Thermal pumping via in situ pipes and apparatus including the same

Patent metadata

Field	Value
Publication number	US-10036373-B2
Application number	US-201414203924-A
Country	US
Kind code	B2
Filing date	Mar 11, 2014
Priority date	Mar 11, 2014
Publication date	Jul 31, 2018
Grant date	Jul 31, 2018

Abstract

A thermal-pumping apparatus according to a non-limiting example embodiment may include a first volume structure defining a first inlet opening and a first outlet opening in fluid communication with a first volume, a second volume structure defining a second inlet opening and a second outlet opening in fluid communication with a second volume, and a connection structure joining the first outlet opening of the first volume structure to the second inlet opening of the second volume structure. The connection structure may include a one-directional valve configured to allow fluid flow between the first and second volume structures in one direction only from the first volume of the first volume structure to the second volume of the second volume structure.

First claim

The invention claimed is:

1. A thermal-pumping apparatus, comprising:
a plurality of volume structures, the plurality of volume structures including a first volume structure and a second volume structure,
the first volume structure defining a first volume, the first volume structure defining a first inlet opening and a first outlet opening in fluid communication with the first volume,
the second volume structure defining a second volume, the second volume structure defining a second inlet opening and a second outlet opening in fluid communication with the second volume;
a plurality of connection structures connecting the plurality of volume structures in series such that each one of the plurality of connection structures connects a corresponding two adjacent volume structures among the plurality of volume structures,
at least three of the plurality of volume structures being arranged end-to-end and extending laterally in a same direction,
the at least three of the plurality of volume structures each having a length greater than a width and the same direction corresponding to the lengths of the at least three of the plurality of volume structures,
the plurality of connection structures each including a one-directional valve configured to allow fluid flow between the corresponding two adjacent volume structures among the plurality of volume structures,
the plurality of connection structures including a first connection structure joining the first outlet opening of the first volume structure to the second inlet opening of the second volume structure, the one-directional valve of the first connection structure configured to allow fluid flow between the first volume structure and the second volume structure in one direction only from the first volume of the first volume structure to the second volume of the second volume structure;
a heat transfer structure that is a closed system with respect to the first volume structure, the heat transfer structure being configured to transfer thermal energy to the first volume structure using at least one of conduction and radiation such that a pressure in the first volume structure increases; and
a distributed control and information system (DCIS), the DCIS including a first volume structure sensor, a second volume structure sensor, and a connection structure sensor,
the first volume structure sensor being configured to measure at least one of a temperature, a level, and a pressure of fluid in the first volume structure,
the second volume structure sensor being configured to measure at least one of a temperature, a level, and a pressure of fluid in the second volume structure,
the connection structure sensor being configured to measure a flow rate of fluid through the first connection structure.

2. The thermal-pumping apparatus of claim 1 , further comprising:
at least one disc independently connected to a corresponding one of the first and second volume structures through a pipe portion and configured to relieve an internal pressure of the corresponding one of the first and second volume structures if the internal pressure of the corresponding one of the first and second volume structures bursts the disc.

3. The thermal-pumping apparatus of claim 1 , wherein
the first and second volume structures are pipes,
the first connection structure is a flange joining one end of the first volume structure to one end of the second volume structure,
the one-directional valve of the first connection structure is one of,
surrounded by the first volume structure,
surrounded by the second volume structure, and
at an interface between the first and second volume structures.

4. The thermal-pumping apparatus of claim 1 , further comprising
at least one of an electrically-powered pump and a mechanically-powered pump that is not directly connected to the second volume structure and is not configured to increase a pressure in the second volume of the second volume structure.

5. The thermal-pumping apparatus of claim 1 , wherein
a bottom surface of the first volume structure defines the first outlet opening, the bottom surface of the first volume structure being opposite a top surface of the first volume structure,
the first connection structure includes an equalizing line connected to the one-directional valve of the first connection structure and the second inlet opening of the second volume structure,
the equalizing line is configured to allow fluid flow from the first volume of the first volume structure through the one-directional valve of the first connection structure to the second volume of the second volume structure if the one-directional valve is open such that the bottom surface of the first volume structure is in a primary flow path of fluid flow from the first volume of the first volume structure to the second volume of the second volume structure, and

the connection structure sensor is configured to measure the flow rate of fluid through the equalizing line.

6. The thermal-pumping apparatus of claim 5 , further comprising:
at least one exhaust valve connected to a corresponding one of the first volume structure and the second volume structure, wherein
the corresponding one of the first volume structure and the second volume structure defines an exhaust opening that is spaced apart from a corresponding one of the first outlet opening and the second outlet opening in the corresponding one of the first volume structure and the second volume structure,
the exhaust valve is connected to the exhaust opening, and
the DCIS is configured to open the exhaust valve in order to provide a path for air or gas to escape from or enter the corresponding one of the first volume structure and the second volume structure.

7. The thermal-pumping apparatus of claim 5 , further comprising:
a bypass valve, wherein
the first volume structure defines a first bypass opening in fluid communication with the first volume,
the equalizing line defines a first bypass hole,
the bypass valve is connected to the first bypass opening and the first bypass hole, and
the bypass valve is configured to selectively allow fluid flow from the first volume of the first volume structure through the first bypass hole into the equalizing line.

8. The thermal-pumping apparatus of claim 1 , wherein
the one-directional valve of the first connection structure is configured to open if a pressure of the first volume is greater than a pressure of the second volume, and a differential pressure between the first volume and the second volume is greater than or equal to a threshold of the one-directional valve of the first connection structure,
the one-directional valve of the first connection structure is configured to close if the differential pressure between the first volume and the second volume is less than the threshold of the one-directional valve of the first connection structure, and
the one-directional valve of the first connection structure is also configured to close if the pressure of the first volume is less than the pressure of the second volume.

9. The thermal-pumping apparatus of claim 1 , further comprising:
at least one input pipe connected to the first inlet opening of the first volume structure.

10. The thermal-pumping apparatus of claim 9 , wherein
the plurality of volume structures and connection structures form a conduit,
the plurality of connection structures connect at least 4 of the plurality of volume structures in series, and
the conduit is configured to thermally-pump a fluid in the one direction only from the first volume structure through the plurality of connection structures to a terminal one of the plurality of volume structures, using at least one of condu

Assignees

• Loewen Eric P
• Hunt Brian S
• Ge Hitachi Nuclear Energy Americas Llc

Inventors

• Loewen Eric P
• Hunt Brian S

Classifications

• Y10T29/49236

  Fluid pump or compressor making · CPC title

• F04B19/24 Primary

  Pumping by heat expansion of pumped fluid · CPC title