Low magnetic flux density interface layer for spin torque oscillator

US10037772B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-10037772-B2
Application numberUS-201715714992-A
CountryUS
Kind codeB2
Filing dateSep 25, 2017
Priority dateJun 28, 2016
Publication dateJul 31, 2018
Grant dateJul 31, 2018

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  1. Title

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Abstract

Official abstract text for this publication.

A magnetic field-assisted magnetic recording (MAMR) head is provided, which includes a recording main pole, a seed layer, and a spin torque oscillator (STO) positioned over the main pole, in this order, in a stacking direction from a leading side to a trailing side of the recording head. The STO comprises a spin polarized layer (SPL), an interlayer with fcc structure, and a field generating layer (FGL), in this order in the stacking direction. The FGL comprises a low magnetic flux density interface (LMFDI) layer with bcc structure that directly contacts the interlayer.

First claim

Opening claim text (preview).

The invention claimed is: 1. A spin torque device comprising: a seed layer and a spin torque oscillator (STO) positioned over a substrate, in this order; wherein: the STO comprises a spin polarized layer (SPL), an interlayer with fcc structure, and a field generating layer (FGL), in this order; and the FGL comprises at least three different magnetic materials, including a low magnetic flux density interface (LMFDI) layer with bcc structure that directly contacts the interlayer. 2. The spin torque device of claim 1 , wherein the LMFDI layer comprises an alloy X-Y-Z comprising element X, element Y, and element Z, wherein: X is selected from a group consisting of Co and Fe; Y is selected from a group consisting of Cr, Mn, Fe, and Co; and Z is Al. 3. The spin torque device of claim 1 , wherein the LMFDI layer comprises an alloy of Co—Fe—Al. 4. The spin torque device of claim 1 , wherein the LMFDI layer has a thickness of 7.5 to 10 Å. 5. The spin torque device of claim 1 , wherein the FGL further comprises a Heusler layer directly contacting the LMFDI layer, the Heusler layer comprising a different material from the LMFDI layer, and the Heusler layer further comprising a magnetically unresponsive magnetic dead layer that directly contacts the LMFDI layer. 6. The spin torque device of claim 5 , wherein the magnetic dead layer has a thickness of less than 5 Å. 7. The spin torque device of claim 5 , wherein the Heusler layer comprises an alloy X-Y-Z comprising element X, element Y, and element Z, wherein: X is selected from a group consisting of Co and Fe, Y is selected from a group consisting of Cr, Mn, Fe, and Co, and Z is selected from a group consisting of Si and Ge. 8. The spin torque device of claim 7 , wherein the Heusler layer comprises an alloy of Co—Mn—Ge. 9. The spin torque device of claim 1 , wherein the seed layer comprises a bcc layer positioned above an hcp layer or an fcc layer. 10. The spin torque device of claim 1 , wherein the FGL comprises the LMFDI layer, a Heusler layer directly contacting the LMFDI layer, and a CoFe layer directly contacting the Heusler layer. 11. The spin torque device of claim 1 , wherein the LMFDI layer comprises an alloy of Co—Mn—Al. 12. A spin torque device comprising: a seed layer and a spin torque oscillator (STO) positioned over a substrate, in this order; wherein: the STO comprises a field generating layer (FGL), an interlayer with fcc structure, and a spin polarized layer (SPL), in this order; and the SPL comprises a LMFDI layer with bcc structure that directly contacts the interlayer. 13. The spin torque device of claim 12 , wherein the LMFDI layer comprises an alloy X-Y-Z comprising element X, element Y, and element Z, wherein: X is selected from a group consisting of Co and Fe, Y is selected from a group consisting of Cr, Mn, Fe, and Co, and Z is Al. 14. The spin torque device of claim 13 , wherein the LMFDI layer comprises an alloy of Co—Fe—Al or an alloy of Co—Mn—Al. 15. The spin torque device of claim 12 , wherein the LMFDI layer has a thickness of 7.5 to 10 Å. 16. The spin torque device of claim 12 , wherein the SPL further comprises a Heusler layer directly contacting the LMFDI layer, the Heusler layer comprising a different material from the LMFDI layer, and the Heusler layer further comprising a magnetically unresponsive magnetic dead layer that directly contacts the LMFDI layer. 17. The spin torque device of claim 16 , wherein the magnetic dead layer has a thickness of less than 5 Å. 18. The spin torque device of claim 16 , wherein the Heusler layer comprises an alloy X-Y-Z comprising element X, element Y, and element Z, wherein: X is selected from a group consisting of Co and Fe, Y is selected from a group consisting of Cr, Mn, Fe, and Co, and Z is selected from a group consisting of Si and Ge. 19. The spin torque device of claim 18 , wherein the Heusler layer comprises an alloy of Co—Mn—Ge. 20. The spin torque device of claim 12 , wherein the seed layer comprises a bcc layer positioned above an hcp layer or an fcc layer.

Assignees

Inventors

Classifications

  • G11B5/3153Primary

    including at least one magnetic thin film coupled by interfacing to the basic magnetic thin film structure · CPC title

  • Microwave assisted recording · CPC title

  • with cores being composed of metal sheets, i.e. laminated cores {with cores composed of isolated magnetic layers, e.g. sheets (in thin films G11B5/31)} · CPC title

  • magnetic layers · CPC title

  • Selection of material for gap filler {(G11B5/232 takes precedence)} · CPC title

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What does patent US10037772B2 cover?
A magnetic field-assisted magnetic recording (MAMR) head is provided, which includes a recording main pole, a seed layer, and a spin torque oscillator (STO) positioned over the main pole, in this order, in a stacking direction from a leading side to a trailing side of the recording head. The STO comprises a spin polarized layer (SPL), an interlayer with fcc structure, and a field generating lay…
Who is the assignee on this patent?
Western Digital Tech Inc
What technology area does this patent fall under?
Primary CPC classification G11B5/3153. Mapped technology areas include Physics.
When was this patent published?
Publication date Tue Jul 31 2018 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 12 related publications on this page (citations in our corpus or others sharing the same primary CPC).