Additive manufacturing for radio frequency hardware
US-9793613-B2 · Oct 17, 2017 · US
US10030298B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-10030298-B2 |
| Application number | US-201514831930-A |
| Country | US |
| Kind code | B2 |
| Filing date | Aug 21, 2015 |
| Priority date | Aug 21, 2015 |
| Publication date | Jul 24, 2018 |
| Grant date | Jul 24, 2018 |
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A surface of an article is modified by first disposing a nickel-enriched region at the surface of a substrate, then enriching the nickel-enriched region with aluminum to form an aluminized region, and finally removing at least a portion of the aluminized region to form a processed surface of the substrate. Upon removal of this material, the roughness of the surface is reduced from a comparatively high initial roughness value to a comparatively low processed roughness value. In some embodiments, the processed roughness is less than about 95% of the initial roughness. Moreover, the sequence of steps described herein may be iterated one or more times to achieve further reduction in substrate surface roughness.
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The invention claimed is: 1. A method for altering the surface of an article, the method comprising: disposing a nickel-enriched region at a surface of a substrate, wherein the substrate has an initial composition prior to the disposing, wherein the surface has an initial roughness, and wherein the nickel-enriched region has a higher nickel concentration than the initial composition of the substrate; heat treating the substrate to form a diffusion zone within the substrate; enriching at least a portion of the nickel-enriched region with aluminum to form an aluminized region; and removing at least a portion of the aluminized region to form a processed surface of the substrate; wherein, after the removing the processed surface has a processed surface roughness that is less than the initial roughness, wherein disposing comprises disposing a nickel-enriched region having a thickness of at least about 50 micrometers. 2. The method of claim 1 , wherein disposing comprises chemical vapor deposition, physical vapor deposition, slurry-based deposition, electroless plating, electroplating, or combinations including at least one of the foregoing. 3. The method of claim 1 , wherein the substrate comprises cobalt, nickel, iron, or combinations including at least one of the foregoing. 4. The method of claim 1 , wherein the initial composition of the substrate comprises at least 50 percent by weight cobalt. 5. The method of claim 1 , wherein the initial composition of the substrate comprises cobalt and chromium. 6. The method of claim 1 , wherein the substrate comprises additively manufactured material. 7. The method of claim 1 , wherein the surface is an internal surface of the substrate. 8. The method of claim 1 , wherein heat treating is performed at a temperature of at least about 1000 degrees Celsius. 9. The method of claim 1 , further comprising isostatically pressing the article. 10. The method of claim 1 , wherein enriching comprises vapor phase aluminizing, slurry aluminizing, or combinations including at least one of the foregoing. 11. The method of claim 1 , further comprising iterating at least once a step sequence comprising the disposing, heat treating, enriching, and removing steps. 12. The method of claim 1 , wherein the initial composition comprises up to about 25 percent by weight nickel. 13. The method of claim 1 , wherein removing comprises chemically or electrochemically removing material. 14. The method of claim 1 , wherein the processed surface roughness is less than about 95% of the initial roughness. 15. The method of claim 1 , wherein the surface has an arithmetic average roughness (R a ) of at least about 200 microinches prior to the disposing. 16. A method for reducing roughness of a surface, comprising: disposing a nickel-enriched region at a surface of a substrate, the nickel-enriched region having a higher nickel concentration than an initial composition of the substrate, wherein the surface has an initial surface roughness, wherein the initial surface roughness is an arithmetic average roughness (Re) of at least about 200 microinches, wherein disposing comprises disposing a nickel-enriched region having a thickness of at least about 50 micrometers; heat treating the substrate to form a diffusion zone within the substrate; enriching at least a portion of the nickel-enriched region with aluminum to form an aluminized region; and removing at least a portion of the aluminized region to form a processed surface of the substrate; wherein, after the removing step, the surface has a processed roughness that is less than the initial roughness. 17. The method of claim 16 , wherein the initial composition of the substrate comprises at least 50 percent by weight cobalt. 18. The method of claim 16 , further comprising iterating at least once a step sequence comprising the disposing, heat treating, enriching, and removing steps. 19. The method of claim 16 , wherein the processed surface of the substrate has a processed surface roughness less than about 95% of the initial surface roughness.
Multi-step processes for surface treatment of metallic material involving at least one process provided for in class C23 and at least one process covered by subclass C21D or C22F or class C25 (coating for obtaining at least two superposed coatings either by methods not provided for in a single one of main groups C23C2/00 - C23C26/00, or by combinations of methods providedfor in subclasses C23C and C25D, C23C28/00) · CPC title
by heat-treatment · CPC title
using solids, e.g. powders, pastes · CPC title
by application of heat or pressure and heat (C23C24/04 takes precedence) · CPC title
of nickel or cobalt · CPC title
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