Tin-plated copper-alloy terminal material

Patent metadata

Field	Value
Publication number	US-10047448-B2
Application number	US-201515505174-A
Country	US
Kind code	B2
Filing date	Aug 18, 2015
Priority date	Sep 11, 2014
Publication date	Aug 14, 2018
Grant date	Aug 14, 2018

Abstract

A tin-plated copper alloy terminal material in which an Sn-based surface layer is formed on a surface of a base material that is made of copper or a copper alloy, and a Cu—Sn alloy layer and an Ni layer or an Ni alloy layer are sequentially formed between the Sn-based surface layer and the base material from the Sn-based surface layer side: the Cu—Sn alloy layer is a layer that is formed only of an intermetallic compound alloy which is obtained by substituting some of Cu in Cu6Sn5 alloy with Ni; and parts of the Cu—Sn alloy layer are exposed from the Sn-based surface layer, thereby forming a plurality of exposed portions; an average thickness of the Sn-based surface layer is from 0.2 μm to 0.6 μm (inclusive); and an area rate of the exposed portions of the Cu—Sn alloy layer relative to a surface area of is 1% to 40% (inclusive).

First claim

The invention claimed is:

1. A tin-plated copper alloy terminal material comprising: a base material made of copper or a copper alloy, an Ni layer or Ni alloy layer formed on a surface of the base material; a Cu—Sn alloy layer formed on the Ni layer or Ni alloy layer; and a Sn-based surface layer formed on the Cu—Sn alloy layer, and wherein
the Cu—Sn alloy layer consists of an intermetallic compound alloy which is obtained by substituting some of Cu in Cu 6 Sn 5 alloy with Ni, parts of the Cu—Sn alloy layer are exposed from the Sn-based surface layer and form exposed portions,
an average thickness of the Sn-based surface layer is 0.2 μm or larger and 0.6 μm or smaller,
an area rate of the exposed portions of the Cu—Sn alloy layer relative to a surface area of a surface layer of the tin-plated copper alloy terminal material is 1% or higher and 40% or lower,
an average circle-equivalent diameter of the exposed portions of the Cu—Sn alloy layer is 0.1 μm or larger and 1.5 μm or smaller,
a reduced peak height Rpk at a surface of the tin-plated copper alloy terminal material is 0.005 μm or larger and 0.03 μm or smaller, and
coefficient of kinetic friction is 0.3 or less.

2. The tin-plated copper alloy terminal material according to claim 1 , wherein a content percentage of Ni in the Cu—Sn alloy layer is 1 at % or more and 25 at % or less.

Assignees

• Mitsubishi Materials Corp

Inventors

• Kato Naoki
• Inoue Yuki
• Nakaya Kiyotaka

Classifications

• C25D5/50

  by heat-treatment · CPC title

• B32B2457/00

  Electrical equipment · CPC title

• C25D5/505

  of electroplated tin coatings, e.g. by melting · CPC title

• Y10T428/265

  1 mil or less · CPC title

• Y10T428/12722

  Next to Group VIII metal-base component · CPC title