Laminate, and element comprising substrate manufactured using same

US10035883B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-10035883-B2
Application numberUS-201414422495-A
CountryUS
Kind codeB2
Filing dateApr 8, 2014
Priority dateApr 9, 2013
Publication dateJul 31, 2018
Grant dateJul 31, 2018

How to read this patent

A practical reading order for non-experts. Skip the full description unless you need deep technical detail.

  1. Title

    What the patent document calls the invention.

  2. Abstract

    A short plain-language summary of the technical disclosure.

  3. Assignees and inventors

    Who owns or filed the patent and who is credited as inventor.

  4. Key dates

    Filing, priority, publication, and grant dates set the timeline.

  5. First independent claim

    The legal scope of protection — read this for what is actually claimed.

  6. CPC / IPC classifications

    Technology tags used to group this patent with similar filings.

  7. Citations and related patents

    Prior art links and similar publications in this corpus.

Abstract

Official abstract text for this publication.

The present invention relates to a laminate and a device fabricated using the laminate. The laminate includes a first polyimide resin layer between a carrier substrate and a second polyimide resin layer, wherein the first polyimide resin layer has a coefficient of thermal expansion (CTE) equal to or lower than the CTE of the second polyimide-based resin layer at a temperature of 100 to 200° C., and the adhesive strength of the first resin layer to the second resin layer decreases when a physical stimulus causing no chemical changes in the first resin layer is applied to the laminate. According to the present invention, the flexible substrate can be easily separated from the carrier substrate without the need for further processing such as laser or light irradiation. Therefore, the use of the laminate facilitates the fabrication of the device having the flexible substrate. The device may be, for example, a flexible display device. In addition, the device can be prevented from deterioration of reliability and occurrence of defects caused by laser or light irradiation. This ensures improved characteristics and high reliability of the device.

First claim

Opening claim text (preview).

The invention claimed is: 1. A laminate for cutting and peeling comprising: a carrier substrate; a first polyimide film disposed directly on top of at least one surface of the carrier substrate; and a second polyimide film disposed on the first polyimide film, wherein the first polyimide film has a coefficient of thermal expansion (CTE) equal to or lower than the CTE of the second polyimide film at a temperature of 100 to 200° C., and wherein the adhesive strength of the first polyimide film to the second polyimide film decreases when the second polyimide film in laminate is cut to expose cross-sectional surfaces of the second polyimide film, and wherein the second polyimide film is adapted to be peeled from the first polyimide film. 2. The laminate according to claim 1 , wherein the difference between the coefficients of thermal expansion (CTE) at a temperature of 100 to 200° C. of the first and second polyimide films is 60 ppm/° C. or less. 3. The laminate according to claim 1 , wherein the first polyimide film has an adhesive strength of at least 1 N/cm to the second polyimide film before the laminate is cut, and has a peel strength not greater than 0.3 N/cm from the second polyimide film after the laminate is cut. 4. The laminate according to claim 1 , wherein the first polyimide film comprises a first polyimide resin that has a similarity score not greater than 0.5, as calculated by Equation 1: Similarity ⁢ ⁢ score = α FIT ⁡ ( k 1 × Ls dianhydride , i + k 2 × Ls diamine , j ) 0 k [ Equation ⁢ ⁢ 1 ] where Ls dianhydride,i =Exp[− k 3 ×Coeff i ]×V i y 0 Ls diamine,j =Exp[− k 4 ×Coeff j ]×V j y 0 k 0 =2.00, y 0 =−1.00, k 1 =206.67, k 2 =124.78, k 3 =3.20, k 4 =5.90, Coeff i and Coeff j are molecular asphericities calculated from the structures of dianhydride i and diamine j as monomers of the polyimide, respectively, using ADRIANA.Code (Molecular Networks GmbH), V i and V j are McGowan volumes calculated from the structures of dianhydride i and diamine j as the monomers, respectively, using ADRIANA.Code (Molecular Networks GmbH), and α FIT is 1.0 if exp (−4.0×|Coeff i −Coeff j |)+0.08<0.90 and is a constant from 0.1 to 0.95 if exp (−4.0×|Coeff i −Coeff j |)+0.08≥0.90. 5. The laminate according to claim 1 , wherein the first polyimide film comprises a first polyimide resin that has an imidization degree of 60% to 99% when the imidization degree is defined as the percentage of the integrated intensity of the CN bands observed at 1350 to 1400 cm −1 or 1550 to 1650 cm −1 in the IR spectrum after a composition comprising a polyamic acid resin is applied and imidized at a temperature of 200° C. or above with respect to the integrated intensity (100%) of the CN bands observed in the same wavelength range after the composition is imidized at a temperature of 500° C. or above. 6. The laminate according to claim 1 , wherein the first polyimide film comprises a first polyimide resin that has a glass transition temperature of 200° C. or above. 7. The laminate according to claim 1 , wherein the first polyimide film is formed by applying a composition including a polyimide resin or a precursor thereof on the carrier substrate and curing the composition at a temperature equal to or 0 to 200° C. lower than the curing temperature of the second polyimide film. 8. The laminate according to claim 1 , wherein the first polyimide film comprises a first polyimide resin prepared by reacting an aromatic tetracarboxylic dianhydride of Formula 1: wherein A is a tetravalent aromatic organic group of Formula 2a or 2b: wherein R 11 is a C 1 -C 4 alkyl or C 1 -C 4 haloalkyl group, a is an integer from 0 to 3, and b is an integer from 0 to 2, wherein R 12 to R 14 are each independently a C 1 -C 4 alkyl or C 1 -C 4 haloalkyl group, c and e are each independently an integer from 0 to 3, d is an integer from 0 to 4, and f is an integer from 0 to 3, with an aromatic diamine compound having a linear structure to prepare a polyamic acid, and curing the polyamic acid at a temperature of 200° C. or above. 9. The laminate according to claim 8 , wherein the aromatic diamine compound is represented by Formula 4a or 4b: wherein R 21 is a C 1 -C 10 alkyl or C 1 -C 10 haloalkyl group and 1 is an integer from 0 to 4, wherein R 22 and R 23 are each independently a C 1 -C 10 alkyl or C 1 -C 10 haloalkyl group, X is selected from the group consisting of —O—, —CR 24 R 25 —, —C(═O)—, —C(═O)O—, —C(═O)NH—, —S—, —SO—, —SO 2 —, —O[CH 2 CH 2 O] q —, C 6 -C 18 monocyclic and polycyclic cycloalkylene groups, C 6 -C 18 monocyclic and polycyclic arylene groups, and combinations thereof, R 24 and R 25 are each independently selected from the group consisting of a hydrogen atom, C 1 -C 10 alkyl groups, and C 1 -C 10 haloalkyl groups, q is an integer of 1 or 2, m and n are each independently an integer from 0 t

Assignees

Inventors

Classifications

  • the auxiliary support including means facilitating the separation of a device or wafer from the auxiliary support · CPC title

  • comprising polyesters · CPC title

  • comprising acrylic (co)polymers · CPC title

  • Organic displays, e.g. OLED · CPC title

  • using interposed adhesives or interposed materials with bonding properties · CPC title

Patent family

Related publications grouped by family.

External sources

Frequently asked questions

Answers are generated from the same data shown on this page.

What does patent US10035883B2 cover?
The present invention relates to a laminate and a device fabricated using the laminate. The laminate includes a first polyimide resin layer between a carrier substrate and a second polyimide resin layer, wherein the first polyimide resin layer has a coefficient of thermal expansion (CTE) equal to or lower than the CTE of the second polyimide-based resin layer at a temperature of 100 to 200° C.,…
Who is the assignee on this patent?
Lg Chemical Ltd
What technology area does this patent fall under?
Primary CPC classification B32B3/16. Mapped technology areas include Operations & Transport.
When was this patent published?
Publication date Tue Jul 31 2018 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).