Soldering flux and solder paste composition

Patent metadata

Field	Value
Publication number	US-10035222-B2
Application number	US-201414495900-A
Country	US
Kind code	B2
Filing date	Sep 25, 2014
Priority date	Sep 30, 2013
Publication date	Jul 31, 2018
Grant date	Jul 31, 2018

Abstract

A soldering flux includes a base resin, an activator, and a solvent. The activator contains an acrylic resin having an acid value of not more than 50 mg KOH/g and represented by a general formula (1).

A monomer weight ratio of a, b, and c is b/(a+b+c)≥0.6, at least one of a and c may be 0, R 1 is an alkyl group having a carbon number of 8 to 24, R 2 is a substituent other than the R 1 and may be one of substituents including a hydrogen atom, a methyl group, an alkyl group, an aryl group, and a hydroxyl group or a combination of a plurality of substituents, and R 3 , R 4 , and R 5 are hydrogen atoms or methyl groups. The solvent contains a compound having a carboxyl group in a cyclohexyl skeleton and represented by a general formula (2).

First claim

What is claimed is:

1. A soldering flux comprising:
a base resin containing an acrylic resin and an other resin other than the acrylic resin, the acrylic resin having an acid value of not more than 30 mg KOH/g and represented by a general formula (1)

 wherein a monomer weight ratio of a, b, and c is b/(a+b+c)≤0.6, at least one of a and c may be 0, R 1 is an alkyl group having a carbon number of 8 to 24, R 2 is a substituent other than the R 1 and may be one of substituents including a hydrogen atom, a methyl group, an alkyl group, an aryl group, and a hydroxyl group or a combination of a plurality of substituents, and R 3 , R 4 , and R 5 are hydrogen atoms or methyl groups;
an activator containing a compound having a carboxyl group in a cyclohexyl skeleton and represented by a general formula (2)

 wherein, R 6 is a hydrogen atom or a methyl group, X is any one of a carboxyl group, an alkyl group, and a cyclic structure bonded with an alkylene group (a single or a plurality of rings may be formed, and partially unsaturated bond, a carboxyl group, a carboxylic anhydride group, a halogen group, an aromatic ring, and an amino group may be contained), X may be one of the above substituents or a combination of a plurality of substituents, and X may contain a halogen group or an amino group and an alkylated amino group as substituents; and
a solvent,
wherein, when a compounding ratio of the acrylic resin having an acid value of not more than 30 mg KOH/g and represented by the general formula (1) is 1, a compounding ratio of the other resin is not more than 0.3.

2. The soldering flux according to claim 1 , wherein a weight average molecular weight of the acrylic resin having an acid value of not more than 30 mg KOH/g and represented by the general formula (1) is from 12,000 to 40,000.

3. The soldering flux according to claim 2 , wherein a compounding amount of the acrylic resin having an acid value of not more than 30 mg KOH/g and represented by the general formula (1) is from 5% by weight to 50% by weight based on a total amount of the soldering flux, and a compounding amount of the activator is from 5% by weight to 50% by weight based on the total amount of the soldering flux.

4. The soldering flux according to claim 2 , wherein the compound having a carboxyl group in a cyclohexyl skeleton and represented by the general formula (2) is at least one of a rosin compound (abietic acid, abietic acid isomer, abietic acid, or a derivative of abietic acid isomer) and cyclohexanedicarboxylic acid.

5. A solder paste composition comprising:
a solder alloy powder; and
a soldering flux comprising:
a base resin containing an acrylic resin and an other resin other than the acrylic resin, the acrylic resin having an acid value of not more than 30 mg KOH/g and represented by a general formula (1)

 wherein a monomer weight ratio of a, b, and c is b/(a+b+c)≤0.6, at least one of a and c may be 0, R 1 is an alkyl group having a carbon number of 8 to 24, R 2 is a substituent other than the R 1 and may be one of substituents including a hydrogen atom, a methyl group, an alkyl group, an aryl group, and a hydroxyl group or a combination of a plurality of substituents, and R 3 , R 4 , and R 5 are hydrogen atoms or methyl groups;
an activator containing a compound having a carboxyl group in a cyclohexyl skeleton and represented by a general formula (2)

 wherein, R 6 is a hydrogen atom or a methyl group, X is any one of a carboxyl group, an alkyl group, and a cyclic structure bonded with an alkylene group (a single or a plurality of rings may be formed, and partially unsaturated bond, a carboxyl group, a carboxylic anhydride group, a halogen group, an aromatic ring, and an amino group may be contained), X may be one of the above substituents or a combination of a plurality of substituents, and X may contain a halogen group or an amino group and an alkylated amino group as substituents; and

a solvent,
wherein, when a compounding ratio of the acrylic resin having an acid value of not more than 30 mg KOH/g and represented by the general formula (1) is 1, a compounding ratio of the other resin is not more than 0.3.

6. The soldering flux according to claim 2 , wherein the monomer weight ratio of a, b, and c is b/(a+b+c)≤0.6, c is 0, R 1 is an alkyl group having a carbon number of 8 to 24, R 2 is a substituent other than the R 1 and may be one of substituents including a hydrogen atom, a methyl group, an alkyl group, an aryl group, and a hydroxyl group or a combination of a plurality of substituents, and R 3 , R 4 , and R 5 are hydrogen atoms or methyl groups of the activator containing an acrylic resin having an acid value of not more than 30 mg KOH/g and represented by the general formula (1).

7. The soldering flux according to claim 1 , wherein a compounding amount of the acrylic resin having an acid value of not more than 30 mg KOH/g and represented by the general formula (1) is from 5% by weight to 50% by weight based on a total amount of the soldering flux, and a compounding amount of the activator is from 5% by weight and 50% by weight based on the total amount of the soldering flux.

8. The soldering flux according to claim 2 , wherein the compound having a carboxyl group in a cyclohexyl skeleton and represented by the general formula (2) is at least one of a cyclohexane carboxylic acid, 1,4-cyclohexane dicarboxylic acid, 1,3-cyclohexane dicarboxylic acid, 4-aminocyclohexanecarboxylic acid, hydrogenated trimellitic acid, and hydrogenated pyromellitic acid.

9. The soldering flux according to claim 2 , wherein the compound having a carboxyl group in a cyclohexyl skeleton and represented by the general formula (2) is 1,4-cyclohexane dicarboxylic acid.

10. The soldering flux according to claim 1 , wherein a weight average molecular weight of the acrylic resin having an acid value of not more than 30 mg KOH/g and represented by the general formula (1) is from 15,000 to 40,000.

11. The solder paste composition according to claim 5 , wherein a weight average molecular weight of the acrylic resin having an acid value of not more than 30 mg KOH/g and represented by the general formula (1) is from 15,000 to 40,000.

12. The solder paste composition according to claim 5 , wherein a compounding amount of the solder alloy powder is preferably not less than 65% by weight and not more than 95% by weight based on a total amount of the solder paste composition.

Assignees

• Tamura Seisakusho Kk

Inventors

• Tsuchiya Masahiro
• Kitamura Akira
• Seino Momoko
• Arai Masaya

Classifications

• B23K35/3613 Primary

  Polymers, e.g. resins · CPC title

• B23K35/362

  Selection of compositions of fluxes (B23K35/365, B23K35/368 take precedence) · CPC title