Die bond design for medium pressure sensor

Patent metadata

Field	Value
Publication number	US-10035703-B2
Application number	US-201314040167-A
Country	US
Kind code	B2
Filing date	Sep 27, 2013
Priority date	Sep 27, 2013
Publication date	Jul 31, 2018
Grant date	Jul 31, 2018

Abstract

A micro-electromechanical pressure transducer formed from a silicon die centers itself on a pedestal, formed from either a metal or a dielectric, by applying a predetermined amount of liquid epoxy adhesive to the square, top surface of the pedestal and allowing the liquid adhesive to distribute itself over the top surface. A MEMS die placed atop the liquid adhesive is centered on the top surface by surface tension between sides of the die and the top surface.

First claim

The invention claimed is:

1. A pressure sensor comprising:
a micro-electromechanical pressure transducer (MEMS sensor) comprising:
a first, substantially right-rectangular prism made of silicon having four, substantially vertical and substantially rectangular sides and substantially square and opposing top and bottom surfaces, the top and bottom surfaces of the first prism having four substantially equal-length sides with a first length dimension, the top and bottom surfaces having a corresponding first area, the top surface also defining a diaphragm, which deflects responsive to a pressure applied to the diaphragm, the first prism also having a first hole through the bottom surface and which extends through the first prism to an open space below the diaphragm;
a pedestal formed from a second, substantially right-rectangular prism having four, substantially vertical and substantially rectangular sides and substantially square and opposing top and bottom opposing surfaces, the top and bottom surfaces of the second prism having four, substantially equal length sides with a second length dimension and a corresponding second area, the second length dimension being greater than the first length dimension, the second area also being greater than the first area, the substantially square top surface of the pedestal having four vertically-oriented, rounded corners, the second prism also having a second hole, which extends through the second prism and its top and bottom surfaces, the second hole being aligned with the first hole; and
a die bond layer located between said top side of the second prism and the bottom surface of the first prism, the die bond layer being formed from a predetermined volume of a liquid adhesive, which hardens by curing, the liquid adhesive having a predetermined viscosity prior to curing, the adhesive also having a surface tension, the liquid adhesive being selected such that surface tension of the liquid adhesive causes the predetermined volume of liquid to distribute itself evenly around the second hole, and wherein the four vertically-oriented, rounded corners are configured to facilitate distribution of the liquid adhesive around the first prism;
wherein the first and second areas, the predetermined volume, and the viscosity are selected, and the rounded corners are configured, such that the predetermined volume of liquid adhesive forms four, substantially equal-size fillets, which are attached to the sides of the first prism and attached to the top surface of the second prism, a fillet being a concave-shaped accumulation of liquid adhesive attached to a side of the first prism and, the top surface of the second prism.

2. The pressure sensor of claim 1 , wherein the pedestal is formed from a dielectric material.

3. The pressure sensor of claim 1 , wherein the pedestal is metallic.

4. The pressure sensor of claim 1 , wherein a rounded corner of the pedestal has a first radius of curvature and the fillets of liquid adhesive have a second radius of curvature.

5. The pressure sensor of claim 1 , wherein a rounded corner has a first radius of curvature and the fillets have a vertical height dimension and a horizontal width dimension.

6. The pressure sensor of claim 4 , wherein the first radius of curvature and the second radius of curvature are substantially equal.

7. The pressure sensor of claim 4 , wherein the first radius of curvature of a corner and the width dimension of a filet are substantially equal.

8. The pressure sensor of claim 1 , wherein the liquid adhesive wets sides of the first prism and wets the top surface of the second prism.

9. A pressure sensor comprising:
a micro-electromechanical pressure transducer (MEMS sensor) comprising:
a first, substantially right-rectangular prism made of silicon having four, substantially vertical and substantially rectangular sides and substantially square and opposing top and bottom surfaces, the top and bottom surfaces of the first prism having four substantially equal-length sides with a first length dimension, the top and bottom surfaces having a corresponding first area, the top surface also defining a diaphragm, which deflects responsive to a pressure applied to the diaphragm, the first prism also having a first hole through the bottom surface and which extends through the first prism to an open space below the diaphragm;
a pedestal formed from a second, substantially right-rectangular prism having four, substantially vertical and substantially rectangular sides and substantially square and opposing top and bottom opposing surfaces, the top and bottom surfaces of the second prism having four, substantially equal length sides with a second length dimension and a corresponding second area, the second length dimension being greater than the first length dimension, the second area also being greater than the first area, the second prism also having a second hole, which extends through the second prism and its top and bottom surfaces, the second hole being aligned with the first hole; and
a die bond layer located between said top side of the second prism and the bottom surface of the first prism, the die bond layer being formed from a predetermined volume of a liquid adhesive, which hardens by curing, the liquid adhesive having a predetermined viscosity prior to curing, the adhesive also having a surface tension, the liquid adhesive being selected such that surface tension of the liquid adhesive causes the predetermined volume of liquid to distribute itself evenly around the second hole;
wherein the first prism side lengths are about 2 millimeters, the second prism side lengths are about 3.25 millimeters and the liquid adhesive is an epoxy having a viscosity of about 6500 centipoise (CPS), whereby surface tension of the liquid adhesive aligns the center the first prism with the center of the second prism.

10. The pressure sensor of claim 9 , wherein the first and second holes are aligned with each other by the filets.

Assignees

• Continental automotive systems inc

Inventors

• Wang Joe Pin

Classifications

• B81C3/007 Primary

  Methods for aligning microparts not provided for in groups B81C3/004 - B81C3/005 · CPC title

• B81C2203/055

  using the surface tension of fluid solder to align the elements · CPC title

• G01L19/148

  Details about the circuit board integration, e.g. integrated with the diaphragm surface or encapsulation · CPC title

• B81B2201/0264

  Pressure sensors · CPC title

• H01L29/84

  Electricity · mapped topic