Integrated chip and manufacturing method therefor, and full-color integrated chip and display panel
US-12183868-B2 · Dec 31, 2024 · US
US10032964B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-10032964-B2 |
| Application number | US-201514624750-A |
| Country | US |
| Kind code | B2 |
| Filing date | Feb 18, 2015 |
| Priority date | Sep 23, 2009 |
| Publication date | Jul 24, 2018 |
| Grant date | Jul 24, 2018 |
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In various embodiments, the present invention relates to a plurality of coated primary particles, each primary particle including a primary matrix material and containing a population of semiconductor nanoparticles, wherein each primary particle is provided with a separate layer of a surface coating material. Various methods of preparing such particles are described. Composite materials and light-emitting devices incorporating such primary particles are also described.
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What is claimed is: 1. A method for preparing a bead-in-bead composite material, the method comprising: randomly incorporating a population of semiconductor nanoparticles within a plurality of primary beads, each primary bead comprising a primary matrix material; providing each of said primary beads with a separate layer of a first surface coating material to form a plurality of coated primary beads; and dispersing the plurality of coated primary beads within a secondary bead to form the bead-in-bead composite material, the secondary bead comprising a secondary matrix material. 2. The method recited in claim 1 , wherein the surface coating is provided separately on each primary particle by a chemical deposition technique. 3. The method recited in claim 2 , wherein said technique is atomic layer deposition. 4. The method recited in claim 3 , wherein said atomic layer deposition process employs a reaction temperature of around 100 to 500° C. 5. The method recited in claim 3 , where said atomic layer deposition process is controlled to provide a surface coating layer thickness of around 1 to 500 nm. 6. The method recited in claim 3 , wherein said atomic layer deposition process employs a metal precursor and an oxide precursor to deposit one or more layers of a metal oxide on a surface of the primary beads. 7. The method recited in claim 1 , wherein the surface coating is produced in-situ on a surface of each primary bead. 8. The method recited in claim 7 , wherein producing the surface coating comprises contacting said surface of each primary particle with one or more polymerizable monomers and subsequently polymerizing said monomer(s) on the surface of each primary bead to produce a separate polymeric surface coating on each primary bead. 9. The method recited in claim 8 , wherein contacting of the primary beads by the polymerizable monomer(s) is effected by dispersing the primary beads within a monomer mixture, optionally including a crosslinking agent and/or polymerization initiator, and subsequently effecting polymerization of the monomer(s). 10. The method of claim 1 , wherein the primary beads are prefabricated beads. 11. The method of claim 10 , wherein the prefabricated beads are silica beads. 12. The method of claim 10 , wherein the prefabricated beads are any one of a polystyrene bead, a polydivinyl benzene bead, and a polythiol bead. 13. The method of claim 10 , wherein the prefabricated beads are porous. 14. The method of claim 1 , wherein the secondary matrix material is selected from the group consisting of a polymer, a resin, a monolith, a glass, sol gel, an epoxy, a silicone, and a (meth)acrylate. 15. The method of claim 1 , further comprising: coating the secondary bead with a layer of a second surface coating material to form a coated secondary bead.
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