Method for manufacturing conductive pattern forming member

Patent metadata

Field	Value
Publication number	US-10048583-B2
Application number	US-201715684469-A
Country	US
Kind code	B2
Filing date	Aug 23, 2017
Priority date	Apr 21, 2015
Publication date	Aug 14, 2018
Grant date	Aug 14, 2018

Abstract

Provided is a method for manufacturing a conductive pattern forming member that is formed on a substrate and that has excellent resistance to ion migration between a conductive pattern and a photosensitive resin layer, while suppressing generation of residues in the dissolution and removal of unexposed portions. This method for manufacturing a conductive pattern forming member includes: a coating step of applying, onto surfaces of a layer A formed of a resin (a) having a carboxyl group, and a transparent electrode layer B, the layers A and B being formed over a substrate, a composition C containing conductive particles and a resin (c) having a double bond and a carboxyl group to obtain a coating film C; a drying step of drying the coating film C to obtain a dry film C; an exposure step of exposing the dry film C to light to obtain an exposed film C; a developing step of developing the exposed film C to obtain a pattern C; and a curing step of curing the pattern C to obtain a conductive pattern C, wherein particles having a particle diameter of 0.3 to 2.0 μm account for 80% or more of the conductive particles.

First claim

The invention claimed is:

1. A method for manufacturing a conductive pattern forming member, comprising:
a coating step of applying, onto surfaces of a layer A formed of a resin (a) having a carboxyl group, and a transparent electrode layer B, the layers A and B being formed over a substrate, a composition C containing conductive particles and a resin (c) having a double bond and a carboxyl group to obtain a coating film C;
a drying step of drying the coating film C to obtain a dry film C;
an exposure step of exposing the dry film C to light to obtain an exposed film C;
a developing step of developing the exposed film C to obtain a pattern C; and
a curing step of curing the pattern C to obtain a conductive pattern C,
wherein particles having a particle diameter of 0.3 to 2.0 μm account for 80% or more of the conductive particles.

2. The method for manufacturing a conductive pattern forming member according to claim 1 , wherein particles having a particle diameter of 0.5 to 1.5 μm account for 80% or more of the conductive particles.

3. The method for manufacturing a conductive pattern forming member according to claim 1 , wherein the composition C further contains a photopolymerization initiator.

4. The method for manufacturing a conductive pattern forming member according to claim 1 , wherein the resin (c) having a double bond and a carboxyl group is an acrylic resin having an acid value of 50 to 250 mg KOH/g.

5. The method for manufacturing a conductive pattern forming member according to claim 1 , wherein the transparent electrode layer B contains silver and the composition C contains silver particles as the conductive particles.

6. The method for manufacturing a conductive pattern forming member according to claim 5 , wherein the silver contained in the transparent electrode layer B is in a fibrous form.

7. The method for manufacturing a conductive pattern forming member according to claim 1 , wherein the composition C contains an alcoholic solvent having a boiling point of 200° C. or more.

8. The method for manufacturing a conductive pattern forming member according to claim 1 , wherein the drying step is carried out at a temperature of 50 to 80° C.

9. The method for manufacturing a conductive pattern forming member according to claim 1 , wherein the developing step is carried out at a development pressure of 0.02 to 0.2 MPa.

10. The method for manufacturing a conductive pattern forming member according to claim 1 , wherein the composition C contains an epoxy resin.

11. The method for manufacturing a conductive pattern forming member according to claim 1 , wherein a difference between an acid value SA of the layer A formed of the resin (a) having a carboxyl group and an organic component acid value SC of the conductive pattern C is 20 to 150 mg KOH/g.

12. A conductive pattern forming member produced by the method for manufacturing a conductive pattern forming member according to claim 1 , wherein the conductive pattern C contains a compound having a urethane linkage.

13. A conductive pattern forming member produced by the method for manufacturing a conductive pattern forming member according to claim 1 , wherein the conductive pattern C contains a compound having a cyclohexane skeleton.

14. A conductive pattern forming member produced by the method for manufacturing a conductive pattern forming member according to claim 1 , wherein an optical clear adhesive layer D stacked on any of the layer A, the transparent electrode layer B and the conductive pattern C contains isobornyl skeleton.

15. A conductive pattern forming member produced by the method for manufacturing a conductive pattern forming member according to claim 1 , wherein the layer D contains a benzotriazole-based compound.

Assignees

• Toray Industries

Inventors

• Mizuguchi Tsukuru
• Kawano Tomotaka

Classifications

• C09D133/08

  Homopolymers or copolymers of acrylic acid esters · CPC title

• G03F7/0388

  with ethylenic or acetylenic bands in the side chains of the photopolymer · CPC title

• G06F3/041

  Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means · CPC title

• G03F7/20 Primary

  Exposure; Apparatus therefor (photographic printing apparatus for making copies G03B27/00) · CPC title

• G03F7/0047 Primary

  characterised by additives for obtaining a metallic or ceramic pattern, e.g. by firing · CPC title