Microelectromechanical microphone having a stationary inner region

Patent metadata

Field	Value
Publication number	US-10045126-B2
Application number	US-201514962182-A
Country	US
Kind code	B2
Filing date	Dec 8, 2015
Priority date	Jul 7, 2015
Publication date	Aug 7, 2018
Grant date	Aug 7, 2018

Abstract

A microelectromechanical microphone has a stationary region or another type of mechanically supported region that can mitigate or avoid mechanical instabilities in the microelectromechanical microphone. The stationary region can be formed in a diaphragm of the microelectromechanical microphone by rigidly attaching, via a rigid dielectric member, an inner portion of the diaphragm to a backplate of the microelectromechanical microphone. The rigid dielectric member can extend between the backplate and the diaphragm. In certain embodiments, the dielectric member can be hollow, forming a shell that is centrosymmetric or has another type of symmetry. In other embodiments, the dielectric member can define a core-shell structure, where an outer shell of a first dielectric material defines an inner opening filled with a second dielectric material. Multiple dielectric members can rigidly attach the diaphragm to the backplate. An extended dielectric member can rigidly attach a non-planar diaphragm to a backplate.

First claim

What is claimed is:

1. A microelectromechanical microphone, comprising:
a stationary plate comprising multiple openings; and
a movable plate comprising an outer portion and an inner opening that is substantially centered at a geometric center of the movable plate, wherein the movable plate is rigidly attached, via a hollow dielectric member comprising a circular region corresponding to the inner opening and extending from a first surface of the stationary plate to a second surface of the movable plate, to the stationary plate in a vicinity of the inner opening to facilitate a reduction in buckling instability, wherein the hollow dielectric member comprises a substantially centrosymmetric shell comprising a thickness and comprising a dielectric cross-section, and wherein a ratio between a width of the dielectric cross-section and the thickness is in a range from about 3 to about 300.

2. The microelectromechanical microphone of claim 1 , wherein the stationary plate comprises silicon, and wherein the movable plate comprises silicon.

3. The microelectromechanical microphone of claim 1 , wherein each of the thickness and the width of the dielectric cross-section of the substantially centrosymmetric shell is based at least on a first material that forms the movable plate and a second material that forms the hollow dielectric member.

4. The microelectromechanical microphone of claim 1 , wherein the outer portion comprises a first cross-section, and wherein the opening comprises a second cross-section.

5. The microelectromechanical microphone of claim 4 , wherein the first cross-section is one of a first octagonal cross-section or a first circular cross-section, and wherein the second cross-section is one of a second octagonal cross-section or a second circular cross-section.

6. The microelectromechanical microphone of claim 5 , wherein the ratio is a first ratio, and wherein a second ratio between a first radius of the first circular cross-section and a second radius of the second circular cross-section ranges from about 2 to about 10.

7. The microelectromechanical microphone of claim 1 , wherein the dielectric cross-section comprises one of a circular cross-section, an oval cross-section, a square cross-section, a pentagonal cross-section, a hexagonal cross-section, a heptagonal cross-section, an octagonal cross-section, or a decagonal cross-section.

8. The microelectromechanical microphone of claim 1 , wherein the dielectric cross-section comprises one of a first cross-section comprising a polygonal perimeter or a second cross-section comprising a non-polygonal perimeter.

9. The microelectromechanical microphone of claim 1 , wherein the hollow dielectric member is a first dielectric member, wherein the movable plate is mechanically coupled to a layer proximate to the outer portion, and wherein a second dielectric member is attached to the stationary plate and overlays the layer.

10. The microelectromechanical microphone of claim 1 , wherein the hollow dielectric member is a first dielectric member, wherein the movable plate is mechanically coupled to a layer proximate to the outer portion, and wherein the layer overlays a second dielectric member that is attached to the stationary plate.

11. The microelectromechanical microphone of claim 10 , wherein the outer portion forms an interface with the layer.

12. The microelectromechanical microphone of claim 10 , wherein the outer portion is flexibly coupled to the layer.

13. The microelectromechanical microphone of claim 1 , wherein the stationary plate comprises one of amorphous silicon; polycrystalline silicon; crystalline silicon; germanium; an alloy of silicon and germanium; a compound containing silicon, germanium, and oxygen; a III-V semiconductor; a II-VI semiconductor; a dielectric material; or a combination of two or more of the foregoing.

14. The microelectromechanical microphone of claim 1 , wherein the movable plate comprises one of amorphous silicon; polycrystalline silicon; crystalline silicon; germanium; an alloy of silicon and germanium; a compound containing silicon, germanium, and oxygen; a III-V semiconductor; a II-VI semiconductor; a dielectric material; or a combination of two or more of the foregoing.

15. The microelectromechanical microphone of claim 1 , wherein the hollow dielectric member comprises one of silicon dioxide or silicon nitride.

16. A microelectromechanical microphone, comprising:
a stationary plate comprising multiple openings; and
a movable plate comprising an outer portion and an inner opening substantially centered at a geometric center of the movable plate, wherein the movable plate is mechanically coupled to the stationary plate via hollow dielectric members extending from a first surface of the stationary plate to a second surface of the movable plate in a vicinity of a geometrical center of the movable plate to facilitate a reduction in buckling instability, wherein the hollow dielectric members comprise respective substantially centrosymmetric shells, wherein a hollow dielectric member of the hollow dielectric members comprises a thickness and a cross-section, and wherein a ratio between a width of the cross-section and the thickness is in a range from about 3 to about 300.

17. The microelectromechanical microphone of claim 16 , wherein the outer portion comprises a circular cross-section, and wherein the hollow dielectric members are disposed in a circular arrangement.

18. The microelectromechanical microphone of claim 16 , wherein the thickness is based at least on a first material that forms the movable plate and a second material that forms the hollow dielectric member.

19. A microelectromechanical microphone, comprising:
a stationary plate comprising multiple openings; and
a movable plate rigidly attached to the stationary plate via a hollow dielectric member extending from a surface of the stationary plate to a surface of the movable plate in a vicinity of a geometric center of the movable plate to facilitate a reduction in collapse of an outer portion of the movable plate, wherein the hollow dielectric member comprises a core-shell structure comprising a shell of a dielectric material and a hollow core that is bounded by the shell, and wherein a ratio between a width of a cross-section of the hollow core and a thickness of the dielectric material is in a range from about 3 to about 300.

20. The microelectromechanical microphone of claim 19 , wherein the shell of the dielectric material is substantially centrosymmetric.

21. The microelectromechanical microphone of claim 20 , wherein the width is a first width, wherein the cross-section is a first cross section, wherein the movable plate comprises an outer portion having a second cross-section, and wherein a ratio between a second width of the second cross-section and the first width of the cross-section is less than about 10.

22. The microelectromechanical microphone of claim 20 , wherein each of the thickness of the dielectric material and the width of the cross-section of the core-shell structure is based at least on a first material that forms the movable plate and a second material that forms the hollow dielectric member.

23. A device, comprising:
a microelectromechanical microphone comprising a substrate comprising a first opening configured to receive an acoustic wave, a stationary plate mechanically coupled to the substrate and comprising multiple openings, and a movable plate comprising an outer portion and a second op

Assignees

• Invensense Inc

Inventors

• Berger Renata Melamud
• Bharatan Sushil
• Chen Thomas

Classifications

• H04R1/04

  Structural association of microphone with electric circuitry therefor (in electric hearing aids H04R25/00) · CPC title

• H04R19/005

  using semiconductor materials · CPC title

• H04R19/04

  Microphones (H04R19/01 takes precedence) · CPC title

• H04R7/24

  Tensioning by means acting directly on free portions of diaphragm or cone · CPC title

• H04R7/20 Primary

  Securing diaphragm or cone resiliently to support by flexible material, springs, cords, or strands · CPC title