Electrical steel sheet and method for manufacturing same
US-12163066-B2 · Dec 10, 2024 · US
Epoxy resin composition, cured product, heat radiating material, and electronic member
US10047256B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-10047256-B2 |
| Application number | US-201414772452-A |
| Country | US |
| Kind code | B2 |
| Filing date | Mar 4, 2014 |
| Priority date | Mar 6, 2013 |
| Publication date | Aug 14, 2018 |
| Grant date | Aug 14, 2018 |
How to read this patent
A practical reading order for non-experts. Skip the full description unless you need deep technical detail.
- Title
What the patent document calls the invention.
- Abstract
A short plain-language summary of the technical disclosure.
- Assignees and inventors
Who owns or filed the patent and who is credited as inventor.
- Key dates
Filing, priority, publication, and grant dates set the timeline.
- First independent claim
The legal scope of protection — read this for what is actually claimed.
- CPC / IPC classifications
Technology tags used to group this patent with similar filings.
- Citations and related patents
Prior art links and similar publications in this corpus.
Abstract
Official abstract text for this publication.
The present invention provides an epoxy resin composition including 2,2′,7,7′-tetraglycidyloxy-1,1′-binaphthalene as an epoxy resin (A), and a filler (B). Further, the present invention provides an epoxy resin composition in which the filler (B) in the epoxy resin composition is a thermally conductive filler and an epoxy resin composition in which the filler (B) is silica. Further, the present invention provides a cured product produced by curing the epoxy resin composition of the present invention and a heat dissipation material and an electronic material each including the cured product.
First claim
Opening claim text (preview).
The invention claimed is: 1. An epoxy resin composition which is a curable resin composition comprising an epoxy resin (A) and a filler (B), wherein the epoxy resin (A) is 2,2′,7,7′-tetraglycidyloxy-1,1′-binaphthalene. 2. The epoxy resin composition according to claim 1 , wherein the filler (B) is a thermally conductive filler. 3. The epoxy resin composition according to claim 2 , wherein the thermally conductive filler has a thermal conductivity of 10 W/m·K or more. 4. The epoxy resin composition according to claim 2 , wherein the thermally conductive filler is at least one selected from alumina, magnesium oxide, zinc oxide, beryllia, boron nitride, aluminum nitride, silicon nitride, silicon carbide, boron carbide, titanium carbide, and diamond. 5. The epoxy resin composition according to claim 2 , wherein the epoxy resin composition is a thermally conductive adhesive. 6. The epoxy resin composition according to claim 1 , wherein the filler (B) is silica. 7. The epoxy resin composition according to claim 1 , further comprising a fibrous base material. 8. The epoxy resin composition according to claim 1 , wherein the epoxy resin composition is used for an electronic material. 9. A cured product produced by curing the epoxy resin composition according to claim 1 . 10. A heat dissipation material comprising a cured product produced by curing the epoxy resin composition according to claim 1 . 11. An electronic material comprising a cured product produced by curing the epoxy resin composition according to claim 1 . 12. The epoxy resin composition according to claim 3 , wherein the thermally conductive filler is at least one selected from alumina, magnesium oxide, zinc oxide, beryllia, boron nitride, aluminum nitride, silicon nitride, silicon carbide, boron carbide, titanium carbide, and diamond. 13. The epoxy resin composition according to claim 3 , wherein the epoxy resin composition is a thermally conductive adhesive. 14. The epoxy resin composition according to claim 4 , wherein the epoxy resin composition is a thermally conductive adhesive. 15. The epoxy resin composition according to claim 6 , further comprising a fibrous base material. 16. The epoxy resin composition according to claim 6 , wherein the epoxy resin composition is used for an electronic material. 17. The epoxy resin composition according to claim 7 , wherein the epoxy resin composition is used for an electronic material. 18. A cured product produced by curing the epoxy resin composition according to claim 2 . 19. A heat dissipation material comprising a cured product produced by curing the epoxy resin composition according to claim 2 . 20. An electronic material comprising a cured product produced by curing the epoxy resin composition according to claim 6 .
Assignees
Inventors
Classifications
containing a filler · CPC title
comprising organic materials, e.g. plastics or resins · CPC title
- C09J163/00Primary
Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins · CPC title
Silica · CPC title
Carbocyclic compounds · CPC title
Patent family
Related publications grouped by family.
External sources
Frequently asked questions
Answers are generated from the same data shown on this page.
- What does patent US10047256B2 cover?
- The present invention provides an epoxy resin composition including 2,2′,7,7′-tetraglycidyloxy-1,1′-binaphthalene as an epoxy resin (A), and a filler (B). Further, the present invention provides an epoxy resin composition in which the filler (B) in the epoxy resin composition is a thermally conductive filler and an epoxy resin composition in which the filler (B) is silica. Further, the present …
- Who is the assignee on this patent?
- Dainippon Ink & Chemicals
- What technology area does this patent fall under?
- Primary CPC classification C09J163/00. Mapped technology areas include Chemistry & Metallurgy.
- When was this patent published?
- Publication date Tue Aug 14 2018 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
- What related patents are in patentsdb?
- We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).