Differential temperature sensor

Patent metadata

Field	Value
Publication number	US-10038133-B2
Application number	US-201514975078-A
Country	US
Kind code	B2
Filing date	Dec 18, 2015
Priority date	Dec 19, 2014
Publication date	Jul 31, 2018
Grant date	Jul 31, 2018

Abstract

Sensor including a substrate, an assembly of thermoelectric layers including at least one first and one second junction of a thermocouple, at least one first and one second connection pads arranged to transfer heat respectively to each first and each second junction, a support member ( 2 ) of the substrate ( 3 ) intended to be connected to the hot source (Sc) and to the cold source (Sf), first and second metal connectors arranged to electrically connect the support member ( 2 ) respectively to each first and each second connection pad, the support member ( 2 ) including a thermal conductor configured to transfer heat from the hot source (Sc) to the first metal connector, and to transfer heat from the second metal connector to the cold source (Sf).

First claim

The invention claimed is:

1. A differential temperature sensor between a hot source and a cold source, including:
a substrate;
an assembly of thermoelectric layers arranged on the substrate, the assembly including at least one first junction of a thermocouple on one side of the assembly, called hot side, and at least one second junction of the thermocouple on an opposite side of the assembly, called cold side;
at least one first connection pad and at least one second connection pad configured to transfer heat respectively to the at least one first junction and to the at least one second junction;
a thermally-insulating support member configured to support the substrate, said support member being intended to be connected to the hot source and to the cold source;
a first metal connector and a second metal connector configured to electrically connect said support member respectively to the at least one first connection pad and to the at least one second connection pad;
wherein said support member includes:
a first thermal conductor configured to transfer heat from the hot source to the first metal connector, and
a second thermal conductor configured to transfer heat from the second metal connector to the cold source.

2. The sensor according to claim 1 , wherein the first metal connector and the second metal connector include a solder bump respectively soldered onto the at least one first connection pad and onto the at least one second connection pad to assemble the substrate and said support member.

3. The sensor according to claim 1 , wherein the first metal connector and the second metal connector include a bonding wire respectively welded to the at least one first connection pad and to the at least one second connection pad to assemble the substrate and said support member.

4. The sensor according to claim 1 , wherein the first and the second thermal conductors respectively include at least a first metal connector pin and at least a second metal connector pin intended to be respectively connected to the hot source and to the cold source.

5. The sensor according to claim 4 , wherein the first and the second thermal conductors respectively include:
at least one first metal track connecting the first metal connector to the at least one first metal connector pin; and
at least one second metal track connecting the second metal connector to the at least second metal connector pin.

6. The sensor according to claim 1 , including an integrated circuit package enclosing the assembly of thermoelectric layers, the integrated circuit package including said support member.

7. The sensor according to claim 6 , wherein the first and the second thermal conductors respectively include at least a first metal connector pin and at least a second metal connector pin intended to be respectively connected to the hot source and to the cold source; the sensor further including an additional package enclosing the integrated circuit package, the additional package including:
a first surface and a second opposite surface being intended to be respectively connected to the hot source and to the cold source,
a first via connecting the first surface the at least one first metal connector pin,
a second via connecting the second surface to the at least one second metal connector pin.

8. The sensor according to claim 7 , wherein the additional package includes a support member configured to support the integrated circuit package.

9. The sensor according to claim 7 , wherein the integrated circuit package includes at least one electric connector pin, and wherein the additional package includes at least one electric track extending from the at least one electric connector pin.

10. The sensor according to claim 1 , including an encapsulation layer configured on the support member to encapsulate the assembly of thermoelectric layers.

11. The sensor according to claim 1 , wherein the assembly of thermoelectric layers has a free surface, wherein the sensor includes a first and a second thermally-conductive elements facing said free surface and extending at a distance from said free surface, and respectively continuing said assembly on the hot side and on the cold side.

12. The sensor according to claim 1 , including a dielectric layer interposed between the substrate and the assembly of thermoelectric layers.

13. The sensor according to claim 1 , wherein the thermally-insulating support member comprises first and second metal tracks, wherein the first and second metal tracks form the first and second connection pads, respectively.

Assignees

• Commissariat Energie Atomique
• Hotblock Onboard

Inventors

• Savelli Guillaume
• Dufourcq Joël

Classifications

• G01K1/18 Primary

  for reducing thermal inertia · CPC title

• G01K3/14

  in respect of space · CPC title

• G01K7/028

  using microstructures, e.g. made of silicon · CPC title

• H01L35/32 Primary

  Electricity · mapped topic

• G01K17/20

  across a radiating surface, combined with ascertainment of the heat-transmission coefficient · CPC title