Polycrystalline diamond compacts, and related methods and applications

Patent metadata

Field	Value
Publication number	US-10047568-B2
Application number	US-201514677875-A
Country	US
Kind code	B2
Filing date	Apr 2, 2015
Priority date	Nov 21, 2013
Publication date	Aug 14, 2018
Grant date	Aug 14, 2018

Abstract

Embodiments relate to polycrystalline diamond compacts (“PDCs”) including a polycrystalline diamond (“PCD”) table in which a metal-solvent catalyst is alloyed with at least one alloying element to improve thermal stability and/or wear resistance of the PCD table. In an embodiment, a PDC includes a substrate and a PCD table bonded to the substrate. The PCD table includes diamond grains defining interstitial regions. The PCD table includes an alloy comprising at least one Group VIII metal and at least one metallic alloying element such as phosphorous.

First claim

What is claimed is:

1. A polycrystalline diamond compact, comprising:
a substrate; and
a polycrystalline diamond table including:
an upper surface;
at least one side surface;
an interfacial surface spaced from the upper surface and bonded to the substrate;
a plurality of bonded diamond grains defining a plurality of interstitial regions;
a first region extending inwardly from the upper surface and the at least one side surface, the first region including an alloy disposed in at least a portion of the plurality of interstitial regions in the first region, the alloy comprising at least one intermediate compound including at least one Group VIII metal and phosphorous, the phosphorous being distributed non-uniformly throughout at least the first region of the polycrystalline diamond table; and
a second region extending inwardly from the interfacial surface that is free of phosphorous.

2. The polycrystalline diamond compact of claim 1 wherein the alloy exhibits a bulk modulus that is less than that of the at least one Group VIII metal alone.

3. The polycrystalline diamond compact of claim 1 wherein the at least one Group VIII metal includes at least one of iron, cobalt, or nickel.

4. The polycrystalline diamond compact of claim 3 wherein the at least one Group VIII metal includes cobalt, and wherein the at least one intermediate compound includes Co 2 P.

5. The polycrystalline diamond compact of claim 4 wherein the alloy includes cobalt, and wherein the second region includes cobalt therein and is substantially free of Co 2 P.

6. The polycrystalline diamond compact of claim 1 wherein first region extends inwardly from at least a portion of one or more of the upper surface or the at least one side surface to a depth of at least about 250 μm.

7. The polycrystalline diamond compact of claim 1 wherein first region extends inwardly from the at least one side surface to form a generally annular first region extending peripherally about at least a portion of the second region.

8. The polycrystalline diamond compact of claim 1 wherein the polycrystalline diamond table includes a leached region extending inwardly from at least a portion of one or more of the upper surface or the at least one side surface to a distance of at least half the depth of the first region.

9. The polycrystalline diamond compact of claim 8 wherein the first region extends between at least a portion of the second region and the leached region.

10. The polycrystalline diamond compact of claim 8 wherein the leached region extends inwardly a distance from at least a portion of one or more of the upper surface or the at least one side surface to a depth of at least about 250 μm.

11. The polycrystalline diamond compact of claim 1 , wherein:
the polycrystalline diamond table includes a chamfer extending between the upper surface and the at least one side surface; and
the first region substantially contours the chamfer.

12. The polycrystalline diamond compact of claim 1 wherein the first region extends along substantially all of a total surface area of one or more of the at least one side surface or the upper surface of the polycrystalline diamond table.

13. The polycrystalline diamond compact of claim 1 wherein the first region extends along about 50% or more of a total surface area of one or more of the at least one side surface or the upper surface of the polycrystalline diamond table.

14. The polycrystalline diamond compact of claim 1 wherein the second region extends about the first region, and the first region extends inwardly from only a portion of the upper surface of the polycrystalline diamond table.

15. A rotary drill bit, comprising:
a bit body configured to engage a subterranean formation; and
a plurality of polycrystalline diamond cutting elements affixed to the bit body, at least one of the polycrystalline diamond cutting elements including:
a substrate; and
a polycrystalline diamond table including:
an upper surface;
at least one side surface;
an interfacial surface spaced from the upper surface and bonded to the substrate;
a plurality of bonded diamond grains defining a plurality of interstitial regions;
a first region extending inwardly from the upper surface and the at least one side surface, the first region including an alloy disposed in at least a portion of the plurality of interstitial regions in the first region, the alloy comprising at least one intermediate compound including at least one Group VIII metal and phosphorous, the phosphorous being distributed non-uniformly throughout at least the first region of the polycrystalline diamond table; and
a second region extending inwardly from the interfacial surface that is free of phosphorous.

16. A method of fabricating a polycrystalline diamond compact, the method comprising:
providing an assembly including:
a substrate;
a polycrystalline diamond table bonded to the substrate, the polycrystalline diamond table including an upper surface, at least one side surface, an interfacial surface bonded to the substrate, and a plurality of bonded diamond grains defining a plurality of interstitial regions, at least a portion of the plurality of interstitial regions including at least one Group VIII metal disposed therein; and
at least one material positioned adjacent to the polycrystalline diamond table, the at least one material including phosphorous; and

subjecting the assembly to a heating process effective to at least partially alloy the at least one Group VIII metal with the phosphorous to form an alloy that includes at least one intermediate compound including the at least one Group VIII metal and the phosphorous, the polycrystalline diamond table including a first region extending inwardly from the upper surface and the at least one side surface that includes the at least one intermediate compound therein and a second region extending inwardly from the interfacial surface that is free of phosphorous;
wherein the phosphorous is distributed non-uniformly throughout at least the first region of the polycrystalline diamond table.

17. The method of claim 16 wherein providing an assembly includes positioning a layer including the at least one material adjacent to at least a portion of one or more of the upper surface or the at least one side surface.

18. The method of claim 16 wherein providing an assembly includes positioning a layer including the at least one material adjacent to more than about 50% of the surface area of one or more of the upper surface or the at least one side surface.

19. The method of claim 16 wherein the alloy exhibits a bulk modulus that is less than that of the at least one Group VIII alone.

20. The method of claim 16 , further comprising leaching a region of the polycrystalline diamond table to a depth of at least about 250 μm from one or more of the upper surface or the at least one side surface.

21. The method of claim 20 , wherein leaching occurs prior to forming the alloy.

22. The method of claim 20 , wherein leaching a region of the polycrystalline diamond table removes at least some of the alloy.

23. The method of claim 16 , wherein:
the assembly includes at least another material adjacent to the polycrystalline diamond table; and
subjecting the assembly to a heating process includes forming another alloy including at least another intermediate compound.

24. The method of claim 16 , wherein subjecting the assembly to a heating process

Assignees

• Us Synthetic Corp

Inventors

• Mukhopadhyay Debkumar
• Bertagnolli Kenneth E
• Knuteson Cody William

Classifications

• B22F2998/10

  Processes characterised by the sequence of their steps · CPC title

• B22F7/06

  of composite workpieces or articles from parts, e.g. to form tipped tools {(B22F7/002 takes precedence)} · CPC title

• B24D3/10

  for porous or cellular structure, e.g. for use with diamonds as abrasives · CPC title

• C22C26/00

  Alloys containing diamond {or cubic or wurtzitic boron nitride, fullerenes or carbon nanotubes} · CPC title

• B22F2999/00

  Aspects linked to processes or compositions used in powder metallurgy · CPC title