Semiconductor packages including an adhesive pattern

Patent metadata

Field	Value
Publication number	US-10043789-B2
Application number	US-201715454253-A
Country	US
Kind code	B2
Filing date	Mar 9, 2017
Priority date	Aug 26, 2016
Publication date	Aug 7, 2018
Grant date	Aug 7, 2018

Abstract

A semiconductor package is disclosed. The semiconductor package comprises a lower package including a first substrate and a semiconductor chip on the first substrate, a second substrate on the lower package, interconnect terminals between the first substrate and the second substrate, and an adhesive pattern between a top surface of the semiconductor chip and a bottom surface of the second substrate. The adhesive pattern extends along an edge of the semiconductor chip. The adhesive pattern exposes a top surface of a central zone of the semiconductor chip.

First claim

What is claimed is:

1. A semiconductor package, comprising:
a lower package including a first substrate and a semiconductor chip on the first substrate;
a second substrate on the lower package;
interconnect terminals between the first substrate and the second substrate; and
an adhesive pattern between a top surface of the semiconductor chip and a bottom surface of the second substrate,
the adhesive pattern extending along an edge of the semiconductor chip, and
the adhesive pattern exposing a top surface of a central zone of the semiconductor chip,

wherein the lower package further includes a molding layer contacting sidewalls of the semiconductor chip, and
the adhesive pattern contacts a top surface of the molding layer.

2. The semiconductor package of claim 1 , wherein the adhesive pattern has a closed-loop shape or a ring shape.

3. A semiconductor package, comprising:
a first substrate;
a first semiconductor chip on a top surface of the first substrate;
a plurality of interconnect terminals on the top surface of the first substrate, the plurality of interconnect terminals arranged around the first semiconductor chip in a plan view;
an adhesive pattern on a top surface of the first semiconductor chip, the adhesive pattern extending along on at least part of an edge of the first semiconductor chip such that the adhesive pattern does not cover a central portion of the top surface of the semiconductor chip;
a second substrate on top of the adhesive pattern and the plurality of interconnect terminals; and
a heat dissipation structure on the central portion of the top surface of the first semiconductor chip.

4. The semiconductor package of claim 3 , comprising:
a first package, wherein
the first package includes the first substrate and the first semiconductor chip on the first substrate,
the second substrate on the first semiconductor chip,
the interconnect terminals are between the first substrate and the second substrate,
the adhesive pattern is one adhesive pattern among adhesive patterns,
the adhesive patterns are between the top surface of the semiconductor chip and a bottom surface of the second substrate,
the adhesive patterns face each other,
each of the adhesive patterns includes a first portion and a second portion,
the first portion extends in a first direction along an edge of the semiconductor chip, and
the second portion extends in a second direction from an end of the first portion along the edge of the semiconductor chip, and
the second direction crosses the first direction.

5. The semiconductor package of claim 4 , wherein a length of the first portion in each of the adhesive patterns is the same as a length of the second portion in each of the adhesive patterns.

6. The semiconductor package of claim 4 , wherein, a length of the first portion in each of the adhesive patterns is different than a length of the second portion of each in the adhesive patterns.

7. The semiconductor package of claim 4 , wherein
each of the adhesive patterns further includes a third portion, and
the third portion extends in the second direction from an opposite end of the first portion along the edge of the semiconductor chip.

8. The semiconductor package of claim 4 , wherein the adhesive patterns expose a top surface of a central zone of the first semiconductor chip.

9. The semiconductor package of claim 4 , wherein
the first semiconductor chip includes corners, and
the adhesive patterns are adjacent to each of the corners of the first semiconductor chip.

10. The semiconductor package of claim 4 , wherein the adhesive patterns are point-symmetric about a center of the first semiconductor chip.

11. The semiconductor package of claim 4 , wherein the adhesive patterns are positioned line-symmetrically about an axis passing between the adhesive patterns.

12. The semiconductor package of claim 3 , wherein the adhesive pattern is a contiguous layer extending along the edge of the first semiconductor chip.

13. The semiconductor package of claim 3 , wherein
the adhesive pattern at least partially surrounds the heat dissipation structure in the plan view.

14. The semiconductor package of claim 3 , wherein the adhesive pattern includes a first portion and a second portion that are separated from each other.

15. The semiconductor package of claim 3 , further comprising:
a molding layer on the first substrate, wherein
the molding layer defines openings,
the interconnect terminals extend through the openings to electrically connect the first substrate to the second substrate.

16. A semiconductor package, comprising:
a lower package including a first substrate and a semiconductor chip on the first substrate;
a second substrate on the lower package;
interconnect terminals between the first substrate and the second substrate; and
an adhesive pattern between a top surface of the semiconductor chip and a bottom surface of the second substrate, the adhesive pattern extending along an edge of the semiconductor chip, and the adhesive pattern exposing a top surface of a central zone of the semiconductor chip; and at least one of
a heat dissipation structure on the top surface of the central zone of the semiconductor chip, or
an upper package on the second substrate, wherein the upper package includes a third substrate, second interconnect terminals between the third substrate and the second substrate, and a second semiconductor chip on the third substrate.

17. The semiconductor package of claim 16 , wherein the semiconductor package includes the heat dissipation structure on the top surface of the central zone of the semiconductor chip.

18. The semiconductor package of claim 16 , wherein the semiconductor package includes the second semiconductor chip on the second substrate.

19. The semiconductor package of claim 18 , wherein the semiconductor chip is a semiconductor logic chip and the second semiconductor chip is a semiconductor memory chip.

20. The semiconductor package of claim 16 , wherein the semiconductor package includes the upper package on the second substrate, and
the upper package includes, the third substrate, the second interconnect terminals between the third substrate and the second substrate, and the second semiconductor chip on the third substrate.

Assignees

• Kim Youngbae
• Samsung Electronics Co Ltd

Inventors

• Kim Youngbae

Classifications

• H10W74/00

  Encapsulations, e.g. protective coatings · CPC title

• H10W90/722 Primary

  between stacked chips · CPC title

• H10W90/288

  characterised by arrangements for thermal management of the stacked chips · CPC title

• H10W70/60

  Insulating or insulated package substrates; Interposers; Redistribution layers (leadframes H10W70/40) · CPC title

• H10W72/884

  Die-attach connectors and bond wires · CPC title