Resin composition for element encapsulation for organic electronic devices, resin sheet for element encapsulation for organic electronic devices, organic electroluminescent element, and image display device

Patent metadata

Field	Value
Publication number	US-10043996-B2
Application number	US-201514868088-A
Country	US
Kind code	B2
Filing date	Sep 28, 2015
Priority date	Mar 29, 2013
Publication date	Aug 7, 2018
Grant date	Aug 7, 2018

Abstract

Provided are a resin composition for element encapsulation for organic electronic devices which is transparent, has excellent flexibility, water vapor barrier properties, and adhesive force, and can suppress the generation of dark spots, a resin sheet for element encapsulation for organic electronic devices, an organic electroluminescent element, and an image display device. This adhesive resin composition for element encapsulation for organic electronic devices is used to seal an element for organic electronic devices, and is characterized by containing a diene polymer and a softening agent, in which the content of the softening agent is from 5% by mass to 30% by mass of the total mass.

First claim

The invention claimed is:

1. An adhesive resin composition comprising:
a diene polymer,
a hydrogenated cyclic olefin compound, and
a softening agent,
wherein:
a content of the softening agent is from 5% by mass to 30% by mass of the total mass of the resin composition,
a content of the hydrogenated cyclic olefin compound is from 50% by mass to 75% by mass of the total mass of the resin composition,
the softening agent comprises a saturated hydrocarbon at a ratio of 80% or more of a repeating unit of the softening agent structure and a number average molecular weight of the softening agent is from 300 to 3,000,
the diene polymer is at least one selected from styrene-butadiene copolymers and hydrides thereof, styrene-isoprene copolymers and hydrides thereof, styrene-butadiene-styrene block copolymers and hydrides thereof, and styrene-isoprene-styrene block copolymers and hydrides thereof, and
wherein an average value of light transmittance of said adhesive resin composition in a wavelength region of 400 nm to 800 nm at a thickness of 0.1 mm is 85% or more.

2. The resin composition according to claim 1 , wherein the compound containing a saturated hydrocarbon at a ratio of 80% or more in a repeating unit is a compound containing an isobutylene skeleton as a main component.

3. The resin composition according to claim 2 , wherein the compound containing an isobutylene skeleton as a main component is polybutene.

4. The resin composition according to claim 1 , wherein the hydrogenated cyclic olefin compound is a hydrogenated petroleum resin.

5. The resin composition according to claim 4 , wherein the hydrogenated petroleum resin includes a dicyclopentadiene structure.

6. The resin composition to claim 1 , wherein the diene polymer is at least one selected from styrene-butadiene-styrene block copolymers and hydrides thereof, and styrene-isoprene-styrene block copolymers and hydrides thereof.

7. The resin composition according to claim 1 , wherein a content of the diene polymer is from 10 to 35% by mass of the total mass of the resin composition.

8. The resin composition according to claim 1 , wherein all of the diene polymer, the cyclic olefin compound, and the softening agent are hydrogenated.

9. The resin composition according to claim 1 , further comprising a desiccant.

10. A resin sheet comprising at least a sealing layer formed by the resin composition according to claim 1 .

11. An organic electroluminescent element sealed by the resin composition according to claim 1 .

12. An image display device comprising the organic electroluminescent element according to claim 11 .

13. The resin composition according to claim 1 , wherein:
the diene polymer is at least one selected from styrene-butadiene-styrene block copolymers and hydrides thereof, and styrene-isoprene-styrene block copolymers and hydrides thereof;
the hydrogenated cyclic olefin compound comprises a dicyclopentadiene structure; and
the softening agent is polybutene.

14. The resin composition according to claim 13 , wherein a content of the diene polymer is from 10 to 35% by mass of the total mass of the resin composition.

15. The resin composition according to claim 1 , wherein the average value of light transmittance of said adhesive resin composition in a wavelength region of 400 nm to 800 nm at a thickness of 0.1 mm is 85%-92%.

16. The resin composition according to claim 1 , wherein the diene polymer is at least one selected from styrene-butadiene copolymers and hydrides thereof, styrene-isoprene copolymers and hydrides thereof, styrene-butadiene-styrene block copolymers and hydrides thereof, and styrene-isoprene-styrene block copolymers and hydrides thereof.

17. The resin composition according to claim 1 , wherein the diene polymer is at least one selected from styrene-butadiene copolymers and hydrides thereof, and styrene-isoprene copolymers and hydrides thereof.

Assignees

• Furukawa Electric Co Ltd

Inventors

• Aoyama Masami
• Mieda Tetsuya
• Saito Keiji
• Ishiguro Kunihiko
• Nakamura Toshimitsu
• Mihara Naoaki
• Asanuma Takumi

Classifications

• C08G2261/3324

  derived from norbornene · CPC title

• C08G2261/418

  Ring opening metathesis polymerisation [ROMP] · CPC title

• H01L51/005

  Electricity · mapped topic

• C08L65/00 Primary

  Compositions of macromolecular compounds obtained by reactions forming a carbon-to-carbon link in the main chain (C08L7/00 - C08L57/00, C08L61/00 take precedence); Compositions of derivatives of such polymers · CPC title

• H01L51/5253 Primary

  Electricity · mapped topic