Compute device casing that doubles as packaging and shipping container for the compute device

Patent metadata

Field	Value
Publication number	US-10034405-B2
Application number	US-201615212452-A
Country	US
Kind code	B2
Filing date	Jul 18, 2016
Priority date	Jun 9, 2014
Publication date	Jul 24, 2018
Grant date	Jul 24, 2018

Abstract

A method for structurally protecting an information handling system (IHS) for both shipment and operation includes: providing a lightweight server (LWS) chassis; providing a casing that is formed of structurally rigid material to protect the server chassis and any functional compute components inserted within the server chassis; inserting the LWS chassis into the casing; and fully enclosing the LWS chassis within the casing using sealable flaps of the casing such that the casing can be utilized as an external shipping carton in which the IHS is physically shipped to a destination.

First claim

What is claimed is:

1. A method for structurally protecting an information handling system (IHS) for both shipment and operation, the method comprising:
forming more than one receptacle on a top surface of a lightweight server (LWS) chassis to engageably receive respective more than one selected modular, functional compute component, the LWS chassis providing structural support for each of the more than one modular functional compute component during both shipping and utilization at a final end customer/destination, with internal cabling connecting the compute components to form a functional IHS;
providing a casing that is formed of structurally rigid material to protect the LWS chassis and any functional compute components inserted within the LWS chassis;
inserting the LWS chassis into the casing; and
fully enclosing the LWS chassis within the casing using sealable flaps of the casing such that the casing can be utilized as an external shipping carton in which the IHS is physically shipped to a destination.

2. The method of claim 1 , wherein providing the casing further comprises sizing the casing to closely receive the LWS chassis to prevent relative movement of the LWS chassis within the casing.

3. The method of claim 1 , further comprising adhesively attaching the LWS chassis to the casing.

4. The method of claim 1 , wherein providing the casing further comprises manufacturing at least one or more portions of the casing using impact tolerant material.

5. The method of claim 1 , wherein providing the casing further comprises providing a selectably removable portion of the casing that encloses the compute components during shipping and enables exterior access to one or more modular, functional compute components located on the chassis by removal of the removable portion after shipping.

6. The method of claim 5 , wherein providing the selectably removable portion further comprises forming perforated segments in the casing that can be removed after shipping of the IHS.

7. The method of claim 5 , wherein providing the selectably removable portion further comprises forming a required removable opening for power cabling in the casing.

8. The method of claim 5 , wherein providing the selectably removable portion further comprises forming a required removable opening for communication cabling in the casing.

9. The method of claim 5 , wherein providing the selectably removable portion further comprises forming a required removable opening for air flow in the casing.

10. The method of claim 5 , wherein providing the selectably removable portion further comprises attaching the selectably removal portions with releasable adhesive.

11. The method of claim 1 , wherein providing the casing further comprises providing a base segment, a top segment, a front segment, a back segment and a pair of lateral sides interconnected in a net for forming into a cuboid of an impact tolerant material.

12. The method of claim 1 , wherein at least one of forming the more than one receptacle on a top surface of the LWS chassis and providing the casing comprises incorporating electromagnetic shielding material for shielding a user from electromagnetic interference (EMI) generated by the compute components and shielding the compute components from electrostatic damage.

13. The method of claim 1 , wherein forming the more than one receptacle on the top surface of the LWS chassis comprises forming a slot sized to fit a particular compute component that is engaged around at least a portion of a lower outer edge of the compute component by a raised portion of the top surface and exposing an upper portion for interconnecting with the internal cabling.

14. The method of claim 1 , wherein at least one of forming the more than one receptacle on a top surface of the LWS chassis and providing the casing comprises incorporating thermal shielding material that is flame retardant and heat resistant.

15. The method of claim 1 , further comprising adhesively attaching the more than one compute component respectively to the more than one receptacle of the LWS chassis.

16. The method of claim 1 , further comprising:
making a cover component that includes one or more downward projections; and
assembling the cover component onto the LWS chassis causing the one or more downward projections to opposingly contact the more than one compute component respectively to serve as a selected one or more of void filler and shock mounting.

17. The method of claim 16 , wherein:
making the cover component further comprises making the cover component to include one or more non-contacting portions; and
assembling the cover component onto the LWS chassis allows air flow between the non-contacting portions and respective compute components of the more than one compute component.

18. The method of claim 1 , wherein forming the more than one receptacle on the top surface of the LWS chassis comprises forming the receptacle via a selected one of: (i) stamping; and (ii) vacuum molding a pliable material.

19. The method of claim 18 , wherein the pliable material comprises a selected one of:
(i) a thermal polymer; and (ii) an epoxy resin.

Assignees

• Dell Products Lp

Inventors

• Bailey Edmond I
• Carver Walter
• Embleton Steven

Classifications

• H10W40/47

  by flowing liquids, e.g. forced water cooling · CPC title

• H05K9/0007

  Casings (standardised racks H05K9/0062) · CPC title

• H05K7/1491

  having cable management arrangements (management of optical cables G02B6/444; in telecommunication cabinets H04Q1/06) · CPC title

• B65B25/00

  Packaging other articles presenting special problems (bundling B65B27/00) · CPC title

• H05K7/1487 Primary

  Blade assemblies, e.g. blade cases or inner arrangements within a blade · CPC title