layer at intervals,

wherein the plate-like surface discharge plasma module is configured to apply an alternating voltage to the plurality of plasma generating electrodes and the plate-like electrode layer to generate plasma around the plurality of plasma generating electrodes, and the plate-like surface discharge plasma module is configured to position a powder on the plasma generating electrodes and treat the surface of the powder by the generated plasma,

the method comprising:
generating a plasma with the plasma generating electrodes of the powder surface processing apparatus; and
contacting a powder with the plasma generated from the plate-like plasma generating electrodes and treating the surface of the powder.

2. The method of claim 1 , wherein the plasma is generated from a plasma reaction gas injected into the surface discharge plasma module.

3. The method of claim 2 , wherein the plasma reaction gas comprises an inert gas and a gas containing oxygen, fluorine, or chlorine.

4. The method of claim 3 , wherein the inert gas comprises Ar or N 2 .

5. The method of claim 3 , wherein the gas containing oxygen comprises O 2 or N 2 O.

6. The method of claim 3 , wherein the gas containing fluorine comprises CF 4 or SF 6 .

7. The method of claim 3 , wherein the gas containing chlorine comprises Cl 2 or BCl 3 .

8. The method of claim 1 , wherein a high voltage is applied to the plate-like electrode layer, and the plurality of plasma generating electrodes are ground electrodes.

9. The method of claim 8 , wherein the apparatus comprises at least two of the plate-like surface discharge modules, the ground electrode or the high-voltage-applying electrodes in each module are disposed to face each other within the chamber.

10. The method of claim 1 , wherein a high voltage is applied to the plurality of plasma generating electrodes, and the plate-like electrode layer is a ground electrode.

11. The method of claim 10 , wherein the apparatus comprises at least two of the plate-like surface discharge modules, the ground electrode or the high-voltage-applying electrodes in each module are disposed to face each other within the chamber.

12. The method of claim 1 , wherein the apparatus comprises a powder supply unit disposed in an upper portion of the chamber, wherein the plate-like surface discharge plasma module is disposed below the powder supply unit and positioned within the chamber, wherein the surface of the plate-like surface discharge plasma module is not perpendicular to a direction in which the powder is supplied.

13. The method of claim 12 , further comprising an inclination adjusting unit configured to adjust an angle of inclination of the plate-like surface discharge plasma module to a predetermined angle within the chamber.

14. The method of claim 12 , wherein an upper portion of the plate-like surface discharge plasma module is positioned below the powder supply unit, a lower portion of the plate-like surface discharge plasma module is positioned in a direction inclined toward one side from the upper portion, and the powder supplied through the powder supply unit falls down in the inclined direction of the plate-like surface discharge plasma module inclined toward the one side.

15. The method of claim 12 , wherein the plurality of plasma generating electrodes are disposed in parallel with a direction in which the powder falls along the plate-like surface discharge plasma module to guide the powder to fall down.

Assignees

• Korea Basic Science Inst

Inventors

• Seok Dong Chan
• Jung Yong Ho
• Jeong Hyun Young

Classifications

• B01J2219/0879

  Solid · CPC title

• H01J37/32348

  Dielectric barrier discharge · CPC title

• H01J37/32568 Primary

  Relative arrangement or disposition of electrodes; moving means · CPC title

• B01J2219/0835

  substantially flat · CPC title

• B01J19/088 Primary

  giving rise to electric discharges (for heating purposes H05B7/00; for the production of ozone C01B13/11, H01T19/00) · CPC title