Microminiature chainmail interface between skin and a transcutaneous prosthetic device and a method of manufacture

Patent metadata

Field	Value
Publication number	US-10039651-B2
Application number	US-201614996040-A
Country	US
Kind code	B2
Filing date	Jan 14, 2016
Priority date	Jan 14, 2015
Publication date	Aug 7, 2018
Grant date	Aug 7, 2018

Abstract

The disclosure describes a direct skeletal attachment (DSA) device including a micro-miniature chainmail skin-to-DSA interface. The interface comprises various porous architectures for skin ingrowth and integration as barriers against pathogens. Failure of skin-to-DSA interfaces can occur due to mismatches in mechanical compliance between pliable skin and more rigid DSA interfaces. To address this problem, in embodiments disclosed herein is an interface having a gradient in mechanical compliance or link mobility, ranging from fully flexible, to less compliant, to rigid where it attaches to the main DSA body.

First claim

What is claimed is:

1. A direct skeletal attachment device comprising:
an intramedullary stem adapted to be inserted into a cavity of a bone;
a post adapted to interface with a prosthesis;
an interface positioned between the post and stem,
wherein the interface extends radially from a first end proximate the post and stem to a second end;
wherein the interface is rigid at the first end;
wherein the interface comprises a series of interconnected links forming a chainmail scaffolding.

2. The direct skeletal attachment of claim 1 , wherein an inner diameter of each link of the series of interconnected links increases from the first end to the second end.

3. The direct skeletal attachment of claim 1 , wherein a thickness of each link of the series of interconnected links decreases from the first end to the second end.

4. The direct skeletal attachment of claim 1 , wherein the chainmail scaffolding has a porosity gradient.

5. The direct skeletal attachment of claim 1 , wherein the chainmail scaffolding is fully dense near the stem and the post.

6. The direct skeletal attachment of claim 4 , wherein a plurality of pores remain above a minimum pore diameter within the porosity gradient.

7. The direct skeletal attachment of claim 1 , wherein the interface tapers from mechanically compliant at the second end to rigid at the first end.

8. The direct skeletal attachment of claim 1 , wherein the links are mobile at the second end and are immobile at the first end.

Assignees

• Univ Carnegie Mellon
• Carnegie Mellon Univ A Pennsylvania Non Profit Corporation

Inventors

• Weiss Lee E
• Fedder Gary K

Classifications

• B22F10/40

  Structures for supporting workpieces or articles during manufacture and removed afterwards · CPC title

• B22F10/62

  by chemical means · CPC title

• B22F10/28

  Powder bed fusion, e.g. selective laser melting [SLM] or electron beam melting [EBM] · CPC title

• A61F2002/30914

  Details of the mesh structure, e.g. disposition of the woven warp and weft wires · CPC title

• B33Y80/00

  Products made by additive manufacturing · CPC title