Addition one part curing type heat-conductive silicone grease composition

Patent metadata

Field	Value
Publication number	US-10030184-B2
Application number	US-201615291165-A
Country	US
Kind code	B2
Filing date	Oct 12, 2016
Priority date	Oct 13, 2015
Publication date	Jul 24, 2018
Grant date	Jul 24, 2018

Abstract

Addition one-part curing-type heat-conductive silicone grease composition containing: (A) an organopolysiloxane containing at least one alkenyl group per molecule and having a viscosity of 50-100,000 mPa·s at 25° C.; (B) an organohydrogenpolysiloxane containing at least two silicon-bonded hydrogen atoms per molecule, having no R2SiO unit, having no silicon-bonded hydrogen atom at any terminal end, having the silicon-bonded hydrogen atoms only in a side chain or chains, and being in a substantially straight chain form, in an amount such that the ratio of {the number of Si—H groups}/{the number of alkenyl groups in the composition} is 0.1-5.0; (C) a photoactive-type platinum complex curing catalyst; and (D) a heat-conductive filler, wherein the composition has a viscosity at 25° C. of 30-800 Pa·s as measured by a Malcom viscometer at a rotational speed of 10 rpm. The composition has high shape-retention properties, is low in hardness, and can be stored at normal temperature.

First claim

The invention claimed is:

1. An addition one part curing type heat-conductive silicone grease composition capable of being stored at normal temperature, the composition comprising,
(A) 100 parts by weight of an organopolysiloxane containing at least one alkenyl group per molecule and having a viscosity of 50 mPa·s to 100,000 mPa·s at 25° C.;
(B) an organohydrogenpolysiloxane which contains at least two silicon-bonded hydrogen atoms per molecule, which has no R 2 SiO unit (where R independently represents an unsubstituted or substituted monovalent hydrocarbon group), which has no silicon-bonded hydrogen atom at any terminal end, which has the silicon-bonded hydrogen atoms only in a side chain or chains, and which is in a substantially straight chain form, in an amount such that the ratio of {the number of Si—H groups}/{the number of alkenyl groups in the composition} is in the range from 0.1 to 5.0;
(C) a photoactive type platinum complex curing catalyst selected from the group consisting of

trimethyl(acetylacetonato)platinum complex,
platinum trimethyl(2,4-pentanedionate) complex,
platinum trimethyl(3,5-heptanedionate) complex,
platinum trimethyl(methylacetoacetate) complex,
bis(2,4-pentanedionato)platinum complex,
bis(2,4-hexanedionato)platinum complex,
bis(2,4-heptanedionato)platinum complex,
bis(3,5-heptanedionato)platinum complex,
bis(1-phenyl-1,3-butanedionato)platinum complex,
bis(1,3-diphenyl-1,3-propanedionato)platinum complex,
(1,5-cyclooctadienyl)dimethyl platinum complex,
(1,5-cyclooctadienyl)diphenyl platinum complex,
(1,5-cyclooctadienyl)dipropyl platinum complex,
(2,5-norboradiene)dimethyl platinum complex,
(2,5-norboradiene)diphenyl platinum complex,
(cyclopentadienyl)dimethyl platinum complex,
(methylcyclopentadienyl)diethyl platinum complex,
(trimethylsilylcyclopentadienyl)diphenyl platinum complex,
(methylcycloocta-1,5-dienyl)diethyl platinum complex,
(cyclopentadienyl)trimethyl platinum complex,
(cyclopentadienyl)ethyldimethyl platinum complex,
(cyclopentadienyl)acetyldimethyl platinum complex,
(methylcyclopentadienyl)trimethyl platinum complex,
(methylcyclopentadienyl)trihexyl platinum complex,
(trimethylsilylcyclopentadienyl)trimethyl platinum complex,
(dimethylphenylsilylcyclopentadienyl)triphenyl platinum complex, and
(cyclopentadienyl)dimethyltrimethylsilylmethyl platinum complex, in an effective amount; and
(D) 100 to 20,000 parts by weight of a heat-conductive filler having a thermal conductivity of at least 10 W/m·° C.,
wherein the composition has a viscosity at 25° C. of 30 Pa·s to 800 Pa·s as measured by a Malcom viscometer at a rotational speed of 10 rpm.

2. The addition one part curing type heat-conductive silicone grease composition according to claim 1 , further comprising
(E) 5 to 900 parts by weight of an organopolysiloxane represented by the following general formula (1):

wherein R 1 groups are each independently an unsubstituted or substituted monovalent hydrocarbon group, R 2 groups are each independently an alkyl group, alkoxyalkyl group, alkenyl group, or acyl group, n is an integer of 2 to 100, and a is an integer of 1 to 3.

3. The addition one part curing type heat-conductive silicone grease composition according to claim 1 , further comprising
(F) 0.1 to 100 parts by weight of a fine silica powder.

4. The addition one part curing type heat-conductive silicone grease composition according to claim 3 , wherein the fine silica powder of the component (F) is surface-treated fumed silica.

5. The addition one part curing type heat-conductive silicone grease composition according to claim 1 , wherein the composition has shape retention properties such that when 0.5 mL of the composition is applied onto an aluminum plate under an environment of 25° C. in such a manner as to form a disk having a diameter of 1 cm and the disk is kept horizontal at 25° C. for 24 hours, the disk shows a diameter change within 1 mm, and the composition, after being heated and increased in viscosity, has a hardness of 1 to 90 as measure by an Asker C type rubber Durometer.

Assignees

• Shinetsu Chemical Co

Inventors

• Iwata Mitsuhiro

Classifications

• H10W40/251

  Organics · CPC title

• C08L2205/03

  containing three or more polymers in a blend · CPC title

• C08K2003/2227

  of aluminium · CPC title

• C08L2205/025

  containing two or more polymers of the same hierarchy C08L, and differing only in parameters such as density, comonomer content, molecular weight, structure · CPC title

• C08K5/56

  Organo-metallic compounds, i.e. organic compounds containing a metal-to-carbon bond · CPC title