Pump having inlet reservoir with vapor-layer standpipe

US10041484B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-10041484-B2
Application numberUS-201514610669-A
CountryUS
Kind codeB2
Filing dateJan 30, 2015
Priority dateJan 30, 2015
Publication dateAug 7, 2018
Grant dateAug 7, 2018

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

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  7. Citations and related patents

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Abstract

Official abstract text for this publication.

A pump is disclosed having a manifold with an inlet, a pressure outlet, and a return outlet. The pump may also have a jacket connected to an end of the manifold to create an enclosure that is in fluid communication with the inlet of the manifold, and at least one pumping mechanism extending from the manifold into the jacket. The at least one pumping mechanism may have an inlet open to the enclosure and an outlet in communication with the pressure outlet of the manifold. The pump may further have a standpipe extending from the manifold into the enclosure. The standpipe may be in communication with the return outlet of the manifold.

First claim

Opening claim text (preview).

What is claimed is: 1. A pump, comprising: a manifold having an inlet, a pressure outlet, and a return outlet; a jacket connected to an end of the manifold to create an enclosure that is in fluid communication with the inlet of the manifold; at least one pumping mechanism extending from the manifold into the jacket and having an inlet open to the enclosure and an outlet in communication with the pressure outlet of the manifold, wherein the at least one pumping mechanism includes: a push rod configured to be driven by a load plate, a lower end of the push rod extending through an opening in the manifold; a barrel having a base end connected to the manifold, and a distal end; a plunger connected to the lower end of the push rod and slidingly disposed within the barrel; and a head connected to the distal end of the barrel; and a standpipe extending from the manifold into the enclosure and being in communication with the return outlet of the manifold, wherein the standpipe extends to an axial location between the base end and the distal end of the barrel; the plunger has a high-pressure end face and an opposing low-pressure end face; the plunger reciprocates within the barrel between a bottom-dead-center position and a top-dead-center position; and the standpipe extends to an axial location corresponding with the opposing low-pressure end face of the plunger when the plunger is located at about the bottom-dead-center position. 2. The pump of claim 1 , wherein the at least one pumping mechanism includes multiple pumping mechanisms. 3. The pump of claim 1 , wherein the head includes an inlet and an outlet, both in communication with the distal end of the barrel. 4. The pump of claim 3 , further including: a first check valve located in the outlet of the head; and a second check valve located in the inlet of the head. 5. The pump of claim 3 , wherein the barrel includes a high-pressure passage extending axially from the distal end to the base end. 6. The pump of claim 1 , wherein the standpipe terminates short of an axial operational range of the plunger. 7. The pump of claim 1 , wherein the standpipe is configured to: direct only vapor out of the enclosure when a vapor layer around the base end of the barrel has a thickness greater than a desired thickness; and direct only liquid out of the enclosure when the thickness of the vapor layer is less than the desired thickness. 8. A pump, comprising: a body; a manifold having an inlet, a pressure outlet, and a return outlet; an enclosure located at an end of the body; a pumping mechanism extending into the enclosure and partially submerged in liquid during operation, wherein a vapor layer is maintained around a base of the pumping mechanism during operation, the pumping mechanism including: a push rod configured to be driven by a load plate rotatably mounted in the body, a lower end of the push rod extending through an opening in the manifold and guided by the manifold; a barrel having a base end connected to the manifold, and a distal end; a plunger connected to the lower end of the push rod and slidingly disposed within the barrel; and a head connected to the distal end of the barrel; and a standpipe extending from the manifold into the enclosure and being in communication with the return outlet of the manifold, wherein the standpipe extends to an axial location between the base end and the distal end of the barrel; the plunger has a high-pressure end face and an opposing low-pressure end face; the plunger reciprocates within the barrel between a bottom-dead-center position and a top-dead-center position; and the standpipe extends to an axial location corresponding with the opposing low-pressure end face of the plunger when the plunger is located at about the bottom-dead-center position. 9. The pump of claim 8 , wherein: the pumping mechanism is a first pumping mechanism; and the pump further includes: a second pumping mechanism extending into the enclosure and partially submerged in liquid during operation.

Assignees

Inventors

Classifications

  • F04B23/02Primary

    having reservoirs · CPC title

  • only the pump-part being immersed, the driving-part being outside the reservoir · CPC title

  • the liquids having low boiling points · CPC title

  • Casings; Cylinders; Cylinder liners or heads; Fluid connections · CPC title

  • Pistons, piston-rods or piston-rod connections · CPC title

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Frequently asked questions

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What does patent US10041484B2 cover?
A pump is disclosed having a manifold with an inlet, a pressure outlet, and a return outlet. The pump may also have a jacket connected to an end of the manifold to create an enclosure that is in fluid communication with the inlet of the manifold, and at least one pumping mechanism extending from the manifold into the jacket. The at least one pumping mechanism may have an inlet open to the enclo…
Who is the assignee on this patent?
Caterpillar Inc
What technology area does this patent fall under?
Primary CPC classification F04B23/02. Mapped technology areas include Mechanical Engineering.
When was this patent published?
Publication date Tue Aug 07 2018 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).