Flame retardant filler

Patent metadata

Field	Value
Publication number	US-10040807-B2
Application number	US-201715831428-A
Country	US
Kind code	B2
Filing date	Dec 5, 2017
Priority date	May 6, 2011
Publication date	Aug 7, 2018
Grant date	Aug 7, 2018

Abstract

A flame retardant filler having brominated silica particles, for example, imparts flame retardancy to manufactured articles such as printed circuit boards (PCBs), connectors, and other articles of manufacture that employ thermosetting plastics or thermoplastics. In this example, brominated silica particles serve both as a filler for rheology control (viscosity, flow, etc.) and a flame retardant. In an exemplary application, a PCB laminate stack-up includes conductive planes separated from each other by a dielectric material that includes a flame retardant filler comprised of brominated silica particles. In an exemplary method of synthesizing the brominated silica particles, a monomer having a brominated aromatic functional group is reacted with functionalized silica particles (e.g., isocyanate, vinyl, amine, or epoxy functionalized silica particles). Alternatively, a monomer having a brominated aromatic functional group may be reacted with a silane to produce a brominated alkoxysilane monomer, which is then reacted with the surface of silica particles.

First claim

What is claimed is:

1. An electronic circuit board, comprising:
a laminate stack-up that includes a plurality of conductive planes separated from each other by a dielectric material, wherein the dielectric material includes a flame retardant filler having halogenated silica particles, and wherein the halogenated silica particles include a halogenated aromatic functional group.

2. The electronic circuit board as recited in claim 1 , wherein the halogenated silica particles include particles represented by the following formula:

wherein a is an integer of 1 to 3, wherein b is an integer of 1 to 2, and wherein X 1 and X 2 is either an isocyanate group NCO or a group represented by the formula:

wherein a is an integer of 1 to 3, and wherein b is an integer of 1 to 2.

3. The electronic circuit board as recited in claim 1 , wherein the halogenated silica particles include particles represented by the following formula:

wherein a is an integer of 1 to 3, wherein b is an integer of 1 to 2, and wherein X 1 and X 2 is either a hydrogen atom or a group represented by the formula:

wherein a is an integer of 1 to 3, and wherein b is an integer of 1 to 2.

4. The electronic circuit board as recited in claim 1 , wherein the halogenated silica particles include particles represented by the following formula:

wherein a is an integer of 1 to 3, wherein b is an integer of 1 to 2, and wherein X 1 and X 2 is either a vinyl group or a group represented by the formula:

wherein a is an integer of 1 to 3, and wherein b is an integer of 1 to 2.

5. The electronic circuit board as recited in claim 1 , wherein the halogenated silica particles include particles made by a method comprising:
providing functionalized silica particles;
halogenating the functionalized silica particles to produce halogenated silica particles, wherein the step of halogenating the functionalized silica particles includes the step of reacting a monomer having a brominated aromatic functional group and the functionalized silica particles, wherein the monomer is selected from a group of monomers represented by the following formulas:

wherein a is an integer of 1 to 3, and wherein b is an integer of 1 to 2,

wherein a is an integer of 1 to 3, and wherein b is an integer of 1 to 2,

wherein a is an integer of 1 to 3, and wherein b is an integer of 1 to 2,

and combinations thereof.

6. The electronic circuit board as recited in claim 1 , wherein the dielectric material further includes a varnish coating applied to a glass fiber substrate, and wherein the halogenated silica particles are incorporated into the varnish coating to impart flame retardancy.

7. An electronic circuit board, comprising:
a laminate stack-up that includes a plurality of conductive planes separated from each other by a dielectric material, wherein the dielectric material includes a glass fiber substrate, a varnish coating applied to the glass fiber substrate, and a flame retardant filler having halogenated silica particles incorporated into the varnish coating to impart flame retardancy.

8. The electronic circuit board as recited in claim 7 , wherein the halogenated silica particles include a halogenated aromatic functional group.

9. The electronic circuit board as recited in claim 7 , wherein the halogenated silica particles include particles made by a method comprising:
providing functionalized silica particles;
halogenating the functionalized silica particles to produce halogenated silica particles, wherein the step of halogenating the functionalized silica particles includes the step of reacting a monomer having a brominated aromatic functional group and the functionalized silica particles, wherein the monomer is selected from a group of monomers represented by the following formulas:

wherein a is an integer of 1 to 3, and wherein b is an integer of 1 to 2,

wherein a is an integer of 1 to 3, and wherein b is an integer of 1 to 2,

and combinations thereof.

10. The electronic circuit board as recited in claim 9 , wherein the halogenated silica particles include particles represented by the following formula:

wherein a is an integer of 1 to 3, wherein b is an integer of 1 to 2, and wherein X 1 and X 2 is either an isocyanate group NCO or a group represented by the formula:

wherein a is an integer of 1 to 3, and wherein b is an integer of 1 to 2.

11. The electronic circuit board as recited in claim 9 , wherein the halogenated silica particles include particles represented by the following formula:

wherein a is an integer of 1 to 3, wherein b is an integer of 1 to 2, and wherein X 1 and X 2 is either a hydrogen atom or a group represented by the formula:

wherein a is an integer of 1 to 3, and wherein b is an integer of 1 to 2.

12. The electronic circuit board as recited in claim 9 , wherein the halogenated silica particles include particles represented by the following formula:

wherein a is an integer of 1 to 3, wherein b is an integer of 1 to 2, and wherein X 1 and X 2 is either a vinyl group or a group represented by the formula:

wherein a is an integer of 1 to 3, and wherein b is an integer of 1 to 2.

Assignees

• IBM

Inventors

• Boday Dylan J
• Kuczynski Joseph
• Meyer Iii Robert E

Classifications

• C07F7/081

  comprising at least one atom selected from the elements N, O, halogen, S, Se or Te · CPC title

• C08K3/016

  Flame-proofing or flame-retarding additives · CPC title

• H05K2201/012

  Flame-retardant; Preventing of inflammation · CPC title

• C07F7/0896

  Compounds with a Si-H linkage · CPC title

• C07F7/1804

  Compounds having Si-O-C linkages (Si-O-acyl linkages C07F7/1896) · CPC title