Moulding compound based on a partially aromatic copolyamide

Patent metadata

Field	Value
Publication number	US-10040938-B2
Application number	US-201414489612-A
Country	US
Kind code	B2
Filing date	Sep 18, 2014
Priority date	Sep 20, 2013
Publication date	Aug 7, 2018
Grant date	Aug 7, 2018

Abstract

A moulding composition contains at least 40 wt % of components a) and b). Based on the sum of components a) and b), there are 60-99 wt % of component a) and 40-1 wt % of component b). Component a) is a partially aromatic copolyamide containing, as polymerized monomer units, 30-90 mol % of a combination of hexamethylenediamine and terephthalic acid and 70-10 mol % of a combination of hexamethylenediamine and a linear aliphatic dicarboxylic acid having 8-19 C atoms. Component b) is an olefinic copolymer containing, as polymerized monomer units, i) 35-94.9 wt % of ethene-based monomer units, ii) 5-65 wt % of monomer units based on a 1-alkene having 4-8 C atoms, iii) 0-10 wt % of monomer units based on an olefin different from i) and ii), and iv) 0.1-2.5 wt % of monomer units based on an aliphatically unsaturated dicarboxylic acid anhydride, where the sum of wt % of i), ii), iii) and iv) is 100%.

First claim

The invention claimed is:

1. A moulding composition, comprising at least 40 wt. % of the following components:
a) 60 to 99 parts by wt. of a partially aromatic copolyamide which comprises as polymerized monomer units:
I. 40 to 90 mol % of a combination of hexamethylenediamine and terephthalic acid; and
II. 60 to 10 mol % of a combination of hexamethylenediamine and a linear aliphatic dicarboxylic acid with 8 to 19 C atoms;

wherein the mol % values relate to a sum of I and II and wherein at most 20% of hexamethylenediamine is optionally replaced by an equivalent quantity of another diamine and/or wherein at most 20% of terephthalic acid is optionally replaced by an equivalent quantity of another aromatic dicarboxylic acid and/or 1,4-cyclohexanedicarboxylic acid and/or Wherein at most 20% of the repeating units of hexamethylenediamine and the linear aliphatic dicarboxylic acid are optionally replaced respectively by an equivalent number of units of a copolymerized lactam or ω-aminocarboxylic acid with 6 to 12 C atoms; and
b) 40 to 1 parts by wt. of an olefinic copolymer comprising as polymerized monomer units:
i) 35 to 94.9 wt. % of ethene-based monomer units,
ii) 5 to 65 wt. % of monomer units based on 1-butene,
iii) 0 to 10 wt. % of monomer units based on an olefin different from i) and ii), and
iv) 0.1 to 2.5 wt. % of monomer units based on an aliphatically unsaturated dicarboxylic acid anhydride,

wherein a sum of the wt. % values of i), iii) and iv) is 100%,
wherein a sum of the parts by wt. of a) and b) is 100, and
wherein polyamide fraction of the moulding composition contains less than 3 wt. % of aliphatic polyamide.

2. The moulding composition according to claim 1 ,
wherein a crystallite melting point T m of the copolyamide a) is from 240° C. to 300° C. as determined according to ISO 11357, measured during a 2nd heating stage.

3. The moulding composition according to claim 1 ,
wherein a ratio of amino end groups to a sum of amino and carboxyl end groups of the partially aromatic copolyamide is from 0.3 to 0.7.

4. The moulding composition according to claim 1 ,
wherein the olefinic copolymer b) comprises the monomer unit (iii), which does not comprise an unconjugated diene.

5. The moulding composition according to claim 1 ,
wherein the olefinic copolymer b) comprises the monomer unit (iii), which does not comprise styrene or propene.

6. The moulding composition according to claim 1 , wherein the olefinic copolymer b) consists of:
i) 35 to 94.9 wt. % of the ethene-based monomer units,
ii) 5 to 65 wt. % of the monomer units based on 1-butene, and
iv) 0.1 to 2.5 wt. % of the monomer units based on an aliphatically unsaturated dicarboxylic acid anhydride.

7. The moulding composition according to claim 1 , further comprising
0.01 to 60 wt. % of an additive selected from the group consisting of a stabilizer, a polymer different from a) and b), a fibrous reinforcing material, a filler, a plasticizer, a pigment, a colorant, a flame retardant and a processing aid.

8. The moulding composition according to claim 7 ,
wherein the moulding composition comprises a stabilizer which is a copper-containing stabilizer.

9. The moulding composition according to claim 8 , wherein the copper-containing stabilizer is a copper(I) salt in combination with an alkali metal halide.

10. The moulding composition according to claim 9 , wherein the copper(I) salt is selected from the group consisting of copper acetate, copper stearate, copper acetylacetonate, and a copper halide.

11. The moulding composition according to claim 9 , wherein the alkali metal halide is selected from the group consisting of lithium iodide, sodium iodide, potassium iodide, lithium bromide, sodium bromide, and potassium bromide.

12. The moulding composition according to claim 8 , wherein a copper content of the moulding composition is from 20 to 2000 ppm.

13. The moulding composition according to claim 7 ,
wherein the moulding composition comprises a stabilizer which is an oxidation stabilizer.

14. A moulded article, comprising
the moulding composition according to claim 1 .

15. The moulded article according to claim 14 , which is a monolayer pipe or a multilayer pipe.

16. The moulded article according to claim 14 , which is a monolayer container or a multilayer container.

Assignees

• Nitsche Jasmin
• Haeger Harald
• Geerkens Sebastian
• Baumann Franz Erich
• Beuth Reinhard
• Evonik Degussa Gmbh

Inventors

• Nitsche Jasmin
• Haeger Harald
• Geerkens Sebastian
• Baumann Franz-Erich
• Beuth Reinhard

Classifications

• C08L2203/18

  used for pipes · CPC title

• C08L77/06 Primary

  Polyamides derived from polyamines and polycarboxylic acids (C08L77/10 takes precedence) · CPC title

• C08K5/18

  with aromatically bound amino groups · CPC title

• Y10T428/1352

  Polymer or resin containing [i.e., natural or synthetic] · CPC title

• Y10T428/1393

  Multilayer [continuous layer] · CPC title