Conductive film-forming composition and conductive film producing method

Patent metadata

Field	Value
Publication number	US-10053587-B2
Application number	US-201514807654-A
Country	US
Kind code	B2
Filing date	Jul 23, 2015
Priority date	Feb 4, 2013
Publication date	Aug 21, 2018
Grant date	Aug 21, 2018

Abstract

In a conductive film-forming composition including copper oxide particles, water and a dispersant selected from the group consisting of a water-soluble polymer and a surfactant, the copper oxide particles have a volume average secondary particle size of 20 to 240 nm, and the copper oxide particles are contained in an amount of 10 to 70 wt % with respect to a total weight of the conductive film-forming composition.

First claim

What is claimed is:

1. A conductive film-forming composition comprising copper oxide particles, water, and a dispersant,
wherein the copper oxide particles have a volume average secondary particle size of 20 to 240 nm,
the copper oxide particles are contained in an amount of 10 to 70 wt % with respect to a total weight of the conductive film-forming composition,
the dispersant contains two or more types of water-soluble polymers different in weight-average molecular weight, and
the water-soluble polymers are polyvinylpyrrolidone.

2. The conductive film-forming composition according to claim 1 , further comprising a thixotropic agent.

3. The conductive film-forming composition according to claim wherein the dispersant further contains a surfactant.

4. The conductive film-forming composition according to claim 2 , wherein the dispersant contains polyvinylpyrrolidone with a weight-average molecular weight of 8000 to 16000.

5. The conductive film-forming composition according to claim 2 , wherein the dispersant is contained in an amount of 4 to 20 wt % with respect to a total weight of the copper oxide particles.

6. The conductive film-forming composition according to claim 2 , wherein the copper oxide particles have a volume average secondary particle size of 20 to 180 nm.

7. The conductive film-forming composition according to claim 1 , wherein the dispersant further contains a surfactant.

8. The conductive film-forming composition according to claim 7 , wherein the dispersant contains polyvinylpyrrolidone with a weight-average molecular weight of 8000 to 160000.

9. The conductive film-forming composition according to claim 7 , wherein the dispersant is contained in an amount of 4 to 20 wt % with respect to a total weight of the copper oxide particles.

10. The conductive film-forming composition according to claim 7 , wherein the copper oxide particles have a volume average secondary particle size of 20 to 180 nm.

11. The conductive film-forming composition according to claim 1 , wherein the dispersant contains polyvinylpyrrolidone with a weight-average molecular weight of 8000 to 160000.

12. The conductive film-forming composition according to claim 11 , wherein the dispersant is contained in an amount of 4 to 20 wt % with respect to a total weight of the copper oxide particles.

13. The conductive film-forming composition according to claim 1 , wherein the dispersant is contained in an amount of 4 to 20 wt % with respect to a total weight of the copper oxide particles.

14. The conductive film-forming composition according to claim 1 , wherein the copper oxide particles have a volume average secondary particle size of 20 to 180 nm.

15. A conductive film producing method, comprising:
a step of forming a coating by applying the conductive film-forming composition according to claim 1 onto a substrate; and
a step of forming a metallic copper-containing conductive film by performing heating treatment and/or light irradiation treatment on the coating to reduce the copper oxide particles.

16. A conductive film-forming composition comprising copper oxide particles, water, and a dispersant, wherein
the copper oxide particles have a volume average secondary particle size of 20 to 240 nm,
the copper oxide particles are contained in an amount of 10 to 70 wt©© with respect to a total weight of the conductive film-forming composition, and
the dispersant contains polyethylene glycol and a surfactant.

17. The conductive film-forming composition according to claim 16 , wherein the weight-average molecular weight of the polyethylene glycol is 3000 to 40000.

Assignees

• Fujifilm Corp

Inventors

• Sasada Misato
• Hayata Yuuichi
• HONGO Yushi
• Kariya Toshihiro

Classifications

• H01B1/22

  the conductive material comprising metals or alloys · CPC title

• C08L71/02

  Polyalkylene oxides · CPC title

• C09D7/40

  Additives · CPC title

• C09D139/06

  Homopolymers or copolymers of N-vinyl-pyrrolidones · CPC title

• C09D201/00

  Coating compositions based on unspecified macromolecular compounds · CPC title