Systems and methods for signal processing in molecular imaging
US-2024013454-A1 · Jan 11, 2024 · US
US10054695B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-10054695-B2 |
| Application number | US-201715476195-A |
| Country | US |
| Kind code | B2 |
| Filing date | Mar 31, 2017 |
| Priority date | Mar 31, 2016 |
| Publication date | Aug 21, 2018 |
| Grant date | Aug 21, 2018 |
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The invention relates to a two steps image capture panel for recording x-ray image information. More particularly, the invention relates to a method and an apparatus for directing the internal electric field to capture the x-ray image first on an insulating surface, avoiding charge injection noise from the insulating surface, and then re-directing the internal electrical field to transfer the image charge from the insulating surface to a conductive readout electrode with electric field sufficient for charge gain during image readout.
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What is claimed is: 1. A radiation imaging detector comprising: a first dielectric layer; a plurality of first electrodes disposed on the first dielectric layer; a second dielectric layer disposed on the first dielectric layer; a plurality of second electrodes disposed on the second dielectric layer; a third dielectric layer disposed on the second electrodes and the second dielectric layer; and a plurality of vias disposed on the first electrodes and penetrating the second dielectric layer and the third dielectric layer. 2. The radiation imaging detector of claim 1 , wherein the first electrodes are row read-out electrodes, and the second electrodes are column buried electrodes which are buried by the third dielectric layer. 3. The radiation imaging detector of claim 2 , further comprising a plurality of charge amplifiers connected to the first electrodes respectively. 4. The radiation imaging detector of claim 1 , further comprising: a radiation charge conversion layer disposed on the third dielectric layer and the vias; and a top bias electrode disposed on the radiation charge conversion layer. 5. The radiation imaging detector of claim 4 , wherein the second electrodes are column buried electrodes which are buried by the third dielectric layer, and wherein, during exposure of radiation, a first bias potential is applied to the top bias electrode, and a second bias potential is applied to the column buried electrodes to form an electric field between the top bias electrode and the column buried electrodes, thereby charges being accumulated at an interface between the third dielectric layer and the radiation charge conversion layer. 6. The radiation imaging detector of claim 5 , wherein the first electrodes are row read-out electrodes, and wherein, upon completion of the exposure of radiation, the potential of the column buried electrodes are changed from the second bias potential to the first bias potential, and the accumulated charges are transferred to a data line through the first electrodes. 7. The radiation imaging detector of claim 6 , wherein the first bias potential is positive and the second bias potential is negative. 8. The radiation imaging detector of claim 4 , wherein the radiation charge conversion layer comprises amorphous selenium. 9. The radiation imaging detector of claim 1 , wherein the second dielectric layer and the third dielectric layer comprise silicon dioxide (SiO2). 10. A radiation imaging detection method using a radiation imaging detector wherein the radiation imaging detector includes a first dielectric layer; a plurality of first electrodes disposed on the first dielectric layer; a second dielectric layer disposed on the first dielectric layer; a plurality of second electrodes disposed on the second dielectric layer; a third dielectric layer disposed on the second electrodes and the second dielectric layer; a plurality of vias disposed on the first electrodes and penetrating the second dielectric layer and the third dielectric layer; a radiation charge conversion layer disposed on the third dielectric layer and the vias; and a top bias electrode disposed on the radiation charge conversion layer, the method comprising: applying, during exposure of radiation, a positive bias potential to the top bias electrode, and applying a negative bias potential to the second electrodes to form an electric field between the top bias electrode and the second electrodes; changing, during readout of the exposure of radiation, the potential of the second electrodes from negative to positive; and digitizing a resulting charge value corresponding to charges transferred to a data line through the first electrodes. 11. The radiation imaging detection method of claim 10 , wherein the second electrodes are column buried electrodes which are buried by the third dielectric layer. 12. The radiation imaging detection method of claim 11 , wherein the first bias potential is positive and the second bias potential is negative. 13. The radiation imaging detection method of claim 10 , wherein the radiation charge conversion layer comprises amorphous selenium. 14. The radiation imaging detector of claim 10 , wherein the second dielectric layer and the third dielectric layer comprise silicon dioxide (SiO2). 15. A radiation imaging detection method using a radiation imaging detector wherein the radiation imaging detector includes a first dielectric layer; a plurality of first electrodes disposed on the first dielectric layer; a second dielectric layer disposed on the first dielectric layer; a plurality of second electrodes disposed on the second dielectric layer; a third dielectric layer disposed on the second electrodes and the second dielectric layer; a plurality of vias disposed on the first electrodes and penetrating the second dielectric layer and the third dielectric layer; a radiation charge conversion layer disposed on the third dielectric layer and the vias; and a top bias electrode disposed on the radiation charge conversion layer, the method comprising: applying, during exposure of radiation, a negative bias potential to the top bias electrode, and applying a positive bias potential to the second electrodes to form an electric field between the top bias electrode and the second electrodes; changing, during readout of the exposure of radiation, the potential of the second electrodes from positive to negative; and digitizing a resulting charge value corresponding to charges transferred to a data line through the first electrodes.
Detector read-out circuitry (for processing gain or off-set correction H04N) · CPC title
Electrode arrangements, e.g. continuous or parallel strips or the like · CPC title
Electricity · mapped topic
Electricity · mapped topic
X-ray, gamma-ray or corpuscular radiation imagers · CPC title
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