Methods of forming holes and etching surfaces in substrates and substrates formed thereby

Patent metadata

Field	Value
Publication number	US-10052722-B2
Application number	US-201615222336-A
Country	US
Kind code	B2
Filing date	Jul 28, 2016
Priority date	Jul 30, 2015
Publication date	Aug 21, 2018
Grant date	Aug 21, 2018

Abstract

Methods capable of forming holes in, etching the surface of, or otherwise ablating substrates, and substrates formed thereby. A first method includes directing a first laser beam pulse towards a substrate to form a hole in a surface thereof and to form a plasma plume at least partially within the hole wherein the plasma plume has insufficient thermal energy and expansion velocity to etch sidewall of the hole, and directing a second laser beam pulse into the plasma plume to increase the temperature and expansion velocity of the plasma plume such that the sidewall is etched causing an increase in the cross-sectional dimension of the hole. A second method includes applying a liquid to a surface of a substrate, and directing a laser beam pulse into the liquid to create plasma on the surface of the substrate that etches portions of the surface of the substrate.

First claim

The invention claimed is:

1. A method comprising:
directing a first laser beam pulse towards a substrate to form a hole in a surface thereof having a cross-sectional dimension at a location along a depth of the hole, and to form a plasma plume at least partially within the hole, the plasma plume having insufficient thermal energy and expansion velocity to etch a sidewall of the hole; and
directing a second laser beam pulse into the plasma plume to increase the temperature and expansion velocity of the plasma plume such that the sidewall is etched causing an increase in the cross-sectional dimension at the location in the hole.

2. The method of claim 1 , wherein the first laser beam pulse has an intensity and duration sufficient to ablate a bottom of the hole in a depth direction, and sufficient to create the plasma plume which has insufficient energy and expansion velocity to etch the sidewall of the hole, but has sufficient energy that once amplified with the second laser beam pulse, etches the sidewall.

3. The method of claim 1 , wherein the second laser beam pulse has an intensity and duration sufficient to amplify the plasma plume such that the plasma plume etches the sidewall, but are low enough such that the second laser beam pulse does not create a HAZ in the sidewall.

4. The method of claim 1 , wherein the hole is a microhole.

5. The method of claim 1 , wherein the substrate is formed of a conductive material.

6. The method of claim 1 , wherein the substrate is formed of a non-conductive material.

7. The method of claim 1 , further comprising controllably delaying the second laser beam pulse such that the sidewall is etched in a predetermined location along the depth of the hole.

8. The method of claim 1 , further comprising controlling an intensity of the first and second laser beam pulses such that the cross-sectional dimension at the location in the hole is increased to by a predetermined amount.

9. The method of claim 1 , further comprising repeatedly directing the first and second laser beam pulses into the hole so that the hole has varying cross-sectional dimensions at locations along the depth of the hole.

10. The method of claim 1 , further comprising directing a third laser beam pulse into the hole to ablate a bottom surface of the hole such that the hole is a through-hole in the substrate.

11. The method of claim 1 , wherein portions of the sidewall in the hole are not etched and the hole has a cross-sectional dimension that varies along the depth of the hole.

Assignees

• Purdue Research Foundation

Inventors

• Shin Yung C

Classifications

• B29K2105/06

  containing reinforcements, fillers or inserts · CPC title

• B23K26/384 Primary

  of specially shaped holes · CPC title

• B29C59/14

  by plasma treatment {(plasma tubes per se H01J)} · CPC title

• B23K2203/08

  Operations & Transport · mapped topic

• B23K2203/50

  Operations & Transport · mapped topic