Method of determining a position of a substrate in a lithography system, substrate for use in such a method, and lithography system for carrying out such method

Patent metadata

Field	Value
Publication number	US-10054863-B2
Application number	US-201514630678-A
Country	US
Kind code	B2
Filing date	Feb 25, 2015
Priority date	Oct 26, 2012
Publication date	Aug 21, 2018
Grant date	Aug 21, 2018

Abstract

The invention relates to a substrate comprising an optical position mark for being read-out by an optical recording head for emitting light of predetermined wavelength, preferably red or infra-red light, more in particular of 635 nm light, the optical position mark having a mark height, a mark length and a predetermined known position on the substrate, the optical position mark extending along a longitudinal direction and being arranged for varying a reflection coefficient of the position mark along said longitudinal direction, wherein the optical position mark comprises:
a first region having a first reflection coefficient and a first width; a second region neighboring the first region and forming a first region pair, the second region having a second reflection coefficient and a second width, and the second reflection coefficient being different from the first reflection coefficient, wherein the first region comprises sub-wavelength structures in comparison with a wavelength of the predetermined wavelength light.

First claim

The invention claimed is:

1. A system for determining a position of a substrate in a lithography system, the system comprising:
an optical column adapted for projecting one or more exposure beams onto a substrate;
a first optical alignment sensor mounted to the system such that it has a substantially constant distance from the optical column, the first optical alignment sensor being configured for emitting a light beam to the substrate, the emitted light beam having a predetermined wavelength, and the first optical alignment sensor being further configured for measuring an intensity profile of a zero-th order reflected light beam;
a focusing lens adapted to focus the light beam to a spot having a spot size on the substrate;
the substrate comprising a first optical position mark having a mark height, a mark length and a predetermined known position on the substrate, the first optical position mark extending longitudinally in a first direction and being arranged for varying a reflection coefficient of the first optical position mark along said first direction, wherein the first optical position mark comprises:

a first main region comprising a plurality of first region pairs, the first region pairs being substantially equal to one another;
wherein each first region pair of the first main region comprises:
a first region having a first reflection coefficient and a first width in the first direction; and
a second region having a second reflection coefficient and a second width in the first direction, the second reflection coefficient being different from the first reflection coefficient, the second region neighboring the first region;
wherein said first width is in the same order of magnitude as said spot size;
wherein said second width is in the same order of magnitude as said spot size;
wherein the first region comprises sub-wavelength structures in comparison with a wavelength of the predetermined wavelength of the emitted light beam;
wherein the sub-wavelength structures comprise a plurality of regular segments formed by segmentation of the first region along the first direction and/or a second direction, the second direction being perpendicular to the first direction; and
wherein the system is configured for scanning the first optical alignment sensor over the first optical position mark in the first direction.

2. The system as claimed in claim 1 , wherein the first optical position mark further comprises a second main region neighboring the first main region, wherein the second main region is substantially free of structures.

3. The system as claimed in claim 2 , wherein the first optical position mark further comprises a third main region neighboring the second main region, wherein the second main region is embedded between the first main region and the third main region when viewed in the first direction, and wherein the third main region comprises a third region pair;
wherein the third region pair of the third main region comprises:
a third region having a third reflection coefficient and a third width; and
a fourth region having a fourth reflection coefficient and a fourth width, the fourth reflection coefficient being different from the third reflection coefficient, the fourth region neighboring the third region;
wherein the third region comprises sub-wavelength structures in comparison with a wavelength of the predetermined wavelength of the emitted light beam.

4. The system as claimed in claim 3 , wherein the first main region and the third main region are substantially identical.

5. The system as claimed in claim 1 , wherein the first optical position mark further comprises a first end region located at a first end of the first optical position mark neighboring the first main region, the first end region being substantially free of structures.

6. The system as claimed in claim 3 , wherein the first optical position mark further comprises a second end region located at a second end of the first optical position mark neighboring the third main region, the second end region being substantially free of structures.

7. The system as claimed in claim 1 , wherein the mark height is a plurality of times the wavelength of red or infra-red light.

8. The system as claimed in claim 1 , wherein the first width and the second width are in a range between 1 μm and 2 μm.

9. The system as claimed in claim 1 , further comprising:
a second optical alignment sensor mounted to the system at a substantially constant distance from the optical column, the second optical alignment sensor being configured for emitting a second light beam to the substrate, the second emitted light beam having a predetermined wavelength, and for measuring an intensity profile of a zero-th order reflected light beam, the system being configured for scanning the second optical alignment sensor in a second direction orthogonal to the first direction.

10. The system as claimed in claim 9 , wherein the first alignment sensor is mounted at a fixed and known position with respect to the optical column in said first direction, and the second alignment sensor is mounted at a fixed and known position with respect to the optical column in said second direction.

11. The system as claimed in claim 9 , wherein the first and second optical alignment sensors are each dedicated to measuring in one direction only.

12. The system as claimed in claim 9 , wherein the substrate further comprises a second optical position mark having a mark height, a mark length and a predetermined known position on the substrate, the second optical position mark extending longitudinally in said second direction and being arranged for varying a reflection coefficient of the second optical position mark along said second direction, wherein the second optical position mark has a structure the same as the first optical position mark.

13. The system as claimed in claim 12 , wherein the first optical alignment sensor is displaced in said first direction with respect to projection optics and is arranged for measuring the first optical position mark in said first direction, and the second optical alignment sensor is displaced in said second direction with respect to the projection optics and is arranged for measuring the second optical position mark in said second direction.

14. The system as claimed in claim 10 , wherein the first direction coincides with a first movement direction of the substrate in operational use of the lithography system, and the second direction coincides with a second movement direction of the substrate in operational use of the lithography system.

15. The system as claimed in claim 1 , wherein the optical column is configured for projecting a multitude of charged particle exposure beams onto the substrate.

16. The system as claimed in claim 1 , wherein the system is configured to:
move the substrate such that the first optical position mark is substantially near the first optical alignment sensor in accordance with an estimated position of the first optical position mark with regards to the first optical alignment sensor;
scan the first optical position mark along a scan path in the first direction with the first optical alignment sensor to obtain a measured intensity profile having a scan length, wherein the scan length is longer than the mark length; and
compare the measured intensity profile with an expected intensity profile associated with the first optical position mark to determine a difference between an actual position of the optical position mark and the estimated position; and
determine the actual position of the first optica

Assignees

• Mapper Lithography Ip Bv

Inventors

• De Boer Guido
• Vergeer Niels

Classifications

• G03F9/7084

  Position of mark on substrate, i.e. position in (x, y, z) of mark, e.g. buried or resist covered mark, mark on rearside, at the substrate edge, in the circuit area, latent image mark, marks in plural levels · CPC title

• H01J37/3174

  Particle-beam lithography, e.g. electron beam lithography · CPC title

• H01J37/3045

  Object or beam position registration · CPC title

• G03F9/7076 Primary

  Mark details, e.g. phase grating mark, temporary mark · CPC title

• B82Y40/00

  Manufacture or treatment of nanostructures · CPC title