Encapsulation composition (as amended)

Patent metadata

Field	Value
Publication number	US-10050204-B2
Application number	US-201414762399-A
Country	US
Kind code	B2
Filing date	Jul 21, 2014
Priority date	Jul 19, 2013
Publication date	Aug 14, 2018
Grant date	Aug 14, 2018

Abstract

An encapsulation composition, an encapsulation film including the same, an encapsulation product for organic electronic devices, and a method of manufacturing an organic electronic device are provided. The encapsulation composition can be useful in effectively preventing moisture or oxygen from flowing into the organic electronic device from external environments while realizing transparency when the organic electronic device is encapsulated by the encapsulation composition. Also, the encapsulation film formed of the encapsulation composition can be useful in ensuring mechanical properties such as handling properties and processability, and the organic electronic device whose encapsulation structure is formed by means of the encapsulation film may have improved lifespan and durability, thereby providing an encapsulation product for organic electronic devices showing high reliability.

First claim

What is claimed is:

1. An encapsulation composition comprising:
a first resin having a weight average molecular weight of 100,000 to 2,000,000;
a second resin, which is a polymer of a mixture comprising an alkyl (meth)acrylate and a monomer having at least one reactive functional group; and
at least one multifunctional cross-linking agent selected from the group consisting of an isocyanate cross-linking agent, an epoxy cross-linking agent, an aziridine cross-linking agent, and a metal chelate cross-linking agent,
wherein the first resin comprises a polyisobutylene resin,
wherein the second resin has a cross-linked structure and forms a semi-interpenetrating polymer network with the first resin,
wherein, in the second resin, the monomer having at least one reactive functional group is included in an amount of 5 to 50 parts by weight with respect to 100 parts by weight of the alkyl (meth)acrylate, and
wherein the monomer having the reactive functional group comprises a hydroxyl group-containing monomer or a carboxyl group-containing monomer.

2. The encapsulation composition of claim 1 , wherein the first resin has a contact angle of 80° or more with deionized water.

3. The encapsulation composition of claim 1 , wherein the first resin has a glass transition temperature of 0° C. or less.

4. The encapsulation composition of claim 1 , wherein the second resin is included at a content of 1 to 50 parts by weight, with respect to 100 parts by weight of the first resin.

5. The encapsulation composition of claim 1 , wherein a difference in solubility parameter between the first resin and the second resin is 1 (cal/cm 3 ) 1/2 or less.

6. The encapsulation composition of claim 1 , wherein the alkyl (meth)acrylate satisfies the following Formula 1:

wherein R 1 represents hydrogen, or an alkyl group having 1 to 4 carbon atoms, and R 2 represents a linear, branched or cyclic alkyl group having 3 to 30 carbon atoms.

7. The encapsulation composition of claim 1 , which has a light transmittance of 80% or more with respect to a visible ray region having a wavelength of 380 nm to 780 nm, as measured by a spectrophotometer when prepared in the form of a film.

8. The encapsulation composition of claim 1 , further comprising a moisture absorbent.

9. An encapsulation film comprising an encapsulation layer formed from the encapsulation composition of claim 1 .

10. An encapsulation product for organic electronic devices comprising:
a substrate;
an organic electronic device formed on the substrate; and
the encapsulation film of claim 9 configured to encapsulate the organic electronic device.

11. A method of manufacturing an organic electronic device, comprising:
applying the encapsulation layer of the encapsulation film of claim 9 to a substrate having an organic electronic device formed on a surface thereof to cover the organic electronic device.

Assignees

• Lg Chemical Ltd

Inventors

• Lee Seung Min
• Chang Suk Ky
• Park Min Soo
• Yoo Hyun Jee
• Shim Jung Sup
• Cho Yoon Gyung
• Bae Kyung Yul
• Kim Hyun Suk
• Moon Jung Ok

Classifications

• C08L23/22

  Copolymers of isobutene; Butyl rubber; Homopolymers or copolymers of other iso-olefins · CPC title

• C09J133/06

  of esters containing only carbon, hydrogen and oxygen, the oxygen atom being present only as part of the carboxyl radical · CPC title

• C08L2203/206

  use in coating or encapsulating of electronic parts · CPC title

• C08L2312/00

  Crosslinking · CPC title

• C08L2205/04

  containing interpenetrating networks · CPC title