Light emitting diode device

Patent metadata

Field	Value
Publication number	US-10038122-B2
Application number	US-201414901675-A
Country	US
Kind code	B2
Filing date	Jun 20, 2014
Priority date	Jun 28, 2013
Publication date	Jul 31, 2018
Grant date	Jul 31, 2018

Abstract

A device according to embodiments of the invention includes a light emitting diode (LED) mounted on an electrically conducting substrate. A lens is disposed over the LED. A polymer body is molded over the electrically conducting substrate and in direct contact with the lens.

First claim

The invention claimed is:

1. A device comprising:
a light emitting diode (LED) mounted on an electrically conducting substrate;
a plurality of metal pins electrically connected to the electrically conducting substrate;
a lens disposed over said LED; and
a polymer body molded over the electrically conducting substrate and encapsulating the LED and the electrically conducting substrate;
wherein the lens and the plurality of metal pins protrude from the polymer body and wherein the electrically conducting substrate is at least partially coated with an electrically insulating coating such that the polymer body is not in direct contact with the plurality of metal pins.

2. The device of claim 1 wherein the substrate is a metal frame.

3. The device of claim 1 wherein the polymer body is a thermal plastic selected from the group polycarbonate, polyolefin, PPA, and PPS.

4. The device of claim 1 further comprising a non-light-emitting electronic component attached to the electrically conducting substrate within the polymer body.

5. The device of claim 4 wherein the non-light-emitting electronic component is one of an electrostatic discharge protection circuit, a power conditioning circuit, a driver circuit, a control circuit, a leaded resistor, and a leaded diode.

6. The device of claim 1 wherein the lens comprises one of silicone and epoxy.

7. A system comprising the device of claim 1 , the system being used in one or more of the following applications:
a lamp which is wired to a vehicle and functions in a vehicle circuit as a finished lamp set;
a sub-component of a vehicle lamp which is further integrated into a lamp in a non-replaceable way;
a lamp used as vehicle lighting such as a turn indicator, a day time running lamp, a headlamp, or a tail lamp.

8. The device of claim 1 wherein the polymer body is in direct contact with and covers a portion of the electrically conducting substrate disposed beneath the LED.

9. The device of claim 1 wherein the electrically conducting substrate comprises a top surface on which the LED is mounted and a vertical sidewall extending downward from the top surface, wherein the polymer body is in direct contact with and covers a portion of the vertical sidewall.

10. The device of claim 1 wherein the polymer body is in direct contact with and wider than the electrically conducting substrate.

11. The device of claim 1 wherein the body comprises graphite loaded polycarbonate.

12. The device of claim 4 wherein the body is configured to provide an electrical shield to protect the non-light-emitting electronic component from electromagnetic interference.

13. The device of claim 4 wherein the body is configured to reduce or eliminate electrical noise when a circuit comprising the LED and the non-light-emitting electronic component is driven with or internally generates a non-DC electrical waveform.

14. A method comprising:
attaching a light emitting diode (LED) to an electrically conducting substrate; and
encapsulating the LED and the electrically conducting substrate by molding a thermally conductive, opaque, and electrically insulating body over the LED and the electrically conducting substrate such that a lens disposed over the LED and a plurality of pins electrically connected to the electrically conducting substrate protrude from the body.

15. The method of claim 14 wherein:
the lens is in direct contact with the body; and
the body is opaque plastic.

16. The method of claim 14 further comprising attaching a non-light-emitting electronic component to the electrically conducting substrate, wherein molding comprises encapsulating the non-light-emitting electronic component within the body.

17. The method of claim 14 further comprising gluing the lens to the LED.

18. The method of claim 14 further comprising molding the lens over the LED.

19. The method of claim 14 further comprising forming fins on the exterior surface of the body.

20. The method of claim 14 wherein the LED is a first LED and the lens is a first lens, the method further comprising attaching a second LED to the electrically conducting substrate such that a second lens disposed over the second LED is oriented in a different direction from the first lens, wherein molding the thermally conductive, opaque, and electrically insulating body comprises molding the body such that the second LED is encapsulated and the second lens protrudes from the body.

21. The method of claim 14 wherein attaching the LED to the electrically conducting substrate comprises attaching with one of silver die attach epoxy and eutectic AuSn solder.

Assignees

• Koninklijke Philips Nv
• Lumileds Llc

Inventors

• Martin Paul Scott

Classifications

• H10W90/00

  Package configurations · CPC title

• H01L33/58

  Electricity · mapped topic

• H01L25/167

  Electricity · mapped topic

• H01L33/56

  Electricity · mapped topic

• H01L33/647

  Electricity · mapped topic