Fabrication of intra-structure conductive traces and interconnects for three-dimensional manufactured structures

Patent metadata

Field	Value
Publication number	US-10039195-B2
Application number	US-201514921868-A
Country	US
Kind code	B2
Filing date	Oct 23, 2015
Priority date	Oct 23, 2014
Publication date	Jul 31, 2018
Grant date	Jul 31, 2018

Abstract

A method for forming a three-dimensional object with at least one conductive trace comprises providing an intermediate structure that is generated (e.g., additively or subtractively generated) from a first material in accordance with a model design of the three-dimensional object. The intermediate structure may have at least one predefined location for the at least one conductive trace. The model design includes the at least one predefined location. Next, the at least one conductive trace may be generated adjacent to the at least one predefined location of the intermediate structure. The at least one conductive trace may be formed of a second material that has an electrical and/or thermal conductivity that is greater than the first material.

First claim

What is claimed is:

1. A method for forming a three-dimensional object with at least one conductive trace, comprising:
injecting a solution comprising a first material into an injection structure of an intermediate structure, the intermediate structure comprising at least one predefined location for at least one conductive trace, the intermediate structure made of a second material having an electrical and/or thermal conductivity that is less than the first material, the first material injected into the at least one predefined location of the intermediate structure via the injection structure to form the at least one conductive trace after the intermediate structure that includes the injection structure is additively formed thereby forming the three-dimensional object with the at least one conductive trace, the intermediate structure, and the injection structure;
removing the injection structure from the intermediate structure subsequent to the first material being injected into the at least one predefined location of the intermediate structure; and
curing the solution comprising the first material that was injected into the at least one predefined location of the intermediate structure.

2. The method of claim 1 , wherein the second material is a polymeric, ceramic, organic, composite, metallic, mineral or living material.

3. The method of claim 1 , wherein the first material is a metal, metal filled polymer or organic conductive material.

4. The method of claim 1 , wherein the solution is cured by directing an electrical current through the solution to generate Joule heating.

5. The method of claim 1 , wherein the at least one predefined location is a channel, and wherein the solution that includes the first material is injected in at least a portion of the channel.

6. The method of claim 1 , wherein the injection structure comprises an injection channel in fluid communication with the at least one predefined location, and the first material is injected to the at least one predefined location through the injection channel of the injection structure.

7. The method of claim 6 , further comprising using one or more sensors adjacent to the injection structure to monitor one or more injection parameters while injecting the solution.

8. The method of claim 7 , further comprising adjusting the one or more injection parameters while injection the solution.

9. The method of claim 6 , further comprising ejecting the solution using the injection structure.

10. The method of claim 1 , wherein the first material has an electrical conductivity that is greater than an electrical conductivity of the second material.

11. The method of claim 1 , wherein the at least one conductive trace comprises a plurality of conductive traces.

12. The method of claim 11 , wherein a given one of the plurality of conductive traces is electrically isolated from another one of said plurality of conductive traces.

13. The method of claim 11 , wherein each of said plurality of conductive traces includes a contact pad at an external surface of the intermediate structure for electrical and/or thermal connectivity.

14. The method of claim 1 , wherein the at least one conductive trace is within the intermediate structure, and the method further comprising exposing at least a portion of said at least one conductive trace.

15. The method of claim 1 , wherein a model design for the intermediate structure includes one or more structural constraints for the at least one predefined location.

16. The method of claim 1 , further comprising bringing an electrical circuit in electrical contact with the at least one conductive trace.

17. The method of claim 1 , wherein removing the injection structure comprises breaking the injection structure from the intermediate structure.

Assignees

• Facebook Inc

Inventors

• Elmieh Baback
• Palan Saurabh
• Crossen Rex Wenters
• Jais Alexandre

Classifications

• H05K2203/163

  Monitoring a manufacturing process · CPC title

• H05K1/111

  Pads for surface mounting, e.g. lay-out · CPC title

• H05K3/0005

  for designing circuits by computer · CPC title

• G05B2219/35134

  3-D cad-cam · CPC title

• H05K2201/0329

  Intrinsically conductive polymer [ICP]; Semiconductive polymer · CPC title