Airflow guide assembly and enclosure

Patent metadata

Field	Value
Publication number	US-10054993-B2
Application number	US-201615285794-A
Country	US
Kind code	B2
Filing date	Oct 5, 2016
Priority date	Oct 5, 2016
Publication date	Aug 21, 2018
Grant date	Aug 21, 2018

Abstract

In an electronics system, an adjustable airflow guide assembly and methods of deploying it facilitate dissipating heat. The assembly includes an extendable plate having a first coupling capable of rotatably attaching the extendable plate to a chassis, a link, including a second coupling, capable of translatably attaching the link to the chassis, and a third coupling capable of rotatably attaching the link to the extendable plate. The extendable plate presents a guide to deflect airflow and is capable of being swung into multiple different fixed positions to divert airflow within the electronics system toward portions of the chassis configured with electronic components that produce heat, such as board solid state drives (BSSDs).

First claim

What is claimed is:

1. An adjustable airflow guide assembly for dissipating heat in an electronics system, comprising:
an extendable plate including a first coupling configured to rotatably attach the extendable plate to a chassis within the electronics system;
a link, including a second coupling configured to translatably attach the link to the chassis; and
a third coupling configured to rotatably attach the link to the extendable plate;
wherein, the extendable plate presents a guide to deflect airflow within the electronics system, where the extendable plate is capable of being rotatably swung and locked into multiple different fixed positions while coupled to both the chassis and the link, and each fixed position of the multiple fixed positions diverts airflow within the electronics system toward a distinct portion of the chassis configured with electronic components that produce heat.

2. The airflow guide assembly according to claim 1 , wherein the third coupling is integral with the link.

3. The airflow guide assembly according to claim 2 , wherein the third coupling is positioned on the extendable plate.

4. The airflow guide assembly according to claim 1 , wherein the third coupling is a position pin that is configured to attach to the chassis to lock the extendable plate in place.

5. The airflow guide assembly according to claim 4 , further comprising a compression latch assembly coupled to the position pin that constrains the position pin to translate along its longitudinal axis and apply a force to the position pin toward at least one mating portion of the chassis.

6. The airflow guide assembly according to claim 1 , wherein the extendable plate includes a swing plate and a slider plate slidably coupled to the swing plate.

7. The airflow guide assembly according to claim 6 , wherein the swing plate and the slider plate include mating grooves that slidably attach the slider plate to the swing plate.

8. The airflow guide assembly according to claim 7 , wherein at least one of the swing plate and the slider plate include a lock member that prevents the swing plate and the slider plate from extending beyond a predetermined position.

9. The airflow guide assembly according to claim 6 , wherein the first coupling is at least one hinge positioned on the swing plate.

10. The airflow guide assembly according to claim 6 , wherein the second coupling is a roller.

11. A method of deploying an airflow guide assembly to cool an electronics system, comprising:
providing at least one airflow guide assembly comprising a link, an extendable plate and a position pin that rotatably couples a first end of the extendable plate to a first end of the link;
inserting a second end of the link into a translational mount on a chassis within the electronics system;
attaching a second end of the extendable plate to a rotational mount fixed to the chassis; and
selectably positioning the extendable plate into a fixed position of multiple fixed positions within the chassis while the extendable plate is coupled to both the chassis and the link, each fixed position of the multiple fixed positions to divert airflow toward a distinct portion of the chassis configured with electronic components that produce heat.

12. The method according to claim 11 , wherein the airflow guide assembly is fixed into one of a plurality of predetermined positions by selectively inserting the position pin into at least one predetermined receptacle within the chassis.

13. The method according to claim 12 , wherein the airflow guide assembly is moved into another fixed position by withdrawing and reinserting the position pin into a hole in the chassis at a different location.

14. The method according to claim 11 , wherein the extendable plate includes a swing plate and a slider plate slidably coupled to the swing plate.

15. The method according to claim 14 , wherein the swing plate and the slider plate include mating grooves that slidably attach the slider plate to the swing plate.

16. The method according to claim 11 , wherein the rotational mount used in the attaching comprises a hinge with mating hinge portions on the extendable plate and the chassis.

17. The method according to claim 12 , wherein the selectively inserting comprises deploying a compression latch to ensure constant pressure on the position pin after insertion.

18. An electronics system with configurable guided airflow, comprising:
a housing;
at least one track coupled to the housing;
at least one airflow guide assembly, each including an extendable plate and a link arm, wherein a first end of the extendable plate is rotatably coupled to a first end of the link arm, wherein a second end of the extendable plate is rotatably coupled to the housing, and wherein a second end of the link arm is slidably coupled to a respective one of the at least one track; and
air inlet vents and air outlet vents positioned on the housing;
wherein the extendable plate is rotatable and extendable while coupled to both the link arm and the housing, the link arm is capable of sliding to enable the airflow guide assembly to be deployed in one of several fixed positions within the housing, and each fixed position of the several fixed positions routes airflow toward a distinct portion within the housing over heat generating components disposed between the air inlet vents and the air outlet vents within the housing.

19. The electronics system according to claim 18 , further comprising:
at least one fan that forces air from the air inlet vents to the air outlet vents to create the airflow through the housing.

20. The electronics system according to claim 19 , wherein the extendable plate includes a swing plate and a slider plate slidably coupled to the swing plate.

21. The electronics system according to claim 20 , wherein the swing plate and the slider plate include mating grooves that slidably attach the slider plate to the swing plate.

22. The electronics system according to claim 18 , wherein the heat generating components include at least one solid state drive.

23. The electronics system according to claim 18 , wherein the heat generating components include at least one array of solid state drives.

24. The airflow guide assembly according to claim 1 , wherein, for each fixed position of the multiple fixed positions, the second coupling of the link translatably attaches the link to a distinct corresponding position within the chassis.

25. The airflow guide assembly according to claim 1 , wherein the extendable plate has a variable length, with a distinct length at each fixed position of the multiple fixed positions.

26. An adjustable airflow guide assembly for dissipating heat in an electronics system, comprising:
an extendable plate including a first coupling configured to rotatably attach the extendable plate to a chassis within the electronics system;
a link, including a second coupling configured to translatably attach the link to the chassis;
a third coupling configured to rotatably attach the link to the extendable plate, wherein the third coupling is a position pin that is configured to attach to the chassis to lock the extendable plate in place; and
a compression latch assembly coupled to the position pin that constrains the position pin to translate along its longitudinal axis and apply a force to the position pin toward at least one mating portion of the chassis;
wherein, when co

Assignees

• Sandisk Technologies Llc
• Sandisk Entpr Ip Llc

Inventors

• Yi George

Classifications

• H05K7/20127

  Natural convection · CPC title

• H05K7/20154

  Heat dissipaters coupled to components · CPC title

• G06F1/20 Primary

  Cooling means · CPC title

• H05K7/14

  Mounting supporting structure in casing or on frame or rack · CPC title

• G06F1/183

  Internal mounting support structures, e.g. for supporting printed circuit boards · CPC title