Tire Rubber Composition
US-2016075864-A1 · Mar 17, 2016 · US
Rubber composition for use in tires
US10035901B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-10035901-B2 |
| Application number | US-201415106250-A |
| Country | US |
| Kind code | B2 |
| Filing date | Dec 5, 2014 |
| Priority date | Dec 18, 2013 |
| Publication date | Jul 31, 2018 |
| Grant date | Jul 31, 2018 |
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- Title
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Abstract
Official abstract text for this publication.
A rubber composition for use in tires comprises: WT part(s) by weight of an aromatic modified terpene resin having a softening point of 100° C. or higher per 100 parts by weight of a diene rubber, the diene rubber containing a total of 50% by weight or greater but less than 90% by weight of a butadiene rubber and an emulsion-polymerized styrene butadiene rubber, wherein the butadiene rubber is contained in an amount of 35% by weight or greater but less than 65% by weight and the emulsion-polymerized styrene butadiene rubber is contained in an amount so that an amount of bonded styrene is 35% by weight or greater. In the rubber composition, the ratio of the compounded amount of the butadiene rubber (WB part(s) by weight) to the compounded amount of the aromatic modified terpene resin (WB/WT) is from 2.5 to 5.0.
First claim
Opening claim text (preview).
The invention claimed is: 1. A rubber composition for use in a tire, the rubber composition comprising: 100 parts by weight of a diene rubber and WT part(s) by weight of an aromatic modified terpene resin having a softening point of 100° C. or higher, the diene rubber containing a total of 50% by weight or greater but 90% by weight or less of an unmodified butadiene rubber and an emulsion-polymerized styrene butadiene rubber, the unmodified butadiene rubber being contained in an amount of 35% by weight or greater but less than 65% by weight and the emulsion-polymerized styrene butadiene rubber being contained in an amount so that an amount of bonded styrene is 35% by weight or greater; and a ratio of a compounded amount of the unmodified butadiene rubber (WB part(s) by weight) to a compounded amount of the aromatic modified terpene resin (WB/WT) being from 2.5 to 5.0. 2. The rubber composition for use in a tire according to claim 1 , further comprising from 50 to 120 parts by weight of a filler per 100 parts by weight of the diene rubber; and the filler has 10% by weight or greater of silica having a CTAB specific surface area of 120 to 180 m 2 /g. 3. A pneumatic tire comprising the rubber composition for use in a tire described in claim 1 . 4. The pneumatic tire according to claim 3 , wherein the pneumatic tire is a tire for a light truck. 5. The rubber composition for use in a tire according to claim 1 , wherein the diene rubber contains a total of 60% by weight or greater but 90% by weight or less of the unmodified butadiene rubber and the emulsion-polymerized styrene butadiene rubber.
Assignees
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Classifications
- C08L9/00Primary
Compositions of homopolymers or copolymers of conjugated diene hydrocarbons · CPC title
containing two or more polymers of the same hierarchy C08L, and differing only in parameters such as density, comonomer content, molecular weight, structure · CPC title
Compositions of the tread · CPC title
containing four or more polymers in a blend · CPC title
containing three or more polymers in a blend · CPC title
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Frequently asked questions
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- What does patent US10035901B2 cover?
- A rubber composition for use in tires comprises: WT part(s) by weight of an aromatic modified terpene resin having a softening point of 100° C. or higher per 100 parts by weight of a diene rubber, the diene rubber containing a total of 50% by weight or greater but less than 90% by weight of a butadiene rubber and an emulsion-polymerized styrene butadiene rubber, wherein the butadiene rubber is …
- Who is the assignee on this patent?
- Yokohama Rubber Co Ltd
- What technology area does this patent fall under?
- Primary CPC classification C08L9/00. Mapped technology areas include Chemistry & Metallurgy.
- When was this patent published?
- Publication date Tue Jul 31 2018 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
- What related patents are in patentsdb?
- We list 2 related publications on this page (citations in our corpus or others sharing the same primary CPC).