Additive manufactured passive thermal enclosure

Patent metadata

Field	Value
Publication number	US-10054995-B2
Application number	US-201615336635-A
Country	US
Kind code	B2
Filing date	Oct 27, 2016
Priority date	Oct 27, 2016
Publication date	Aug 21, 2018
Grant date	Aug 21, 2018

Abstract

Thermal management devices and systems, and corresponding manufacturing methods are described herein. A thermal management device includes a plate having a first surface. The first surface partially defines a chamber of the thermal management device. The thermal management device also includes capillary features disposed on the plate, and walls having a first end and a second end. The walls are disposed on the plate and extend away from the first surface of the plate, at the first end, to the second end. The walls partially define the chamber of the thermal management device. The thermal management device also includes a layer of material disposed on the walls, at the second end of the wall. The layer of material partially defines the chamber.

First claim

The invention claimed is:

1. A computing device comprising:
a heat generating electronic component;
a housing that supports the heat generating electronic component, the housing having an inner surface and an outer surface; and
a thermal management device supported by the housing, the thermal management device comprising:
a plate mounted to the inner surface of the housing, the plate having a first surface and a second surface opposite the first surface, the second surface of the plate facing the inner surface of the housing, the first surface of the plate partially defining a chamber of the thermal management device;
walls each having a first end and a second end, each of the walls being disposed on the plate and extending away from the first surface of the plate, at the first end, to the second end, respectively, the walls partially defining the chamber of the thermal management device; and
a layer of first material disposed on the second end of the walls, the layer of first material partially defining the chamber; and
a fluid and a second material disposed in the chamber; and

a layer of a third material disposed between the second surface of the plate and the inner surface of the housing.

2. The computing device of claim 1 , wherein the second surface of the plate is substantially the same shape and size as the inner surface of the housing.

3. The computing device of claim 1 , wherein the plate and the walls are made of the first material or a fourth material.

4. The computing device of claim 1 , wherein the layer of third material is made of a wax.

5. The computing device of claim 1 , wherein the thermal management device further comprises capillary features disposed on the first surface of the plate.

6. The computing device of claim 1 , wherein the plate is an enclosure plate of the housing.

7. The computing device of claim 1 , wherein the second material is configured as capillary features, the capillary features being disposed on the first surface of the plate.

Assignees

• Microsoft Technology Licensing Llc

Inventors

• Jenkins Kurt
• Delano Andrew Douglas
• Ghioni Lincoln
• Stellman Jeffrey Taylor

Classifications

• G06F2200/201

  Cooling arrangements using cooling fluid · CPC title

• G06F1/203

  for portable computers, e.g. for laptops · CPC title

• F28F2255/18

  sintered · CPC title

• F28D2020/0013

  the heat storage material being enclosed in elements attached to or integral with heat exchange conduits · CPC title

• F28D15/0283

  Means for filling or sealing heat pipes · CPC title