Heat-insulating wall, and heat-insulating housing and method for producing the same

Patent metadata

Field	Value
Publication number	US-10030805-B2
Application number	US-201314398693-A
Country	US
Kind code	B2
Filing date	Jun 20, 2013
Priority date	Jun 20, 2012
Publication date	Jul 24, 2018
Grant date	Jul 24, 2018

Abstract

A heat-insulating housing ( 21 ) includes: a wall body; and an open-cell resin body ( 4 ) of thermosetting resin with which a heat-insulating space formed by the wall body is filled by integral foaming, the open-cell resin body including: a plurality of cells ( 47 ); a cell film portion ( 42 ); a cell skeleton portion ( 43 ); a first through-hole ( 44 ) formed so as to extend through the cell film portion; and a second through-hole ( 45 ) formed so as to extend through the cell skeleton portion, wherein the plurality of cells communicate with one another through the first through-hole and the second through-hole.

First claim

The invention claimed is:

1. A heat-insulating wall comprising:
a wall body whose hollow portion is a heat-insulating space;
an open-cell resin body formed of a thermosetting resin, with which the heat-insulating space is filled by integral foaming; and
powder dispersed in the open-cell resin body,
the open-cell resin body comprising:
a plurality of cells;
a first through-hole formed so as to extend through the thermosetting resin located between neighboring cells; and
a second through-hole formed at an interface between the thermosetting resin and the powder,
wherein the plurality of cells communicate with one another through the first through-hole and the second through-hole,
the dispersed powder is incompatible with the thermosetting resin, and
the open-cell resin body comprises one of an open-cell urethane foam and an open-cell phenol foam.

2. The heat-insulating wall according to claim 1 , wherein the size of the powder is smaller than the size of the cell.

3. The heat-insulating wall according to claim 1 , wherein the pressure in the wall body is lower than atmospheric pressure.

4. The heat-insulating wall according to claim 1 , further comprising a gas adsorption device disposed in the wall body.

5. The heat-insulating wall according to claim 4 , wherein the gas adsorption device comprises an adsorbent that adsorbs a carbon dioxide gas, and
the adsorbent includes ZSM-5 zeolite ion-exchanged with at least one of barium and strontium.

6. A heat-insulating housing comprising one or more of the heat-insulating walls according to claim 1 .

Assignees

• Panasonic Ip Man Co Ltd

Inventors

• Uekado Kazutaka
• Hirai Tsuyoki

Classifications

• B29L2031/10

  Building elements, e.g. bricks, blocks, tiles, panels, posts, beams {(frameless domes B29L2025/00, doors B29L2031/724)} · CPC title

• C08J2477/00

  Characterised by the use of polyamides obtained by reactions forming a carboxylic amide link in the main chain; Derivatives of such polymers · CPC title

• B29K2075/00

  Use of {PU, i.e.} polyureas or polyurethanes {or derivatives thereof}, as moulding material · CPC title

• B29K2105/045

  with open cells · CPC title

• C08J2205/05

  Open cells, i.e. more than 50% of the pores are open · CPC title