Light emitting diode package module and display device having the same

Patent metadata

Field	Value
Publication number	US-10032963-B2
Application number	US-201715480094-A
Country	US
Kind code	B2
Filing date	Apr 5, 2017
Priority date	Apr 29, 2016
Publication date	Jul 24, 2018
Grant date	Jul 24, 2018

Abstract

Disclosed herein are an LED package module capable of lowering the price of manufacture by simply reducing the number of LED packages without decreasing the luminance, and a display device having the same. To this end, in an LED package module according to an exemplary embodiment of the present disclosure and a display device having the same, a plurality of LED packages is mounted on an LED module substrate in a matrix such that the LED packages are oriented in intersecting directions alternately in each of the longitudinal and lateral directions. Consequently, it is possible to increase price competitiveness by simply reducing the number of LED packages without degrading the display quality.

First claim

What is claimed is:

1. An LED package module, comprising:
an LED module substrate; and
a plurality of LED packages mounted on the LED module substrate, each of the plurality of LED packages having a long axis and a short axis,
wherein each of the plurality of LED packages includes:
at least one LED chip mounted on a substrate;
a mold frame supporting the LED chip, the mold frame having two closed side surfaces in parallel with the long axis and two open side surfaces in parallel with the short axis; and
an encapsulant sealing the substrate and the LED chip in the mold frame, the encapsulant being at least partially exposed along the two open side surfaces of the mold frame.

2. The LED package module of claim 1 , wherein the plurality of LED packages comprises first LED packages mounted on the LED substrate with the open side surfaces aligned in a first direction, and second LED packages mounted on the LED substrate with the open side surfaces aligned in a second direction that intersects the first direction.

3. The LED package module of claim 2 , wherein the first and second LED packages are arranged in a matrix of columns and rows, and are oriented in the intersecting first and second directions, respectively, alternately in each of the columns and rows.

4. The LED package module of claim 3 , wherein each of the first and second LED packages has a beam angle of 125 to 130 degrees.

5. The LED package module of claim 4 , wherein a center axis of a respective one of the first LED packages is spaced apart from a center axis of an adjacent second LED package in a same column by a first distance, and the center axis of the respective one of the first LED packages is spaced apart from a center axis of an adjacent second LED package in a same row by a second distance.

6. The LED package module of claim 5 , wherein the first distance is within a range of 37 mm to 42 mm, and the second distance is within a range of 38 mm to 42 mm.

7. The LED package module of claim 1 , wherein the plurality of LED packages are arranged in a plurality of diamond patterns, each of the plurality of diamond patterns including two first LED packages that are mounted on the LED substrate with the open side surfaces aligned in a first direction, and two second LED packages that are mounted on the LED substrate with the open side surfaces aligned in a second direction that intersects the first direction.

8. A display device, comprising:
a display panel;
a main support disposed under the display panel to support edges of the display panel;
a plurality of optical sheets seated on the main support;
a bottom cover mounted under the main support;
an LED package module mounted on the bottom cover;
a reflective plate mounted on the LED package module and having a plurality of through holes through which the LED package module at least partially protrudes; and
a top case mounted on the display panel and coupled to the main support and the display panel,
wherein the LED package module includes an LED module substrate and a plurality of LED packages mounted on the LED module substrate, each of the plurality of LED packages having a long axis and a short axis, and
wherein each of the plurality of LED packages includes:
at least one LED chip mounted on a substrate;
a mold frame supporting the LED chip, the mold frame having two closed side surfaces in parallel with the long axis and two open side surfaces in parallel with the short axis; and
an encapsulant sealing the substrate and the LED chip in the mold frame, the encapsulant being at least partially exposed along the two open side surfaces of the mold frame.

9. The display device of claim 8 , wherein the plurality of LED packages includes first LED packages mounted on the LED substrate with the open side surfaces aligned in a first direction, and second LED packages mounted on the LED substrate with the open side surfaces aligned in a second direction that intersects the first direction.

10. The display device of claim 9 , wherein the first and second LED packages are arranged in a matrix of columns and rows, each column and each row having an alternating arrangement of the first and second LED packages.

11. The display device of claim 10 , wherein each of the first and second LED packages has a beam angle within a range of 125 degrees to 130 degrees.

12. The display device of claim 11 , wherein a center axis of a respective one of the first LED packages is spaced apart from a center axis of an adjacent second LED package in a same column by a first distance, and the center axis of the respective one of the first LED packages is spaced apart from a center axis of an adjacent second LED package in a same row by a second distance.

13. The display device of claim 8 , wherein the plurality of LED packages are arranged in a plurality of diamond patterns, each of the plurality of diamond patterns including two first LED packages that are mounted on the LED substrate with the open side surfaces aligned in a first direction, and two second LED packages that are mounted on the LED substrate with the open side surfaces aligned in a second direction that intersects the first direction.

14. A display device comprising:
a display panel;
a main support disposed under the display panel to support edges of the display panel;
a plurality of optical sheets seated on the main support;
a bottom cover mounted under the main support;
an LED package module mounted on the bottom cover at a position adjacent to at least one edge of the bottom cover;
a reflective plate mounted on the bottom cover;
a light guide plate mounted between the reflective plate and the optical sheets, the light guide plate having a side surface facing the LED package module; and
a top case mounted on the display panel and coupled to the main support and the display panel,
wherein the LED package module includes an LED module substrate and a plurality of LED packages mounted on the LED module substrate, each of the plurality of LED packages having a long axis and a short axis, and
wherein each of the plurality of LED packages includes:
at least one LED chip mounted on a substrate;
a mold frame supporting the LED chip, the mold frame having two closed side surfaces in parallel with the long axis and two open side surfaces in parallel with the short axis; and
an encapsulant sealing the substrate and the LED chip in the mold frame, the encapsulant being at least partially exposed along the two open side surfaces of the mold frame.

15. The display device of claim 14 , wherein the LED package module further comprises at least one buffer pad mounted on the LED substrate, the at least one buffer pad extending farther toward the side surface of the light guide plate than the LED packages.

16. The display device of claim 15 , wherein the at least one buffer pad extends at least partially between a pair of adjacent LED packages.

17. The display device of claim 15 , wherein the at least one buffer pad has a milky color.

18. The display device of claim 17 , wherein the buffer pad is composed of 95% to 99% by weight of a base resin and 1% to 5% by weight of a milky pigment.

19. The display device of claim 18 , wherein the base resin includes at least one of: polycarbonate (PC), polyimide resin (PI), polyethylene terephthalate (PET), and polyether sulfone (PES), and wherein the milky pigment includes silsesquioxane.

20. The display device of claim 15 , wherein the at least one buffer pad has a transmittance in a range of 50% to 90%.

Assignees

• Lg Display Co Ltd

Inventors

• Park Kiduck
• Park Jongwan
• Chung Donghyun
• Park Junsoo

Classifications

• H10W90/00

  Package configurations · CPC title

• G02F1/133605

  including specially adapted reflectors · CPC title

• G02F1/133603

  with LEDs · CPC title

• G02F1/1336 Primary

  Illuminating devices · CPC title

• H01L33/56

  Electricity · mapped topic