Decoupling device, radio frequency coil and magnetic resonance imaging apparatus

Patent metadata

Field	Value
Publication number	US-10033095-B2
Application number	US-201514607898-A
Country	US
Kind code	B2
Filing date	Jan 28, 2015
Priority date	Jan 29, 2014
Publication date	Jul 24, 2018
Grant date	Jul 24, 2018

Abstract

A decoupling device includes a first substrate, a first inductive coil printed on the first substrate, a second substrate, a second inductive coil printed on the second substrate, and a joining component. The joining component is for joining the first substrate to the second substrate. The first inductive coil and the second inductive coil have an area of overlap.

First claim

The invention claimed is:

1. A decoupling device comprising:
a first substrate;
a first inductive coil disposed on the first substrate;
a second substrate;
a second inductive coil disposed on the second substrate; and
a joining component that joins the first substrate to the second substrate,
wherein the first inductive coil and second inductive coil have an area of overlap when the first substrate and the second substrate are joined by the joining component, and
wherein the first inductive coil is connected to a first antenna unit, and the second inductive coil is connected to a second antenna unit.

2. The decoupling device of claim 1 , wherein the joining component comprises a fastener and a slot, and
wherein the fastener is arranged on the first substrate, the slot is arranged on the second substrate, and the fastener engages with the slot.

3. The decoupling device of claim 2 , wherein the slot is a first slot,
wherein the joining component further comprises a second slot, and
wherein the size of the area of overlap is adjusted by the first slot.

4. The decoupling device of claim 1 , wherein the first inductive coil is a spiral inductive coil, the second inductive coil is a spiral inductive coil, or the first inductive coil is a spiral inductive coil and the second inductive coil is a spiral inductive coil.

5. The decoupling device of claim 1 , wherein the first substrate comprises a guide hole, the first inductive coil being printed on a front surface and a back surface of the first substrate by passing through the guide hole, the second substrate comprises a guide hole, the second inductive coil being printed on a front surface and a back surface of the second substrate by passing through the guide hole, or a combination thereof.

6. The decoupling device of claim 1 , wherein the first inductive coil, the second inductive coil, or the first inductive coil and the second inductive coil are formed by copper, tin, a lead-tin alloy, a tin-copper alloy, or a combination thereof.

7. A radio frequency (RF) coil comprising:
a decoupling device comprising:
a first substrate;
a first inductive coil disposed on the first substrate;
a second substrate;
a second inductive coil disposed on the second substrate; and
a joining component that joins the first substrate to the second substrate,

wherein the first inductive coil and second inductive coil have an area of overlap;
a first antenna unit; and
a second antenna unit,
wherein the first antenna unit is connected to the first inductive coil, and the second antenna unit is connected to the second inductive coil.

8. The RF coil of claim 7 , wherein the second antenna unit is adjacent or second-adjacent to the first antenna unit.

9. The RF coil of claim 7 , wherein the RF coil is an RF phased array coil.

10. The RF coil of claim 7 , wherein the joining component comprises a fastener and a slot, and
wherein the fastener is arranged on the first substrate, the slot is arranged on the second substrate, and the fastener engages with the slot.

11. The RF coil of claim 10 , wherein the slot is a first slot,
wherein the joining component further comprises a second slot, and
wherein the size of the area of overlap is adjusted by the first slot.

12. The RF coil of claim 7 , wherein the first inductive coil is a spiral inductive coil, the second inductive coil is a spiral inductive coil, or the first inductive coil is a spiral inductive coil and the second inductive coil is a spiral inductive coil.

13. The RF coil of claim 7 , wherein the first substrate comprises a guide hole, the first inductive coil being printed on a front surface and a back surface of the first substrate by passing through the guide hole, the second substrate comprises a guide hole, the second inductive coil being printed on a front surface and a back surface of the second substrate by passing through the guide hole, or a combination thereof.

14. The RF coil of claim 7 , wherein the first inductive coil, the second inductive coil, or the first inductive coil and the second inductive coil are formed by copper, tin, a lead-tin alloy, a tin-copper alloy, or a combination thereof.

15. A magnetic resonance imaging system comprising:
a radio frequency (RF) coil comprising:
a decoupling device comprising:
a first substrate;
a first inductive coil disposed on the first substrate;
a second substrate;
a second inductive coil disposed on the second substrate; and
a joining component that joins the first substrate to the second substrate, wherein the first inductive coil and second inductive coil have an area of overlap;

a first antenna unit; and
a second antenna unit,

wherein the first antenna unit is connected to the first inductive coil, and the second antenna unit is connected to the second inductive coil.

16. The magnetic resonance imaging system of claim 15 , wherein the second antenna unit is adjacent or second-adjacent to the first antenna unit.

17. The magnetic resonance imaging system of claim 15 , wherein the RF coil is an RF phased array coil.

Assignees

• Chen Yan Hong
• Tong Tong
• Siemens Ag

Inventors

• Chen Yan Hong
• Tong Tong

Classifications

• H01Q1/523 Primary

  between antennas of an array · CPC title

• G01R33/365 Primary

  Decoupling of multiple RF coils wherein the multiple RF coils have the same function in MR, e.g. decoupling of a receive coil from another receive coil in a receive coil array, decoupling of a transmission coil from another transmission coil in a transmission coil array · CPC title

• G01R33/34007

  Manufacture of RF coils, e.g. using printed circuit board technology; additional hardware for providing mechanical support to the RF coil assembly or to part thereof, e.g. a support for moving the coil assembly relative to the remainder of the MR system · CPC title