Method and apparatus of three-dimensional printing and electronic apparatus

US10035307B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-10035307-B2
Application numberUS-201414277067-A
CountryUS
Kind codeB2
Filing dateMay 14, 2014
Priority dateMar 17, 2014
Publication dateJul 31, 2018
Grant dateJul 31, 2018

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  2. Abstract

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  5. First independent claim

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Abstract

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A method and an apparatus of three-dimensional (3D) printing and an electronic apparatus are provided. The 3D printing method is adapted for printing a 3D object and includes the following. A plurality of layer objects of a 3D model are obtained, and a plurality of two-dimensional images, which correspond to a slice plane, of each of the layer objects are generated. The layer objects include a first layer object and a second layer object. When a comparison relationship between a two-dimensional image of the first layer object and a two-dimensional image of the second layer object matches a stack condition, the first layer object and the second layer object are stacked to generate thickness stack information of a stack object. A printing mechanism is initiated according to the thickness stack information so as to print a 3D object associated with the 3D model.

First claim

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What is claimed is: 1. A three-dimensional printing method, adapted for printing a three-dimensional object, the three-dimensional printing method comprising: obtaining a plurality of layer objects of a three-dimensional model by performing a slicing process on the three-dimensional model and generating a plurality of two-dimensional images, corresponding to a slice plane, of each of the layer objects, wherein the layer objects comprise a first layer object and a second layer object adjacent to each other; stacking the first layer object and the second layer object to generate thickness stack information of a stack object when a comparison relationship between the two-dimensional image of the first layer object and the two-dimensional image of the second layer object matches a stack condition; and initiating a printing mechanism according to the thickness stack information to print the three-dimensional object associated with the three-dimensional model, wherein the step of stacking the first layer object and the second layer object to generate the thickness stack information of the stack object when the comparison relationship between the two-dimensional image of the first layer object and the two-dimensional image of the second layer object matches the stack condition comprises: after obtaining the first layer object and the second layer object by performing the slicing process, determining whether a coverage of the two-dimensional image of the second layer object is larger than or equal to a coverage of the two-dimensional image of the first layer object; and after obtaining the first layer object and the second layer object by performing the slicing process, stacking the first layer object and the second layer object to generate at least one combined thickness and at least one combined control code file of the stack object only when the coverage of the two-dimensional image of the second layer object is larger than or equal to the coverage of the two-dimensional image of the first layer object, wherein the step of initiating the printing mechanism according to the thickness stack information to print the three-dimensional object associated with the three-dimensional model comprises: adjusting irradiation intensity of a light source into a first value according to the at least one combined thickness; and adjusting the irradiation intensity of the light source into a second value according to the at least one combined thickness and generating the stack object to have multiple thicknesses on a movable platform while moving the movable platform only once. 2. The three-dimensional printing method according to claim 1 , wherein the step of obtaining the layer objects of the three-dimensional model and generating the two-dimensional images, corresponding to the slice plane, of each of the layer objects comprises: generating a plurality of initial control code files respectively corresponding to the layer objects; and generating the two-dimensional images of each of the layer objects according to the initial control code files. 3. The three-dimensional printing method according to claim 2 , wherein the initial control code files are G code files. 4. The three-dimensional printing method according to claim 1 , wherein the step of stacking the first layer object and the second layer object to generate the at least one combined thickness and the at least one combined control code file of the stack object when the coverage of the two-dimensional image of the second layer object is larger than or equal to the coverage of the two-dimensional image of the first layer object comprises: determining whether the coverage of the two-dimensional image of the second layer object is equal to the coverage of the two-dimensional image of the first layer object; and if affirmative, adding a thickness of the first layer object and a thickness of the second layer object to generate the at least one combined thickness. 5. The three-dimensional printing method according to claim 4 , further comprising: setting the at least one combined control code file as an initial control code file of the second layer object, wherein the initial control code file of the second layer object is the same as an initial control code file of the first layer object. 6. The three-dimensional printing method according to claim 1 , wherein the step of stacking the first layer object and the second layer object to generate the at least one combined thickness and the at least one combined control code file of the stack object when the coverage of the two-dimensional image of the second layer object is larger than or equal to the coverage of the two-dimensional image of the first layer object comprises: determining whether the coverage of the two-dimensional image of the second layer object is larger than the coverage of the two-dimensional image of the first layer object; and if affirmative, adding the thickness of the first layer object and the thickness of the second layer object to generate a first combined thickness of the at least one combined thickness and recording the thickness of the second layer object as a second combined thickness of the at least one combined thickness. 7. The three-dimensional printing method according to claim 6 , further comprising: comparing the coverage of the first layer object with the coverage of the second layer object to generate a first combined control code file associated with the first combined thickness and a second combined control code file associated with the second combined thickness. 8. The three-dimensional printing method according to claim 1 , wherein the step of initiating the printing mechanism according to the thickness stack information to print the three-dimensional object associated with the three-dimensional model comprises: adjusting output intensity of the light source according to the at least one combined thickness; and controlling an irradiation pathway of the light source according to the at least one combined control code file to cure an irradiated liquid molding material, so as to form the three-dimensional object on the movable platform. 9. The three-dimensional printing method according to claim 1 , wherein the printing mechanism is a stereolithography (SLA) printing mechanism. 10. A three-dimensional printing apparatus, comprising: a processor obtaining a plurality of layer objects of a three-dimensional model based on a slicing process performed on the three-dimensional model and generating a plurality of two-dimensional images, corresponding to a slice plane, of each of the layer objects, wherein the layer objects comprise a first layer object and a second layer object adjacent to each other, and the processor stacks the first layer object and the second layer object to generate thickness stack information of a stack object when a comparison relationship between the two-dimensional image of the first layer object and the two-dimensional image of the second layer object matches a stack condition, wherein the processor initiates a printing mechanism according to the thickness stack information to print a three-dimensional object associated with the three-dimensional model, wherein after obtaining the first layer object and the second layer object based on the slicing process, the processor determines whether a coverage of the two-dimensional image of the second layer object is larger than or equal to a coverage of the two-dimensional image of the first layer object, wherein after obtaining the first layer object and the second layer object based on the slicing process, the processor stacks the first layer object and the second layer object to generate at least one combined thicknes

Assignees

Inventors

Classifications

  • for controlling or regulating additive manufacturing processes · CPC title

  • for controlling or regulating additive manufacturing processes · CPC title

  • Computer-aided design [CAD] · CPC title

  • Processes of additive manufacturing · CPC title

  • Geometric CAD · CPC title

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What does patent US10035307B2 cover?
A method and an apparatus of three-dimensional (3D) printing and an electronic apparatus are provided. The 3D printing method is adapted for printing a 3D object and includes the following. A plurality of layer objects of a 3D model are obtained, and a plurality of two-dimensional images, which correspond to a slice plane, of each of the layer objects are generated. The layer objects include a …
Who is the assignee on this patent?
Xyzprinting Inc, Kinpo Elect Inc, Cal Comp Electronics & Communications Company Ltd
What technology area does this patent fall under?
Primary CPC classification B29C67/0088. Mapped technology areas include Operations & Transport.
When was this patent published?
Publication date Tue Jul 31 2018 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).