Infrared ray absorbing composition or infrared ray absorbing composition kit, infrared ray cut filter using the same, method for producing the infrared ray cut filter, camera module, and method for producing the camera module

Patent metadata

Field	Value
Publication number	US-10036838-B2
Application number	US-201514820619-A
Country	US
Kind code	B2
Filing date	Aug 7, 2015
Priority date	Feb 14, 2013
Publication date	Jul 31, 2018
Grant date	Jul 31, 2018

Abstract

An infrared ray absorbing composition kit comprises: a composition containing a copper compound or pigment having a maximum absorption wavelength in the wavelength range of 700 nm to 1000 nm; and a composition containing a metal oxide having a maximum absorption wavelength in the wavelength range of 800 nm to 2000 nm.

First claim

What is claimed is:

1. An infrared ray absorbing composition kit comprising:
a composition containing a copper compound having a maximum absorption wavelength in the wavelength range of 700 nm to 1000 nm; and
a composition containing a metal oxide having a maximum absorption wavelength in the wavelength range of 800 nm to 2000 nm, and
wherein the copper compound is a copper complex represented by the following General formula (1-1) or General formula (1-2):
Cu(L) n1   General Formula (1-1)

Cu(L) n1 .(X) n2   General Formula (1-2)

 in General Formulas (1-1) and (1-2), L represents a ligand coordinated to copper, the ligand being a sulfonic acid, a phosphoric acid, a phosphoric acid ester, a phosphonic acid, a phosphonic acid ester, a phosphinic acid, a carboxylic acid, a carbonyl (ester or ketone), an amine, an amide, a sulfonamide, a urethane, a urea, an alcohol, or a thiol; X represents a halogen atom, H 2 O, NO 3 , ClO 4 , SO 4 , CN, SCN, BF 4 , PF 6 , BPh 4 or an alcohol; Ph represents a phenyl group; and each of n1 and n2 independently represents an integer of 1 to 4.

2. The infrared ray absorbing composition kit according to claim 1 ,
wherein the content of the metal oxide in the composition containing the metal oxide is from 1% by mass to 50% by mass with respect to the mass of the total solid content of the composition.

3. The infrared ray absorbing composition kit according to claim 1 ,
wherein the content of the copper compound in the composition containing the copper compound is from 50% by mass to 80% by mass with respect to the mass of the total solid content of the composition.

4. The infrared ray absorbing composition kit according to claim 1 ,
wherein the content of the pigment in the composition containing the copper compound is from 1% by mass to 20% by mass with respect to the mass of the total solid content of the composition.

5. The infrared ray absorbing composition kit according to claim 1 , wherein the metal oxide is cesium tungsten oxide.

6. The infrared ray absorbing composition kit according to claim 1 ,
wherein the ligand L in General Formulas (1-1) and (1-2) is a sulfonic acid, a carboxylic acid, a phosphoric acid, a phosphoric acid ester, a phosphonic acid, phosphonic acid ester, or a phosphinic acid.

7. The infrared ray absorbing composition kit according to claim 1 , wherein the mass ratio of the metal oxide to the copper compound is from 0.0001 to 0.5.

8. An infrared ray cut filter formed by using the infrared ray absorbing composition kit according to claim 1 .

9. A method for producing an infrared ray cut filter, comprising a step of coating the infrared ray absorbing composition kit according to claim 1 to form a film.

10. A method for producing a camera module composed of a solid state imaging element substrate and an infrared ray cut filter disposed on the light-receiving side of the solid state imaging element substrate, comprising a step of coating the infrared ray absorbing composition kit according to claim 1 at the light-receiving side of the solid imaging element substrate to form a film.

Assignees

• Fujifilm Corp

Inventors

• Bak Seongmu
• Ezoe Toshihide
• Shimada Kazuto

Classifications

• H04N23/55

  Optical parts specially adapted for electronic image sensors; Mounting thereof · CPC title

• H04N23/57

  Mechanical or electrical details of cameras or camera modules specially adapted for being embedded in other devices · CPC title

• H04N25/131

  including elements passing infrared wavelengths · CPC title

• C09B67/0097

  Dye preparations of special physical nature; Tablets, films, extrusion, microcapsules, sheets, pads, bags with dyes · CPC title

• H04N9/045

  Electricity · mapped topic