Heat-insulation material and production method thereof

US10042092B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-10042092-B2
Application numberUS-201715642902-A
CountryUS
Kind codeB2
Filing dateJul 6, 2017
Priority dateJul 22, 2016
Publication dateAug 7, 2018
Grant dateAug 7, 2018

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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Abstract

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A heat-insulation material does not cause deterioration in heat-insulation performance and any loss of components included therein, and possesses an excellent radiation-preventing function. The heat-insulation material includes: a first heat-insulation layer that includes a first silica xerogel and a first radiation-preventing material; and a third heat-insulation layer that includes a third silica xerogel and second fibers, wherein the first heat-insulation layer and the third heat-insulation layer are layered. An electronic device includes the heat-insulation material. Yet further disclosed is a method for producing the heat-insulation material.

First claim

Opening claim text (preview).

What is claimed is: 1. A heat-insulation material, comprising: a first heat-insulation layer that includes a first silica xerogel and a first radiation-preventing material; and a third heat-insulation layer that includes a third silica xerogel and second fibers, wherein the first heat-insulation layer and the third heat-insulation layer are layered, wherein the first silica xerogel and the third silica xerogel have a mean pore size of about 10 nm to about 55 nm, and a pore volume of about 3.0 cc/g to about 10 cc/g. 2. A heat-insulation material, comprising: a first heat-insulation layer that includes a first silica xerogel and a first radiation-preventing material; a third heat-insulation layer that includes a third silica xerogel and second fibers, wherein the first heat-insulation layer and the third heat-insulation layer are layered; and a second heat-insulation layer that includes a second xerogel, a second radiation-preventing material, and first fibers, wherein the second heat-insulation layer is placed between the first heat-insulation layer and the third heat-insulation layer. 3. The heat-insulation material according to claim 2 , wherein the first heat-insulation layer does not include the same type of fibers as the first fibers. 4. The heat-insulation material according to claim 2 , wherein the first heat-insulation layer does not include any fibers. 5. The heat-insulation material according to claim 2 , wherein the first fiber and the second fiber are the same type of fibers. 6. The heat-insulation material according to claim 2 , wherein the first radiation-preventing material and the second radiation-preventing material are the same type of radiation-preventing materials. 7. The heat-insulation material according to claim 2 , wherein the first heat-insulation layer and the second heat-insulation layer are each thinner than the third heat-insulation layer. 8. The heat-insulation material according to claim 2 , wherein the first heat-insulation layer, the second heat-insulation layer, and the third heat-insulation layer become thicker in this order. 9. An electronic device, comprising: a circuit substrate; a heat-generating component that is placed on the circuit substrate; and the heat-insulation material according to claim 1 , wherein the heat-insulation material is placed such that the first heat-insulation layer faces the heat-generating component. 10. A method for producing a heat-insulation material, comprising: (i) converting water glass or a silicic acid solution to a sol (a), and, providing a sol (b) that is prepared from the sol (a) and that includes a radiation-preventing material (p), and a sol (c) that is prepared from the sol (a) and that does not include the radiation-preventing material (p); (ii) causing the sol (b) and the sol (c) to penetrate into at least one piece of unwoven fabrics; (iii) converting the sol (b) and the sol (c) into gels; (iv) aging the gels; (v) soaking the gels in an acidic aqueous solution; (vi) hydrophobizing the gels; and (vii) drying the gels, wherein the gels have a mean pore size of about 10 nm to about 55 nm, and a pore volume of about 3.0 cc/g to about 10 cc/g.

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What does patent US10042092B2 cover?
A heat-insulation material does not cause deterioration in heat-insulation performance and any loss of components included therein, and possesses an excellent radiation-preventing function. The heat-insulation material includes: a first heat-insulation layer that includes a first silica xerogel and a first radiation-preventing material; and a third heat-insulation layer that includes a third si…
Who is the assignee on this patent?
Panasonic Ip Man Co Ltd
What technology area does this patent fall under?
Primary CPC classification B32B5/022. Mapped technology areas include Operations & Transport.
When was this patent published?
Publication date Tue Aug 07 2018 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 1 related publication on this page (citations in our corpus or others sharing the same primary CPC).