Coolant composition for fuel cell
US-2024417614-A1 · Dec 19, 2024 · US
US10030185B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-10030185-B2 |
| Application number | US-201515326170-A |
| Country | US |
| Kind code | B2 |
| Filing date | Jul 16, 2015 |
| Priority date | Jul 16, 2014 |
| Publication date | Jul 24, 2018 |
| Grant date | Jul 24, 2018 |
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A hydrofluoroether compound represented by the following general formula (I).
Opening claim text (preview).
What is claimed is: 1. A hydrofluoroether compound represented by the following general formula (I): wherein, (i) Rf 3 is F, Rf 4 is CF 3 , and Rf 1 and Rf 2 are independently perfluoroalkyl groups (a) having 1 to 2 carbon atoms and optionally comprising at least one catenated heteroatom, or (b) that are bonded together to form a ring structure having 4-8 carbon atoms and optionally comprising one or more catenated heteroatoms; or (ii) Rf 3 is CF 3 , Rf 4 is F, and Rf 1 and Rf 2 are independently perfluoroalkyl groups (a) having 1 to 8 carbon atoms and optionally comprising at least one catenated heteroatom, or (b) that are bonded together to form a ring structure having 4 to 8 carbon atoms and optionally comprising one or more catenated heteroatoms; and wherein Rfh is a linear, branched, or cyclic alkyl or fluoroalkyl group of from 1 to 10 carbon atoms that may be saturated or unsaturated and optionally comprises one or more catenated heteroatoms. 2. A working fluid comprising a hydrofluoroether compound according to claim 1 , wherein the hydrofluoroether compound is present in the working fluid at an amount of at least 50% by weight based on the total weight of the working fluid. 3. An apparatus for heat transfer comprising: a device; and a mechanism for transferring heat to or from the device, the mechanism comprising a heat transfer fluid that comprises a hydrofluoroether compound according to claim 1 . 4. An apparatus for heat transfer according to claim 3 , wherein the device is selected from a microprocessor, a semiconductor wafer used to manufacture a semiconductor device, a power control semiconductor, an electrochemical cell, an electrical distribution switch gear, a power transformer, a circuit board, a multi-chip module, a packaged or unpackaged semiconductor device, a fuel cell, and a laser. 5. An apparatus according to claim 1 , wherein the mechanism for transferring heat is a component in a system for maintaining a temperature or temperature range of an electronic device. 6. A method of transferring heat comprising: providing a device; and transferring heat to or from the device using a heat transfer fluid that comprises a hydrofluoroether compound according to claim 1 .
Apparatus for thermal treatment · CPC title
for cooling by change of state · CPC title
the change of state being from liquid to vapour or vice versa · CPC title
not condensed with other rings · CPC title
Liquid materials · CPC title
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