Flat plate-type bass loudspeaker
US-9788121-B2 · Oct 10, 2017 · US
MEMS microphone
US10051381B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-10051381-B2 |
| Application number | US-201715416980-A |
| Country | US |
| Kind code | B2 |
| Filing date | Jan 26, 2017 |
| Priority date | Oct 25, 2016 |
| Publication date | Aug 14, 2018 |
| Grant date | Aug 14, 2018 |
How to read this patent
A practical reading order for non-experts. Skip the full description unless you need deep technical detail.
- Title
What the patent document calls the invention.
- Abstract
A short plain-language summary of the technical disclosure.
- Assignees and inventors
Who owns or filed the patent and who is credited as inventor.
- Key dates
Filing, priority, publication, and grant dates set the timeline.
- First independent claim
The legal scope of protection — read this for what is actually claimed.
- CPC / IPC classifications
Technology tags used to group this patent with similar filings.
- Citations and related patents
Prior art links and similar publications in this corpus.
Abstract
Official abstract text for this publication.
A MEMS microphone, includes a base with a back cavity and a capacitor system fixed to the base. The capacitor system includes a back plate above the base and a diaphragm opposite to the back plate for forming an insulated gap. The back plate includes a body part and multiple spaced fixation parts extending from the body part, and the diaphragm includes a vibrating part and a connecting part extending from the vibrating part. An orthographic projection of the body part of the back plate along a vibration direction of the diaphragm is completely located on the diaphragm; and at least a part of an orthographic projection of the fixation parts along the vibration direction is located on the diaphragm.
First claim
Opening claim text (preview).
What is claimed is: 1. A MEMS microphone, including: a base with a back cavity; a capacitor system fixed to the base, the capacitor system including a back plate above the base and a diaphragm opposite to the back plate for forming an insulated gap; wherein the back plate includes a body part and multiple spaced fixation parts extending from the body part, and the diaphragm includes a vibrating part and a connecting part extending from the vibrating part; an orthographic projection of the body part of the back plate along a vibration direction of the diaphragm is completely located on the diaphragm; and at least a part of an orthographic projection of the fixation parts along the vibration direction is located on the diaphragm. 2. The MEMS microphone as described in claim 1 , wherein the orthographic projection of the body part of the back plate along the vibration direction is completely located on the vibrating part. 3. The MEMS microphone as described in claim 1 , wherein the fixation parts are spaced apart with a certain distance for forming comb fingers. 4. The MEMS microphone as described in claim 1 , wherein the fixation parts form a ring comb finger structure together. 5. The MEMS microphone as described in claim 1 further comprising a first insulation layer fixed between the base and the back plate, and a second insulation layer is fixed between the diaphragm and the back plate, both the first insulation layer and the second insulation layer are provided with a plurality of ventholes penetrating therethrough.
Assignees
Inventors
Classifications
Transducers incorporated or for use in hand-held devices, e.g. mobile phones, PDA's, camera's · CPC title
- H04R19/04Primary
Microphones (H04R19/01 takes precedence) · CPC title
Transducers for transforming electrical into mechanical energy or vice versa (dynamo-electric machines H02K99/00; electrostatic machines H02N1/00; piezoelectric devices H10N30/00) · CPC title
using semiconductor materials · CPC title
Comb structures · CPC title
Patent family
Related publications grouped by family.
External sources
Frequently asked questions
Answers are generated from the same data shown on this page.
- What does patent US10051381B2 cover?
- A MEMS microphone, includes a base with a back cavity and a capacitor system fixed to the base. The capacitor system includes a back plate above the base and a diaphragm opposite to the back plate for forming an insulated gap. The back plate includes a body part and multiple spaced fixation parts extending from the body part, and the diaphragm includes a vibrating part and a connecting part ext…
- Who is the assignee on this patent?
- Zhang Jinyu, Zhang Rui, Meng Zhenkui, and 1 more
- What technology area does this patent fall under?
- Primary CPC classification H04R19/04. Mapped technology areas include Electricity.
- When was this patent published?
- Publication date Tue Aug 14 2018 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
- What related patents are in patentsdb?
- We list 1 related publication on this page (citations in our corpus or others sharing the same primary CPC).