Die supply apparatus
US-2015382520-A1 · Dec 31, 2015 · US
Component mounting method
US10045470B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-10045470-B2 |
| Application number | US-201514799814-A |
| Country | US |
| Kind code | B2 |
| Filing date | Jul 15, 2015 |
| Priority date | Jul 23, 2014 |
| Publication date | Aug 7, 2018 |
| Grant date | Aug 7, 2018 |
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- Title
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- Abstract
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- Assignees and inventors
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- First independent claim
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- CPC / IPC classifications
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- Citations and related patents
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Abstract
Official abstract text for this publication.
A component mounting line includes a component mounting apparatus and a board distributing apparatus. The component mounting apparatus includes two transport lanes, each having a carry-in area where a board is carried and a mounting area where a component is mounted onto the board received from the carry-in area. The board distributing apparatus distributes the board to any one of the two transport lanes. The board distributing apparatus distributes the board to any one of the two transport lanes based on a presence or absence of boards in the carry-in area and the mounting area.
First claim
Opening claim text (preview).
What is claimed is: 1. A component mounting method in a component mounting apparatus that mounts a component onto a board distributed by a board distributing apparatus, in which the component mounting apparatus includes two transport lanes, each having a carry-in area where the board distributed by the board distributing apparatus is carried and a mounting area where the component is mounted on the board received from the carry-in area, the method comprising: distributing one or more boards to one or both of the two transport lanes; determining which one of the two transport lanes the board from the board distributing apparatus is carried to based on a presence or absence of the one or more boards in the carry-in area and the mounting area, and outputting a board request signal for requesting a distribution of the board to the determined transport lane to the board distributing apparatus; and mounting the component onto the board distributed to the transport lane for which the board is requested. 2. The component mounting method according to claim 1 , wherein when the one or more boards are present in only the mounting area of one transport lane among the two transport lanes and no boards are present in the carry-in areas of the two transport lanes, the board distributing apparatus distributes the board to the other transport lane among the two transport lanes. 3. The component mounting method according to claim 1 , wherein when the one or more boards are present in the mounting areas of both of the two transport lanes and no boards are present in the carry-in areas of the two transport lanes, the board distributing apparatus distributes the board to a transport lane where component mounting is first terminated among the two transport lanes.
Assignees
Inventors
Classifications
Methods or means for supplying the conductive material and for forcing it through the screen or stencil · CPC title
- H05K13/0061Primary
Tools for holding the circuit boards during processing; handling transport of printed circuit boards · CPC title
Surface mounted components · CPC title
Electricity · mapped topic
Application of solder paste, slurry or powder (using printing techniques to form the desired conductive pattern of the printed circuit by applying conductive material H05K3/12) · CPC title
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Frequently asked questions
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- What does patent US10045470B2 cover?
- A component mounting line includes a component mounting apparatus and a board distributing apparatus. The component mounting apparatus includes two transport lanes, each having a carry-in area where a board is carried and a mounting area where a component is mounted onto the board received from the carry-in area. The board distributing apparatus distributes the board to any one of the two trans…
- Who is the assignee on this patent?
- Panasonic Ip Man Co Ltd
- What technology area does this patent fall under?
- Primary CPC classification H05K13/0061. Mapped technology areas include Electricity.
- When was this patent published?
- Publication date Tue Aug 07 2018 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
- What related patents are in patentsdb?
- We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).