Systems and methods for transfer of micro-devices

Patent metadata

Field	Value
Publication number	US-10032827-B2
Application number	US-201615270763-A
Country	US
Kind code	B2
Filing date	Sep 20, 2016
Priority date	Jun 29, 2016
Publication date	Jul 24, 2018
Grant date	Jul 24, 2018

Abstract

An apparatus for positioning micro-devices on a substrate includes one or more supports to hold a donor substrate and a destination substrate, an adhesive dispenser to deliver adhesive on micro-devices on the donor substrate, a transfer device including a transfer surface to transfer the micro-devices from the donor substrate to the destination substrate, and a controller. The controller is configured to operate the adhesive dispenser to selectively dispense the adhesive onto selected micro-devices on the donor substrate based on a desired spacing of the selected micro-devices on the destination substrate. The controller is configured to operate the transfer device such that the transfer surface engages the adhesive on the donor substrate to cause the selected micro-devices to adhere to the transfer surface and the transfer surface then transfers the selected micro-devices from the donor substrate to the destination substrate.

First claim

What is claimed is:

1. An apparatus for positioning micro-devices on a substrate, the apparatus comprising:
one or more supports to hold a donor substrate and a destination substrate;
an adhesive dispenser to deliver adhesive onto micro-devices on the donor substrate by ejecting droplets of adhesive;
a transfer device including a transfer surface to transfer the micro-devices from the donor substrate to the destination substrate; and
a controller configured to
operate the adhesive dispenser to selectively dispense the adhesive onto selected micro-devices on the donor substrate based on a desired spacing of the selected micro-devices on the destination substrate such that droplets of adhesive are ejected onto less than all of the micro-devices on the donor substrate,
operate the transfer device such that the transfer surface engages the adhesive on the donor substrate to cause the selected micro-devices to adhere to the transfer surface,
operate the transfer device to withdraw the transfer surface from the donor substrate such that the selected micro-devices detach from the donor substrate and remain adhered by the adhesive to the transfer surface,
operate the transfer device to lower the transfer surface toward the destination substrate so that the selected micro-devices engage the destination substrate, and
operate the transfer device to withdraw the transfer surface from the destination substrate such that the selected micro-devices are transferred from the transfer surface to the destination substrate.

2. The apparatus of claim 1 , wherein the controller is configured to operate the transfer device such that the transfer surface transfers first micro-devices to the destination substrate and then transfers second micro-devices to the destination substrate such that the second micro-devices adjacent to the first micro-devices, the first micro-devices and the second micro-devices both having the desired spacing on the destination substrate.

3. The apparatus of claim 2 , wherein the controller is configured to operate the transfer device to transfer the first micro-devices from a first donor substrate and to transfer the second micro-devices from a second donor substrate.

4. The apparatus of claim 1 , wherein the transfer device is a first transfer device, and the apparatus further comprises a second transfer device including a second transfer surface to transfer at least one additional micro-device to the transfer surface of the first transfer device or to the destination substrate.

5. The apparatus of claim 4 , wherein the second transfer device is configured to transfer a single micro-device at a time to a receiving surface, wherein the receiving surface is (i) the transfer surface of the first transfer device or (ii) a surface of the destination substrate.

6. The apparatus of claim 5 , wherein the controller is configured to operate the second transfer device such that the transfer surface of the second transfer device transfers the single micro-device from the donor substrate to a receiving surface to fill a gap between the selected micro-devices on the receiving surface with the single micro-device, thereby achieving a desired arrangement of the selected micro-devices on the receiving surface.

7. The apparatus of claim 5 , wherein the controller is configured to operate the adhesive dispenser to dispense adhesive on the receiving surface after the selected micro-devices are adhered to the receiving surface, and to operate the second transfer device such that the transfer surface of the second transfer device engages the single micro-device with the second dispensed adhesive when the transfer surface of the second transfer device transfers the single micro-device to the receiving surface.

8. The apparatus of claim 4 , wherein the second transfer device is configured to transfer a plurality of micro-devices to the destination substrate.

9. The apparatus of claim 1 , further comprising a sensor to detect one or more defective micro-devices on the donor substrate, and wherein the controller is configured to selectively dispense the adhesive such that the adhesive is not dispensed on the one or more failed micro-devices and the selected micro-devices does not comprise the one or more failed micro-devices.

10. The apparatus of claim 9 , wherein the sensor comprises circuitry configured to optically excite the micro-devices on the donor substrate and an optical detector to detect light emitted by the micro-devices on the donor substrate.

11. The apparatus of claim 9 , wherein:
the transfer device is a first transfer device,
the apparatus further comprises a second transfer device including a second transfer surface to transfer a single micro-device at a time to the transfer surface of the first transfer device or transfer micro-devices to the destination substrate, and
the controller is configured to
operate the first transfer device such that the transfer surface of the first transfer device engages the adhesive on the donor substrate to cause the selected micro-devices to adhere to the transfer surface of the first transfer device, and
operate the second transfer device such that the second transfer surface of the second transfer device transfers one or more micro-devices to the transfer surface of the first transfer device based on a location of the one or more defective micro-devices.

12. The apparatus of claim 1 , wherein the transfer surface comprises a stretchable film to receive the selected micro-devices.

13. The apparatus of claim 12 , comprising an actuator coupled to the stretching film, and wherein the controller is configured to cause the actuator to stretch the film such that the selected micro-devices to have the desired spacing when the transfer surface transfers the selected micro-devices to the destination substrate.

14. The apparatus of claim 1 , wherein the transfer device comprises a roller to receive the selected micro-devices from the donor substrate.

15. The apparatus of claim 1 , wherein the transfer surface comprises a planar surface to receive the selected micro-devices from the donor substrate.

16. The apparatus of claim 1 , wherein the transfer device includes a heating element to heat the transfer surface when the transfer surface transfers the selected micro-devices to the destination substrate.

17. The apparatus of claim 1 , further comprising a radiation emitter to emit a pattern of radiation to cure the selectively dispensed adhesive before operating the transfer device.

Assignees

• Applied Materials Inc

Inventors

• Zhu Mingwei
• Ganapathiappan Sivapackia
• Fu Boyi
• Ng Hou T
• Patibandla Nag B

Classifications

• H10W90/00 Primary

  Package configurations · CPC title

• H10W72/0198

  batch processes · CPC title

• H10W72/0711

  Apparatus therefor · CPC title

• H10P74/23

  characterised by multiple measurements, corrections, marking or sorting processes · CPC title

• H10P72/7434

  used in a transfer process involving at least two transfer steps, i.e. including an intermediate handle substrate · CPC title