Method for sealing a fastener

US10035287B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-10035287-B2
Application numberUS-201414543253-A
CountryUS
Kind codeB2
Filing dateNov 17, 2014
Priority dateNov 17, 2014
Publication dateJul 31, 2018
Grant dateJul 31, 2018

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

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  7. Citations and related patents

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Abstract

Official abstract text for this publication.

A method for sealing a fastener employs a mold which provided with an inlet port for molding material. The mold is then positioned over a fastener and the mold is sealed against a structure. A molding material is then injected into the mold. The mold is then removed to leave an in-situ molded cap formed over the fastener and sealed to the structure.

First claim

Opening claim text (preview).

What is claimed is: 1. A method for sealing a fastener comprising the steps of: providing a mold having an inlet port for molding material; positioning the mold over a fastener; sealing the mold against a structure; injecting a thermoplastic elastomer (TPE) molding material in a plastic state into the mold to fill the mold with any overflow routed through an overflow port, said TPE selected from a set of thermoplastic polyether-ester block copolymers, thermoplastic fluoroelastomers, Polyarylsulphones (PSU) or polyphenylsulfones (PPSU); cooling the TPE yielding a preliminary cure without chemical reaction; and, removing the mold to leave an in-situ formed molded cap over the fastener and sealed to the structure. 2. The method as defined in claim 1 wherein the molding material adheres to the fastener and the structure. 3. The method as defined in claim 1 wherein the mold provides a sealing circumference on a surface of the structure around the fastener, said molded cap sealed to the surface within the sealing circumference. 4. The method as defined in claim 1 wherein the mold is formed from Polytetrafluoroethylene (PTFE). 5. The method as defined in claim 4 further comprising spraying a release agent into a cavity in the mold prior to positioning the mold. 6. The method as defined in claim 1 further comprising applying a surface treatment to the surface prior to positioning the mold. 7. The method as defined in claim 1 wherein the step of injecting molding material is performed with a handheld hot melt gun inducing the plastic state in the thermoplastic elastomer. 8. The method as defined in claim 1 wherein the steps of applying the mold and sealing the mold are automated. 9. The method as defined in claim 1 wherein the fastener comprises an array of fasteners and the step of positioning the mold comprises positioning the mold over the array of fasteners. 10. The method as defined in claim 6 where in the step of applying a surface treatment comprises applying a primer over the surface within the sealing circumference. 11. The method as defined in claim 6 where in the step of applying a surface treatment comprises applying an adhesive over the surface within the sealing circumference.

Assignees

Inventors

Classifications

  • PTFE, i.e. polytetrafluoroethylene, e.g. ePTFE, i.e. expanded polytetrafluoroethylene · CPC title

  • Injection pistols · CPC title

  • by injecting a settable material after the screwing down · CPC title

  • Transition metals · CPC title

  • Thermoplastic elastomers · CPC title

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Frequently asked questions

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What does patent US10035287B2 cover?
A method for sealing a fastener employs a mold which provided with an inlet port for molding material. The mold is then positioned over a fastener and the mold is sealed against a structure. A molding material is then injected into the mold. The mold is then removed to leave an in-situ molded cap formed over the fastener and sealed to the structure.
Who is the assignee on this patent?
Boeing Co
What technology area does this patent fall under?
Primary CPC classification B29C45/14819. Mapped technology areas include Operations & Transport.
When was this patent published?
Publication date Tue Jul 31 2018 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 1 related publication on this page (citations in our corpus or others sharing the same primary CPC).