Substrate heat channels for heat assisted magnetic recording for reader over writer transducer application

Patent metadata

Field	Value
Publication number	US-10049693-B2
Application number	US-201615227319-A
Country	US
Kind code	B2
Filing date	Aug 3, 2016
Priority date	Aug 3, 2016
Publication date	Aug 14, 2018
Grant date	Aug 14, 2018

Abstract

An apparatus includes an apparatus comprising a slider. The slider comprises a substrate comprising a media-facing surface, a first side surface perpendicular to the media-facing surface, and a second side surface opposite the first side surface. A heat sink layer is formed proximate to and thermally coupled to the first side surface of the substrate. A write transducer comprises a waveguide core that at least partially extends from the top surface to the media-facing surface. The waveguide core is formed proximate to and thermally coupled to the heat sink layer. A read transducer is formed proximate to the write transducer such that the read transducer is closer to a trailing edge of the slider than the write transducer.

First claim

What is claimed is:

1. An apparatus, comprising:
a slider, comprising:
a substrate comprising a media-facing surface, a first side surface perpendicular to the media-facing surface, and a second side surface opposite the first side surface;
a heat sink layer formed proximate to and mechanically coupled to the first side surface of the substrate;
a write transducer comprising a waveguide core that at least partially extends from the top surface to the media-facing surface, the waveguide core formed proximate to and thermally coupled to the heat sink layer, the heat sink layer disposed between the substrate and the write transducer and configured to transfer heat away from the write transducer; and
a read transducer formed proximate to the write transducer such that the read transducer is closer to a trailing edge of the slider than the write transducer.

2. The apparatus of claim 1 , wherein the heat sink layer is thermally coupled to the waveguide core by thermal vias extending therebetween.

3. The apparatus of claim 1 , wherein the heat sink layer is recessed from the media-facing surface.

4. The apparatus of claim 1 , wherein the heat sink layer extends to the media-facing surface.

5. The apparatus of claim 1 , wherein the substrate comprises AlTiC.

6. The apparatus of claim 1 , wherein the heat sink layer is at least partially embedded in the substrate.

7. The apparatus of claim 1 , wherein the heat sink layer is patterned.

8. The apparatus of claim 1 , wherein the heat sink layer has a thickness of about 0.25-1.75 μm.

9. An apparatus, comprising:
a slider, comprising:
a substrate comprising a media-facing surface, a first side surface perpendicular to the media-facing surface, and a second side surface opposite the first side surface;
a heat sink layer formed proximate to and mechanically coupled to the first side surface of the substrate;
a writer comprising a write pole, a return pole, and a write coil arrangement, the heat sink layer disposed between the substrate and the writer and configured to transfer heat away from the writer;
a reader formed proximate to the writer such that the reader is closer to a trailing edge of the slider than the writer;
a near-field transducer proximate the write pole; and
an optical waveguide formed proximate to and thermally coupled to the heat sink layer, the optical waveguide configured to receive light from a light source.

10. The apparatus of claim 9 , wherein the heat sink layer is thermally coupled to the waveguide core by thermal vias extending therebetween.

11. The apparatus of claim 9 , wherein the heat sink layer is recessed from the media-facing surface.

12. The apparatus of claim 9 , wherein the heat sink layer extends to the media-facing surface.

13. The apparatus of claim 9 , wherein the substrate comprises AlTiC.

14. The apparatus of claim 9 , wherein the heat sink layer is at least partially embedded in the substrate.

15. The apparatus of claim 9 , wherein the heat sink layer is patterned.

16. A method, comprising:
energizing at least one component disposed on a slider configured for heat-assisted magnetic recording, the slider having a read transducer formed proximate to a write transducer such that the read transducer is closer to a trailing edge of the slider than the write transducer, the slider comprising a substrate having a media-facing surface, a top surface opposite the media-facing surface, a first side surface perpendicular to the media-facing surface, and a second side surface opposite the first side surface;
conducting heat away from the write transducer by a heat sink layer, the heat sink layer formed between the first side surface of the substrate and the write transducer and mechanically coupled to the substrate; and
conducting the heat from the heat sink layer to the substrate of the slider.

17. The method of claim 16 , wherein the component comprises one or more of a reader, a writer core, a return pole of a writer, and at least one coil of a coil arrangement.

18. The method of claim 16 , wherein the heat sink layer is thermally coupled to the waveguide core by thermal vias extending therebetween.

19. The method of claim 16 , wherein the heat sink layer is recessed from the media-facing surface.

20. The method of claim 16 , wherein the heat sink layer extends to the media-facing surface.

Assignees

• Seagate Technology Llc

Inventors

• Hutchinson Erik J
• Wolf John

Classifications

• G11B5/6088

  Optical waveguide in or on flying head · CPC title

• G11B5/40

  Protective measures on heads, e.g. against excessive temperature  (G11B5/31 takes precedence; protection against wear G11B5/255  {; protective structure of the head: see under structures, e.g. G11B5/3106}) · CPC title

• G11B5/6082 Primary

  Design of the air bearing surface · CPC title

• G11B7/1387

  using the near-field effect · CPC title

• G11B2005/0021

  Thermally assisted recording using an auxiliary energy source for heating the recording layer locally to assist the magnetization reversal · CPC title