Submicron wafer alignment

Patent metadata

Field	Value
Publication number	US-10048473-B2
Application number	US-201615188717-A
Country	US
Kind code	B2
Filing date	Jun 21, 2016
Priority date	Aug 6, 2015
Publication date	Aug 14, 2018
Grant date	Aug 14, 2018

Abstract

Certain aspects relate to systems and techniques for submicron alignment in wafer optics. One disclosed method of alignment between wafers to produce an integrated lens stack employs a beam splitter (that is, a 50% transparent mirror) that reflects the alignment mark of the top wafer when the microscope objective is focused on the alignment mark of the bottom wafer. Another disclosed method of alignment between wafers to produce an integrated lens stack implements complementary patterns that can produce a Moiré effect when misaligned in order to aid in visually determining proper alignment between the wafers. In some embodiments, the methods can be combined to increase precision.

First claim

What is claimed is:

1. An optical wafer stack comprising:
a first transparent wafer comprising a first array of lenses;
a second transparent wafer comprising a second array of lenses, each lens of the second array of lenses forming a lens pair with a corresponding one of the first array of lenses;
a first spacer wafer positioned between the first transparent wafer and the second transparent wafer and comprising a spacer material including an array of openings, at least one lens of each lens pair extending into an opening of the array of openings;
a first alignment mark provided on the first transparent wafer, the first alignment mark comprising a first set of repeating marks positioned around a first lens of the first array of lenses; and
a second alignment mark provided on the second transparent wafer, the second alignment mark comprising a second set of repeating marks complementary to the first set of repeating marks and positioned around a second lens of the second array of lenses, the first lens and the second lens forming one lens pair.

2. The optical wafer stack of claim 1 , wherein the first set of repeating marks comprises a first set of concentric annuli and the second set of repeating marks comprises a second set of concentric annuli.

3. The optical wafer stack of claim 2 , wherein, when the first alignment mark is aligned with the second alignment mark, the first and second sets of concentric annuli form a continuous circular shape when viewed from a top-down perspective orthogonal to a surface of the first transparent wafer.

4. The optical wafer stack of claim 1 , wherein the first lens, the second lens, and a portion of the spacer material around an opening of the array of openings form a lens stack having an optical axis.

5. The optical wafer stack of claim 4 , wherein, when the first alignment mark is aligned with the second alignment mark from a top-down perspective, a center of the first lens and a center of the second lens align with the optical axis of the lens stack within a tolerance of 2 microns.

6. The optical wafer stack of claim 4 , further comprising a beam splitter layer provided at an optical center point between a first plane of the first alignment mark and a second plane of the second alignment mark.

7. The optical wafer stack of claim 6 , wherein, when the first alignment mark is aligned with the second alignment mark from a top-down perspective, a center of the first lens and a center of the second lens align with the optical axis of the lens stack within a tolerance of 250 nm.

8. The optical wafer stack of claim 1 , wherein the first set of repeating marks and the second set of repeating marks comprise concentric annuli having a line thickness of 5 μm.

9. The optical wafer stack of claim 1 , further comprising:
a third transparent wafer including a third array of lenses;
a second spacer wafer positioned between the second transparent wafer and the third transparent wafer and comprising the spacer material including an array of openings; and
a third alignment mark provided on the third transparent wafer, the third alignment mark comprising a third set of repeating marks complementary to the first and second sets of repeating marks and positioned around a third lens of the third array of lenses, the third lens forming an optical stack with the first lens and the second lens.

10. The optical wafer stack of claim 1 , further comprising:
a third transparent wafer including a third array of lenses;
a second spacer wafer positioned between the second transparent wafer and the third transparent wafer and comprising the spacer material including an array of openings;
a third alignment mark provided on the third transparent wafer, the third alignment mark comprising a third set of repeating marks positioned around a third lens of the third array of lenses, the third lens forming a pair with a fourth lens of the second array of lenses;
a fourth alignment mark provided on the second transparent wafer, the fourth alignment mark comprising a fourth set of repeating marks complementary to the third set of repeating marks and positioned around the fourth lens.

Assignees

• Qualcomm Inc

Inventors

• Georgiev Todor Georgiev

Classifications

• G02B27/144

  using partially transparent surfaces without spectral selectivity (G02B27/147 takes precedence) · CPC title

• G02B27/62

  Optical apparatus specially adapted for adjusting optical elements during the assembly of optical systems · CPC title

• B32B2307/412

  Transparent · CPC title

• G02B27/32

  Fiducial marks and measuring scales within the optical system · CPC title

• G02B27/1073

  characterized by manufacturing or alignment methods · CPC title