Sintered body production method
US-2024307956-A1 · Sep 19, 2024 · US
US10050160B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-10050160-B2 |
| Application number | US-201113988363-A |
| Country | US |
| Kind code | B2 |
| Filing date | Aug 10, 2011 |
| Priority date | Jan 17, 2011 |
| Publication date | Aug 14, 2018 |
| Grant date | Aug 14, 2018 |
A practical reading order for non-experts. Skip the full description unless you need deep technical detail.
What the patent document calls the invention.
A short plain-language summary of the technical disclosure.
Who owns or filed the patent and who is credited as inventor.
Filing, priority, publication, and grant dates set the timeline.
The legal scope of protection — read this for what is actually claimed.
Technology tags used to group this patent with similar filings.
Prior art links and similar publications in this corpus.
Official abstract text for this publication.
A Cu—Ga alloy sintered-compact sputtering target having a Ga concentration of 40 to 50 at % and Cu as the balance, wherein the sintered-compact sputtering target is characterized in that the relative density is 80% or higher, and the compositional deviation of the Ga concentration is within ±0.5 at % of the intended composition. A method of producing a Cu—Ga alloy sintered-compact sputtering target having a Ga concentration of 40 to 50 at % and Cu as the balance, wherein the method thereof is characterized in that Cu and Ga raw materials are melted and cooled/pulverized to produce a Cu—Ga alloy raw material powder, and the obtained material powder is further hot-pressed with a retention temperature being between the melting point of the mixed raw material powder and a temperature 15° C. lower than the melting point and with a pressure of 400 kgf/cm 2 or more applied to the sintered mixed raw material powder. Provided are a sputtering target having very low compositional deviation and high density; a method of producing the target; a light-absorbing layer having a Cu—Ga based alloy film; and a CIGS solar cell including the light-absorbing layer.
Opening claim text (preview).
The invention claimed is: 1. A Cu—Ga alloy sintered compact sputtering target having a structure consisting of a single composition alloy having a Ga concentration of 40 to 50 at % and Cu as the balance, wherein the relative density is 80% or higher, and no Ga phase is present. 2. A method of producing a Cu—Ga based alloy sintered compact sputtering target having a structure consisting of a single composition alloy having a Ga concentration of 40 to 50 at % and Cu as the balance, a relative density of 80% or higher, and no Ga phase present within the sputtering target, comprising the steps of: producing a Cu—Ga alloy raw material powder by melting, cooling and pulverizing Cu and Ga raw materials; and hot-pressing the raw material powder at a retention temperature being between the melting point of the mixed raw material powder and a temperature 15° C. lower than the melting point and with a pressure of 400 kgf/cm 2 or more applied to the sintering mixed raw material powder. 3. A light-absorbing layer comprising a Cu—Ga based alloy film formed on a substrate using the Cu—Ga alloy sintered compact sputtering target according to claim 1 . 4. A CIGS system solar cell comprising the light-absorbing layer according to claim 3 . 5. The method according to claim 2 , wherein compositional deviation of the Ga concentration is within ±0.5 at % of the intended composition.
Alloys based on copper · CPC title
CuInSe2 material PV cells · CPC title
Alloys based on a metal not provided for in groups C22C5/00 - C22C27/00 · CPC title
starting from solid material, e.g. by crushing, grinding or milling ({C22C1/1084 takes precedence}; crushing, grinding or milling, in general, see the relevant subclasses, e.g. B02C) · CPC title
Metallurgical or chemical aspects of target preparation, e.g. casting, powder metallurgy · CPC title
Related publications grouped by family.
Answers are generated from the same data shown on this page.