Encapsulating material, encapsulating cover plate, sintering equipment, sintering method, and display apparatus

Patent metadata

Field	Value
Publication number	US-10033011-B1
Application number	US-201715565901-A
Country	US
Kind code	B1
Filing date	Apr 13, 2017
Priority date	May 13, 2016
Publication date	Jul 24, 2018
Grant date	Jul 24, 2018

Abstract

Embodiments of this disclosure provide an encapsulating material, an encapsulating cover plate, a sintering equipment, a sintering method, and a display apparatus, and relate to the technical field of display. This encapsulating material comprises a leveling auxiliary material, wherein the leveling auxiliary material is used to move upon excitation so as to level the encapsulating material when the encapsulating material is subjected to sintering, and is thus used in the encapsulation of a cover plate to be encapsulated and an encapsulating cover plate.

First claim

What is claimed is:

1. A sintering equipment for sintering an encapsulating cover plate comprising an encapsulating area coated with an encapsulating material, wherein the encapsulating material comprises a leveling auxiliary material, wherein when the encapsulating material is subjected to sintering, the leveling auxiliary material moves upon excitation so as to level the encapsulating material, and the sintering equipment comprises an exciting apparatus, a heating apparatus, and a base, wherein:
the base is provided with a conveying area;
the heating apparatus is configured for heating the encapsulating cover plate;
the base is configured for supporting the encapsulating cover plate, and the encapsulating area of the encapsulating cover plate corresponds to the conveying area; and
the exciting apparatus is configured for exciting the movement of the leveling auxiliary material in the encapsulating material through the conveying area.

2. The sintering equipment according to claim 1 , wherein the exciting apparatus is an electromagnetic wave emitting apparatus.

3. The sintering equipment according to claim 1 , wherein a shape and size of the conveying area are consistent with a shape and size of the encapsulating area.

4. The sintering equipment according to claim 1 , wherein the conveying area is an enclosed groove.

5. A sintering method, comprising the steps of:
placing an encapsulating cover plate comprising an encapsulating area coated with an encapsulating material on a base of a sintering equipment that includes an exciting apparatus, a heating apparatus, and the base, and allowing the encapsulating area to correspond to a conveying area on the base, wherein the encapsulating material comprises a leveling auxiliary material, wherein when the encapsulating material is subjected to sintering, the leveling auxiliary material moves upon excitation so as to level the encapsulating material;
controlling a temperature of the heating apparatus so that the encapsulating material coated on the encapsulating cover plate is in a melted state; and
starting the exciting apparatus to excite movement of the leveling auxiliary material in the encapsulating material through the conveying area on the base,
wherein:
the base is provided with the conveying area;
the heating apparatus is configured for heating the encapsulating cover plate;
the base is configured for supporting the encapsulating cover plate, and the encapsulating area of the encapsulating cover plate corresponds to the conveying area; and
the exciting apparatus is configured for exciting the movement of the leveling auxiliary material in the encapsulating material through the conveying area.

6. The sintering method according to claim 5 , wherein
the leveling auxiliary material is a magnetic material;
the exciting apparatus is an electromagnetic wave emitting apparatus; and
the step of starting the exciting apparatus to excite the movement of the leveling auxiliary material in the encapsulating material through the conveying area on the base comprises: starting the electromagnetic wave emitting apparatus so that an electromagnetic wave emitted from the electromagnetic wave emitting apparatus excites the movement of the magnetic material through the conveying area on the base.

7. The sintering method according to claim 6 , wherein
the conveying area is an enclosed groove; and
the step of starting the electromagnetic wave emitting apparatus so that an electromagnetic wave emitted from the electromagnetic wave emitting apparatus excites the movement of the magnetic material through the conveying area on the base comprises: starting the electromagnetic wave emitting apparatus so that the electromagnetic wave emitted from the electromagnetic wave emitting apparatus excites the movement of the magnetic material through the enclosed groove on the base.

8. A display apparatus, comprising a cover plate to be encapsulated and an encapsulating cover plate sintered by the sintering method of claim 5 .

9. The display apparatus according to claim 8 , wherein an organic electroluminescence structure is provided on the cover plate to be encapsulated.

Assignees

• Boe Technology Group Co Ltd
• Ordos Yuansheng Optoelectronics Co Ltd

Inventors

• Chen Jingjing
• Zhang Liang
• Cui Fuyi
• Wang Lina
• Li Xuewei

Classifications

• C03C27/06

  Joining glass to glass by processes other than fusing (fusing C03B23/20; units for use as elements for closing wall or like openings and comprising two or more parallel glass panes in spaced relationship, the panes being permanently secured together E06B3/66) · CPC title

• H01L27/3244

  Electricity · mapped topic

• C03B19/06 Primary

  by sintering, {e.g. by cold isostatic pressing of powders and subsequent sintering, by hot pressing of powders, by sintering slurries or dispersions not undergoing a liquid phase reaction} · CPC title

• H01L51/56

  Electricity · mapped topic

• H01L51/5246 Primary

  Electricity · mapped topic