Binder resin composition for preform, binder particle, preform, and fiber-reinforced composite material

Patent metadata

Field	Value
Publication number	US-10053575-B2
Application number	US-201314410439-A
Country	US
Kind code	B2
Filing date	Jul 3, 2013
Priority date	Jul 5, 2012
Publication date	Aug 21, 2018
Grant date	Aug 21, 2018

Abstract

A binder resin composition for preform production includes thermosetting resin [A], thermoplastic resin [B], and curing catalyst [C], thermosetting resin [A] containing a bifunctional epoxy resin, thermoplastic resin [B] accounting for 10 to 100 parts by mass relative to 100 parts by mass of thermosetting resin [A], and curing catalyst [C] being at least one curing catalyst selected from the group consisting of organic phosphorus compounds, imidazole, and derivatives thereof.

First claim

The invention claimed is:

1. A reinforcement fiber base comprising a binder resin composition and a plurality of stacked reinforcement fiber base sheets, the binder resin composition existing at least on a surface between adjacent stacked reinforcement fiber base sheets with a weight per unit surface area of 0.5 to 30 g/m 2 , wherein the binder resin composition comprising thermosetting resin [A], thermoplastic resin [B], and curing catalyst [C], thermosetting resin [A] consisting of an epoxy resin which includes a bifunctional epoxy resin, thermoplastic resin [B] accounting for 10 to 100 parts by mass relative to 100 parts by mass of thermosetting resin [A], and curing catalyst [C] being at least one curing catalyst selected from the group consisting of organic phosphorus compounds, imidazole, and derivatives thereof, and wherein the thermosetting resin [A] has a glass transition temperature of Tg1 and is characterized in that there exists a combination of a molding temperature T° C. that is 60 to 200° C. and meets formula (1) and a molding time t that is 0.5 to 120 minutes such that the glass transition temperature Tg1 can be raised to Tg2 as expressed by formula (2) by heating at the molding temperature T° C. for the molding time t:
Tg 1< T≤Tg 1+100  (1)

T≤Tg 2≤ T+ 30  (2).

2. The reinforcement fiber base as claimed in claim 1 , wherein the bifunctional epoxy resin contains liquid bifunctional epoxy resin.

3. The reinforcement fiber base as claimed in claim 1 , wherein thermoplastic resin [B] has a hydroxyl group in its backbone chain.

4. The reinforcement fiber base as claimed in claim 1 , wherein 100 parts by mass of thermosetting resin [A] consists of 30 to 80 parts by mass of liquid bifunctional epoxy resin and 20 to 70 parts by mass of solid bifunctional epoxy resin.

5. The reinforcement fiber base as claimed in claim 1 , wherein the bifunctional epoxy resin contains solid bifunctional bisphenol epoxy resin.

6. The reinforcement fiber base as claimed in claim 1 , wherein curing catalyst [C] accounts for 2 to 20 parts by mass relative to 100 parts by mass of thermosetting resin [A].

7. The reinforcement fiber base as claimed in claim 1 , wherein the molding time t and the molding temperature T are specified by formula (3):
80≤ T+ 0.4 t≤ 190  (3).

8. The reinforcement fiber base as claimed in claim 1 , wherein the molding time t and the molding temperature T are specified by formula (4):
80≤ T+ 0.4 t≤ 130  (4).

9. The reinforcement fiber base as claimed in claim 1 , wherein the binder resin composition contains a prereaction product of thermosetting resin [A].

10. A preform comprising the reinforcement fiber base as claimed in claim 1 .

11. A fiber reinforced composite material produced by impregnating a preform as claimed in claim 10 with liquid thermosetting resin and curing the liquid thermosetting resin.

12. A preform production method comprising: preparing the reinforcement fiber base as claimed in claim 1 , and heating the reinforcement fiber base at a real molding temperature TR of 60° C. to 200° C. for 0.5 to 120 minutes so that the glass transition temperature of the binder resin composition is raised from the glass transition temperature Tg1 that meets formula (5) prior to the heating to the glass transition temperature Tg2 that meets formula (6) posterior to the heating, thereby providing the preform:
TR− 100≤ Tg 1< TR   (5)

TR≤Tg 2≤ TR+ 30  (6).

13. The reinforcement fiber base as claimed in claim 1 , wherein T° C. is 90 to 130° C.

14. The reinforcement fiber base as claimed in claim 1 , wherein the epoxy resin further includes phenol novolac type epoxy resin or cresol novolac type epoxy resin.

Assignees

• Toray Industries

Inventors

• Hirano Masanori
• Tomioka Nobuyuki
• Honda Shiro

Classifications

• B32B27/26

  using curing agents · CPC title

• C08G59/245

  aromatic · CPC title

• C08G2650/56

  Polyhydroxyethers, e.g. phenoxy resins · CPC title

• C08G59/02

  Polycondensates containing more than one epoxy group per molecule · CPC title

• C08J2363/00

  Characterised by the use of epoxy resins; Derivatives of epoxy resins · CPC title